HEATSINK MOUNTING SYSTEM

• US 20100157539A1
• Filed: 12/23/2008
• Published: 06/24/2010
• Est. Priority Date: 12/23/2008
• Status: Active Grant

• Current Assignee: Intricast Company, Inc.
• Original Assignee: Intricast Company, Inc.
• Inventors: Wang, Fang, Sin Yan Too, Thierry, Moore, Jim, Hu, Mong
• Granted Patent: US 7,848,107 B2
• Time in Patent Office: Days
• US Class Current: 361/709
• CPC Class Codes: H01L 23/4093 Snap-on arrangements, e.g. clips
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A heatsink system (10) is provided for containing and engaging a heatsink (16) against a heat generating component, typically an IC chip (18). The system (10) includes a rectangular integrally formed resilient frame (12) defining a cavity (26) in which the heatsink (16) is contained. The frame (12) includes a pair of opposed lateral sides (30) and a pair of opposing gripping sides (28) with L-shaped corner blocks (32) depending from the intersections thereof. The gripping sides (28) include centrally positioned grip handles (38) extending upward and grip blocks (34) depending therefrom, each grip block (34) having a grip tongue (36) at the lower extent thereof extending inward into the cavity (26). Inward pressure on the grip handles (38) forces the grip tongues (36) outward to release objects captured thereby.

Claims

1. A heatsink mounting system for holding a heatsink against a heat generating component, comprising:

a resilient rectangular frame member, including a pair of opposing gripping sides and a pair of opposing lateral sides, said lateral sides each including a receiving channel; and

a spring member having end tips for engaging said opposing receiving channels, said spring member engaging an upper surface of the heatsink to hold it in position against the heat generating component;

wherein applying pressure against said gripping sides forces said frame member to torsion such that jaws open to capture objects such as the heatsink or the heat generating component when said pressure is released and said jaws close.

2. The heatsink mounting system of claim 1, wherein

said gripping sides are provided with grip handles extending therefrom to provide pressure levers for applying said pressure.

3. The heatsink mounting system of claim 1, wherein

said gripping sides each include a grip block depending therefrom, each said grip block having a grip tongue projecting therefrom.

4. The heatsink mounting system of claim 2, wherein

said gripping sides each include a grip block depending therefrom, each said grip block having a grip tongue projecting therefrom.

5. The heatsink mounting system of claim 1, wherein

said spring member includes a bowed central expanse which arcs in the direction of the heatsink.

6. The heatsink mounting system of claim 1, wherein

spring pressure adjusting means are provided in said receiving channels to adjust the pressure on said spring end tips and consequently against said heatsink.

7. An assembly for mounting and securing a heatsink against a heat generating component, comprising:

a resilient frame defining a rectangular interior cavity, said frame including a pair of opposing gripping sides and opposing lateral sides, each said gripping side including a grip handle extending therefrom, a grip block depending therefrom, said grip block having a grip tongue extending into said cavity and each lateral side including at least one receiving channel; and

a spring member engagable at each end thereof with a corresponding one of said receiving channels for applying pressure to a heatsink contained within said cavity;

wherein

applying pressure toward said cavity on each said grip handle causes said frame to twist such that said grip blocks are forced apart from said cavity and said grip tongues are forced beyond the extent of said cavity.

8. The assembly of claim 7, wherein:

an L-shaped corner block is provided depending from each intersection of one of said gripping sides and one of said lateral sides, said corner blocks framing and positioning said heatsink within said central cavity.

9. The assembly of claim 7, wherein:

said heatsink is adapted to be placed against an IC chip including a rigid generally planar substrate; and

said grip tongues extend a short distance inward from said grip blocks, said distance being sufficient to capture said heat sink and said substrate.

10. The assembly of claim 7, wherein:

said spring member includes an end tip at each end for fitting into said corresponding receiving channel.

said vertical channels have a depth selected such that a desirable constant pressure is provided to said heatsink by said spring member.

11. The assembly of claim 10, wherein:

tension adjusting means are provided to provide pressure to each said end tip.

12. The assembly of claim 10, wherein:

adjusting screws are provided in said vertical channels for adjusting the pressure upon each said spring tip.

13. The assembly of claim 7, wherein:

said grip handles curve outwardly away from said center cavity.

14. A heatsink mounting system for releasably mounting a heatsink on an IC chip having a generally planar substrate, comprising

a clip member;

and

a spring member adapted to mate with said clip member;

wherein

said clip member is adapted to capture the IC chip by releasably gripping under opposing edges of said substrate and to simultaneously force said spring member against the heatsink to maintain contact pressure against the IC chip.

15. The heatsink mounting system of claim 14, wherein

said clip member is a resilient rectangular frame having a pair of opposing gripping sides and a pair of opposing lateral sides, each said lateral side including buttresses having receiving means for receiving end tips of said spring member.

16. The heatsink mounting system of claim 14, wherein

each of said gripping sides includes a depending grip block and each said grip block includes a grip tongue for engaging the underside of the substrate.

17. The heatsink mounting system of claim 16, wherein

each said gripping side includes a grip handle opposite said grip block, said grip handle being positioned such that inward pressure on said grip handle twists said gripping side outward such that said grip tongues are released from engagement with the substrate.