ELECTRONIC COMPONENT AND MANUFACTURING METHOD OF ELECTRONIC COMPONENT

• US 20100157565A1
• Filed: 11/18/2009
• Published: 06/24/2010
• Est. Priority Date: 12/22/2008
• Status: Active Grant

• Current Assignee: TDK Corporation
• Original Assignee: TDK Corporation
• Inventors: YOSHIDA, Makoto, KAMIYAMA, Hiroshi, NISHIKAWA, Tomonaga
• Granted Patent: US 8,174,349 B2
• Time in Patent Office: Days
• US Class Current: 361/811
• CPC Class Codes: H01F 27/027 specially adapted for combination of signal type inductors or transformers with electronic circuits, e.g. mounting on printed circuit boards
• CPC Class Codes: H01F 27/292 Surface mounted devices
• CPC Class Codes: H01F 41/046 structurally combined with ferromagnetic material
• CPC Class Codes: H01G 4/224 Housing; Encapsulation
• CPC Class Codes: H01G 4/33 Thin- or thick-film capacitors thin- or thick-film circuits H01L27/00; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor H01L28/40
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

A manufacturing method of electronic components includes forming a first insulation layer on a substrate, forming a plurality of passive elements on the first insulation layer, forming a second insulation layer on the passive elements, forming a plurality of conductor layers electrically connected to the respective passive elements, on the outer side of the second insulation layer to be exposed to an upper surface of each electronic component, and forming grooves between the electronic components including the respective passive elements to expose side surfaces of each electronic component and parts of the conductor layers from the side surfaces of each electronic component. The manufacturing method further including plating a plurality of external electrodes on the respective conductor layers exposed to the upper surface and the side surfaces of each electronic component, and cutting the substrate to completely separate into individual electronic components.

Claims

1. An electronic component comprising:

at least one passive element formed in said electronic component;

an insulation layer for covering said at least one passive element;

a plurality of conductor layers electrically connected to said at least one passive element and formed on the outer side of said insulation layer to extend to at least a part of an upper surface of said electronic component; and

a plurality of external electrodes, each having a L-shaped section, formed to coat said plurality of conductor layers at the part of the upper surface of said electronic component and formed on a part of at least one side surface of said electronic component.

2. The electronic component as claimed in claim 1, wherein each of said plurality of external electrodes has the L-shaped section only between the upper surface and a one side surface of said electronic component.

3. The electronic component as claimed in claim 1, wherein each of said plurality of external electrodes has the L-shaped section between the upper surface and each of two side surfaces of said electronic component and between the two side surfaces of said electronic component.

4. The electronic component as claimed in claim 1, wherein said plurality of conductor layers are extended to the part of the upper surface of said electronic component and to the part of the at least one side surface of said electronic component, and wherein said plurality of external electrodes are coated on said plurality of conductor layers at the part of the upper surface of said electronic component and on the part of the at least one side surface of said electronic component.

5. The electronic component as claimed in claim 1, wherein each of said plurality of external electrodes consists of a conductor film plated on each of said plurality of conductor layers.

6. The electronic component as claimed in claim 5, wherein each of said conductor films is composed of a multi-layered film including a gold film or of a tin film.

7. The electronic component as claimed in claim 1, wherein said plurality of conductor layers are extended only to the part of the upper surface of said electronic component, and wherein said plurality of external electrodes are electrically conducted to said plurality of conductor layers only at the part of the upper surface of said electronic component.

8. The electronic component as claimed in claim 1, wherein each of said plurality of external electrodes consists of a lower conductor film formed on each of said plurality of conductor layers at the part of the upper surface of said electronic component and formed on the part of the at least one side surface of said electronic component, and an upper conductor film plated on said lower conductor film.

9. The electronic component as claimed in claim 8, wherein said lower conductor film is composed of a multi-layered film including a cupper film.

10. The electronic component as claimed in claim 8, wherein said upper conductor film is composed of a multi-layered film including a gold film or of a tin film.

11. The electronic component as claimed in claim 1, wherein said at least one passive element comprises at least one of an inductor, a capacitor and a resister.

12. The electronic component as claimed in claim 11, wherein said electronic component comprises a common mode choke coil with said inductor, another insulation layer containing a magnetic material, and a magnetic substrate on which said inductor is mounted.

13. A manufacturing method of electronic components comprising the steps of:

forming a first insulation layer on a substrate;

forming a plurality of passive elements on said first insulation layer;

forming a second insulation layer on the passive elements;

forming a plurality of conductor layers electrically connected to the respective passive elements, on the outer side of said second insulation layer to be exposed to an upper surface of each electronic component;

forming grooves between the electronic components including the respective passive elements to expose side surfaces of each electronic component and parts of the conductor layers from said side surfaces of each electronic component;

plating a plurality of external electrodes on the respective conductor layers exposed to the upper surface and the side surfaces of each electronic component; and

cutting said substrate to completely separate into individual electronic components.

14. The manufacturing method as claimed in claim 13, wherein said step of plating a plurality of external electrodes comprises a step of forming the external electrodes by plating a multi-layered film including a gold film or of a tin film.

15. The manufacturing method as claimed in claim 13, wherein said step of forming a plurality of passive elements comprises a step of forming at least one of an inductor, a capacitor and a resister.

16. The manufacturing method as claimed in claim 15, wherein said electronic component comprises a common mode choke coil, wherein said substrate comprises a magnetic substrate, and wherein said manufacturing method further comprises a step of filling a magnetic-material contained layer between the conductive layers before said step of forming grooves.

17. A manufacturing method of electronic components comprising the steps of:

forming a first insulation layer on a substrate;

forming a plurality of passive elements on said first insulation layer;

forming a second insulation layer on the passive elements;

forming a plurality of conductor layers electrically connected to the respective passive elements, on the outer side of said second insulation layer to be exposed to an upper surface of each electronic component;

cutting said substrate to completely separate into individual electronic components so as to expose side surfaces of each electronic component and parts of the conductor layers from said side surfaces of each electronic component; and

plating a plurality of external electrodes on the respective conductor layers exposed to the upper surface and the side surfaces of each separated individual electronic component.

18. The manufacturing method as claimed in claim 17, wherein said manufacturing method further comprises a step of chamfering each electronic component after the separation into the individual electronic components.

19. A manufacturing method of electronic components comprising the steps of:

forming a first insulation layer on a substrate;

forming a plurality of passive elements on said first insulation layer;

forming a second insulation layer on the passive elements;

forming a plurality of conductor layers electrically connected to the respective passive elements, on the outer side of said second insulation layer to be exposed to an upper surface of each electronic component;

forming a third insulation layer on the outer side of the conductor layers;

forming shallow grooves to expose side surfaces of each electronic component including the passive element and parts of the third insulation layer from said side surfaces of each electronic component;

sputtering a lower conductor film for external electrodes on the conductor layers exposed to the upper surface of each electronic component and on the parts of the third insulation layer exposed to the side surfaces of each electronic component;

plating an upper conductor film for external electrodes on said lower conductor film for external electrodes; and

cutting said substrate to completely separate into individual electronic components.

20. A manufacturing method of electronic components comprising the steps of:

forming a first insulation layer on a substrate;

forming a plurality of passive elements on said first insulation layer;

forming a second insulation layer on the passive elements;

forming a plurality of conductor layers electrically connected to the respective passive elements, on the outer side of said second insulation layer to be exposed to an upper surface of each electronic component;

forming a third insulation layer on the outer side of the conductor layers;

forming shallow grooves to expose side surfaces of each electronic component including the passive element and parts of the third insulation layer from said side surfaces of each electronic component;

sputtering a lower conductor film for external electrodes on the conductor layers exposed to the upper surface of each electronic component and on the parts of the third insulation layer exposed to the side surfaces of each electronic component;

cutting said substrate to completely separate into individual electronic components; and

plating an upper conductor film for external electrodes on said lower conductor film for external electrodes of each separated individual electronic component.