Air Cooling for a Phased Array Radar
First Claim
1. A structure for electronic components, comprising:
- a baseplate having a substantially planar shape, the baseplate comprising a plurality of sub-sections, each sub-section removable from the baseplate, the baseplate defining one or more openings configured to allow air to flow through the openings;
a frame coupled to the baseplate, the frame comprising;
a planar support, the planar support having a substantially planar shape and substantially parallel to the baseplate, the planar support and baseplate at least partially defining one or more plenums, the planar support configured to support one or more transmit/receive integrated microwave modules,a plurality of frame supports, at least one of the frame supports defining one or more channels for air flow, each of the one or more channels corresponding to one of the one or more plenums;
a ventilated panel having a surface defining a plurality of air inlets, the air inlets configured to allow air into one of the one or more plenums; and
one or more thermal interfaces configured to dissipate heat;
a heat sink material in thermal communication with at least one thermal interface, the heat sink material located within one of the one or more plenums and configured to dissipate heat;
one or more electronic interfaces coupled to the planar support, each electronic interface configured to electronically couple to at least one of the one or more transmit/receive modules, at least one electronic interface having its own power supply, and at least a portion of each electronic interface coplanar with at least a portion of the one or more thermal interfaces;
one or more cooling fans, each cooling fan associated with the one or more openings and configured to expel air from the plenums; and
a radome coupled to the frame, the radome having a substantially planar shape and the radome substantially parallel to the baseplate.
1 Assignment
0 Petitions
Accused Products
Abstract
In certain embodiments, a structure for electronic components includes a baseplate having a substantially planar shape. The baseplate defines one or more openings allowing air flow. The structure includes a frame coupled to the baseplate. The frame includes a planar support with a substantially planar shape that is substantially parallel to the baseplate. Then planar support and baseplate at least partially defines one or more plenums. The planar support is also configured to support one or more transmit/receive integrated microwave modules. The frame also includes a plurality of frame supports that define one or more channels for air flow. Each channel corresponds to one of the plenums. Additionally, the frame includes a ventilated panel with a surface defining a plurality of air inlets. The air inlets allow air into one of the one or more plenums. Also, the frame includes one or more thermal interfaces configured to dissipate heat.
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Citations
20 Claims
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1. A structure for electronic components, comprising:
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a baseplate having a substantially planar shape, the baseplate comprising a plurality of sub-sections, each sub-section removable from the baseplate, the baseplate defining one or more openings configured to allow air to flow through the openings; a frame coupled to the baseplate, the frame comprising; a planar support, the planar support having a substantially planar shape and substantially parallel to the baseplate, the planar support and baseplate at least partially defining one or more plenums, the planar support configured to support one or more transmit/receive integrated microwave modules, a plurality of frame supports, at least one of the frame supports defining one or more channels for air flow, each of the one or more channels corresponding to one of the one or more plenums; a ventilated panel having a surface defining a plurality of air inlets, the air inlets configured to allow air into one of the one or more plenums; and one or more thermal interfaces configured to dissipate heat; a heat sink material in thermal communication with at least one thermal interface, the heat sink material located within one of the one or more plenums and configured to dissipate heat; one or more electronic interfaces coupled to the planar support, each electronic interface configured to electronically couple to at least one of the one or more transmit/receive modules, at least one electronic interface having its own power supply, and at least a portion of each electronic interface coplanar with at least a portion of the one or more thermal interfaces; one or more cooling fans, each cooling fan associated with the one or more openings and configured to expel air from the plenums; and a radome coupled to the frame, the radome having a substantially planar shape and the radome substantially parallel to the baseplate.
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2. A structure for electronic components, comprising:
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a baseplate having a substantially planar shape, the baseplate defining one or more openings configured to allow air to flow through the openings; a frame coupled to the baseplate, the frame comprising; a planar support, the planar support having a substantially planar shape and substantially parallel to the baseplate, the planar support and the baseplate at least partially defining one or more plenums, the planar support configured to support one or more transmit/receive integrated microwave modules; a plurality of frame supports, at least one of the frame supports defining one or more channels for air flow, each of the one or more channels corresponding to one of the one or more plenums; a ventilated panel having a surface defining a plurality of air inlets, the air inlets configured to allow air into one of the one or more plenums; and one or more thermal interfaces configured to dissipate heat; and one or more electronic interfaces coupled to the planar support, each electronic interface configured to electronically couple to one of the one or more transmit/receive integrated microwave modules, and at least a portion of each electronic interface coplanar with at least a portion of the one or more thermal interfaces. - View Dependent Claims (3, 4, 5, 6, 7, 8, 9, 10)
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11. A structure for electronic components, comprising:
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a baseplate having a substantially planar shape, the baseplate defining one or more openings configured to allow air to flow through the openings; and a frame coupled to the baseplate, the frame comprising; a planar support, the planar support having a substantially planar shape and substantially parallel to the baseplate, the planar support and the baseplate at least partially defining one or more plenums, the planar support configured to support one or more transmit/receive integrated microwave modules; a plurality of frame supports, at least one of the frame supports defining one or more channels for air flow, each of the one or more channels corresponding to one of the one or more plenums; a ventilated panel having a surface defining a plurality of air inlets, the air inlets configured to allow air into one of the one or more plenums; and one or more thermal interfaces configured to dissipate heat. - View Dependent Claims (12, 13, 14, 15)
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16. A structure for electronic components, comprising:
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a baseplate having a substantially planar shape, the baseplate defining one or more openings configured to allow air to flow through the openings, the baseplate comprising a plurality of sub-sections, each sub-section removable from the baseplate; a frame coupled to the baseplate, the frame comprising; a planar support, the planar support having a substantially planar shape and substantially parallel to the baseplate, the planar support and the baseplate at least partially defining one or more plenums, the planar support configured to support one or more transmit/receive integrated microwave modules; a ventilated panel having a surface defining a plurality of air inlets, the air inlets configured to allow air into one of the plenums; and one or more thermal interfaces configured to dissipate heat; and a heat sink material in thermal communication with at least one thermal interface, the heat sink material located within one of the one or more plenums and configured to dissipate heat. - View Dependent Claims (17, 18, 19, 20)
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Specification