Method and Apparatus for Forming a Thermal Interface for an Electronic Assembly
First Claim
1. A method for manufacturing a thermal interface for an electronic assembly, comprising the steps of:
- providing a thermally conductive polymer having an adhesive layer formed thereon;
pressing a surface of the electronic assembly against the adhesive layer; and
allowing the adhesive layer to cure so that the thermally conductive polymer and the electronic assembly are in thermal communication with each other.
4 Assignments
0 Petitions
Accused Products
Abstract
A method and apparatus are provided for forming a thermal interface for an electronic product. A thermally conductive polymer having an adhesive layer formed thereon is provided, a surface of an electronic assembly is pressed against the adhesive layer, and the adhesive layer is allowed to cure so that the thermally conductive polymer and the electronic assembly are in thermal communication with each other. The electronic assembly could be pressed against the thermally conductive polymer using a press and die assembly having a pad for supporting the polymer and a controller for controlling operation of the press. The thermally conductive polymer is bonded to the electronic assembly so that no air pockets or voids are formed therebetween.
-
Citations
36 Claims
-
1. A method for manufacturing a thermal interface for an electronic assembly, comprising the steps of:
-
providing a thermally conductive polymer having an adhesive layer formed thereon; pressing a surface of the electronic assembly against the adhesive layer; and allowing the adhesive layer to cure so that the thermally conductive polymer and the electronic assembly are in thermal communication with each other. - View Dependent Claims (2, 3, 4, 5, 6)
-
-
7. A method for manufacturing a thermal interface for an electronic assembly, comprising the steps of:
-
providing a thermally conductive polymer having an adhesive layer formed thereon; pressing the adhesive layer and the thermally conductive polymer against a surface of the electronic assembly; and allowing the adhesive layer to cure so that the thermally conductive polymer and the electronic assembly are in thermal communication with each other. - View Dependent Claims (8, 9, 10, 11, 12)
-
-
13. An apparatus for forming a thermal interface for an electronic assembly, comprising:
-
a pad for supporting a thermally conductive polymer, the thermally conductive polymer having an adhesive layer formed thereon; a press for pressing a surface of an electronic assembly against the adhesive layer of the thermally conductive polymer; and a controller for controlling operation of the press, the controller causing the press to maintain pressure against the electronic assembly and the thermally conductive polymer until the adhesive layer cures and the thermally conductive polymer is in thermal communication with the electronic assembly. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21, 22)
-
-
23. An apparatus for forming a thermal interface for an electronic assembly, comprising:
-
a pad having a plurality of upright support pins for supporting an electronic assembly; a press for pressing an adhesive layer and a thermally conductive polymer against a surface of the electronic assembly; and a controller for controlling operation of the press, the controller causing the press to maintain pressure against the thermally conductive polymer and the adhesive layer until the adhesive layer cures and the thermally conductive polymer is in thermal communication with the electronic assembly. - View Dependent Claims (24, 25, 26, 27, 28, 29, 30, 31, 32)
-
-
33. An electronic apparatus, comprising:
-
a printed circuit board having a plurality of electronic components mounted thereto; and a thermally conductive polymer mounted to a surface of the printed circuit board for drawing heat through the printed circuit board and away from the plurality of electronic components. - View Dependent Claims (34, 35, 36)
-
Specification