Camera Module

• US 20100158508A1
• Filed: 08/08/2007
• Published: 06/24/2010
• Est. Priority Date: 08/22/2006
• Status: Active Grant

• Current Assignee: LG Innotek Company Limited (LG Corporation)
• Original Assignee: LG Innotek Company Limited (LG Corporation)
• Inventors: Kim, Min Soo
• Granted Patent: US 7,997,812 B2
• Time in Patent Office: Days
• US Class Current: 396/529
• CPC Class Codes: H04N 23/54 Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 23/57 Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Abstract

A camera module is provided with a lens part including a lens and a lens barrel, a holder coupled with the lens part and formed with a first conductive layer, and a printed circuit board electrically connected to the first conductive layer while supporting the holder.

Claims

1. A camera module comprising:

a lens part comprising a lens and a lens barrel;

a holder coupled with the lens part and formed with a first conductive layer; and

a printed circuit board electrically connected to the first conductive layer while supporting the holder.

2. The camera module according to claim 1, comprising a grounding area electrically connected the first conductive layer and formed on the printed circuit board.

3. The camera module according to claim 2, wherein the grounding area is not formed with solder resist.

4. The camera module according to claim 2, wherein the grounding area is formed at area positioned a bottom surface of the holder.

5. The camera module according to claim 1, comprising a boss pin formed at a lower portion of the holder, wherein the boss pin is coupled with the printed circuit board.

6. The camera module according to claim 5, comprising a second conductive layer formed on a surface of the boss pin.

7. A camera module comprising:

a sensor part comprising a lens part comprising a lens and a lens barrel, a holder coupled with the lens part, a first printed circuit board disposed with an image sensor while supporting the holder, and a first conductive layer formed on the first printed circuit board;

a second printed circuit board connected to the sensor part; and

a connector connected to the second printed circuit board.

8. The camera module according to claim 7, wherein the second printed circuit board is a flexible printed circuit board and comprises a second conducive layer, and the connector comprises a third conductive layer.

9. The camera module according to claim 8, wherein a grounding area is formed at least one of the first printed circuit board, the second printed circuit board and the connector.

10. The camera module according to claim 8, wherein at least one of the conductive layers is electrically grounded.

11. A camera module comprising:

a lens part comprising a lens, a lens barrel, and an actuator;

a holder coupled with the lens part, in which a first conductive layer is formed on a surface of the holder; and

a printed circuit board electrically connected to the first conductive layer while supporting the holder.

12. The camera module according to claim 11, comprising a second conductive layer formed on the lens part.

13. The camera module according to claim 11, comprising a boss pin formed at a lower portion of the holder, wherein the boss pin is coupled with the printed circuit board.

14. The camera module according to claim 13, comprising a third conductive layer formed on a surface of the boss pin.

15. The camera module according to claim 11, comprising a grounding area electrically connected to the first conductive layer, and formed on the printed circuit board.

16. The camera module according to claim 15, wherein the grounding area is not formed with solder resist.

17. The camera module according to claim 11, comprising a cap formed at an outer portion of both the lens part and the holder.

18. The camera module according to claim 11, comprising a fourth conductive layer formed at a lower portion of the printed circuit board.

19. The camera module according to claim 17, comprising a socket disposed at a lower portion of the printed circuit board, and coupled with the cap to support the cap.

20. The camera module according to claim 17, wherein a groove is formed in at least a portion of the holder, and a protrusion is formed in at least a portion of the cap corresponding to the groove.