MOISTURE RESISTANT POLYIMIDE COMPOSITIONS

• US 20100159224A1
• Filed: 12/19/2008
• Published: 06/24/2010
• Est. Priority Date: 12/19/2008
• Status: Active Grant

• Current Assignee: SHPP Global Technologies BV (Government of Saudi Arabia)
• Original Assignee: Sabic Innovative Plastics IP BV (Government of Saudi Arabia)
• Inventors: Haralur, Gurulingamurthy M., Donovan, Michael Stephen
• Granted Patent: US 8,912,272 B2
• Time in Patent Office: Days
• US Class Current: 428/220
• CPC Class Codes: C08G 2650/40 containing ketone groups, e.g. polyarylethylketones, PEEK or PEK
• CPC Class Codes: C08G 79/00 Macromolecular compounds obtained by reactions forming a linkage containing atoms other than silicon, sulfur, nitrogen, oxygen, and carbon with or without the latter elements in the main chain of the macromolecule
• CPC Class Codes: C08J 2379/08 Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
• CPC Class Codes: C08J 5/2256 based on macromolecular compounds obtained by reactions other than those involving carbon-to-carbon bonds, e.g. obtained by polycondensation
• CPC Class Codes: C08L 2666/20 Macromolecular compounds having nitrogen in the main chain according to C08L75/00 - C08L79/00; Derivatives thereof
• CPC Class Codes: C08L 71/00 Compositions of polyethers obtained by reactions forming an ether link in the main chain of polyacetals C08L59/00; of epoxy resins C08L63/00; of polythioether-ethers C08L81/02; of polyether-sulfones C08L81/06; Compositions of derivatives of such polymers
• CPC Class Codes: C08L 71/10 from phenols
• CPC Class Codes: C08L 79/04 Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
• CPC Class Codes: F21V 7/0066 specially adapted to cooperate with point like light sources; specially adapted to cooperate with light sources the shape of which is unspecified F21V7/16 - F21V7/30 take precedence
• CPC Class Codes: F21V 7/28 characterised by coatings
• CPC Class Codes: G02B 1/10 Optical coatings produced by application to, or surface treatment of, optical elements G02B1/08 takes precedence
• CPC Class Codes: G02B 27/0006 with means to keep optical surfaces clean, e.g. by preventing or removing dirt, stains, contamination, condensation G02B1/18 takes precedence; cleaning in general B08B
• CPC Class Codes: Y10T 428/266 of base or substrate
• CPC Class Codes: Y10T 428/31681 Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]

Abstract

The invention relates to a moisture resistant composition comprising: a) from 20 to 80 weight percent based on the total weight of the composition of a polyetherimide copolymer made from a monomer mixture comprising 3,3′ bisphenol-A dianhydride (BPADA), and 4,4′-diaminodiphenyl sulfone (DDS); b) from 5 to 75 weight percent based on the total weight of the composition of polyetheretherketone (PEEK); and c) from 0 to 30 weight percent based on the total weight of the composition of a filler. The invention relates to a reflector substrate comprising a moisture resistant layer metalized with a reflective layer, wherein the moisture resistant layer comprising the moisture resistant composition. The invention relates to a method for producing a metalized coating without a primer comprising applying a reflective layer directly to a moisture resistant layer in the absence of a primer, wherein the moisture resistant layer comprises the moisture resistant composition.

Claims

1. A moisture resistant composition comprising:

a) from 20 to 80 weight percent based on the total weight of the composition of a polyetherimide copolymer made from a monomer mixture comprising 3,3′

bisphenol-A dianhydride (BPADA), and 4,4′

-diaminodiphenyl sulfone (DDS);

b) from 5 to 75 weight percent based on the total weight of the composition of polyetheretherketone (PEEK); and

c) from 0 to 30 weight percent based on the total weight of the composition of a filler.

2. The moisture resistant composition of claim 1, wherein the monomer mixture further comprises 3-chloroanhydride.

3. The moisture resistant composition of claim 1 comprising:

about 80 weight percent based on the total weight of the composition of component a), about 20 weight percent based on the total weight of the composition of component b), and about 0 weight percent based on the total weight of the composition of component c).

4. The moisture resistant composition of claim 1 comprising:

about 70 weight percent based on the total weight of the composition of component a), about 30 weight percent based on the total weight of the composition of component b), and about 0 weight percent based on the total weight of the composition of component c).

5. The moisture resistant composition of claim 1 comprising:

about 75 weight percent based on the total weight of the composition of component a), about 15 weight percent based on the total weight of the composition of component b), and about 10 weight percent based on the total weight of the composition of component c).

6. The moisture resistant composition of claim 1 comprising:

about 65 weight percent based on the total weight of the composition of component a), about 15 weight percent based on the total weight of the composition of component b), and about 20 weight percent based on the total weight of the composition of component c).

7. The moisture resistant composition of claim 1 comprising:

about 25 weight percent based on the total weight of the composition of component a), about 66 weight percent based on, the total weight of the composition of component b), and about 9 weight percent based on the total weight of the composition of component c).

8. The moisture resistant composition of claim 1, wherein a molded part comprising the moisture resistant composition of claim 1, and having a thickness of from 1 to 3 mm does not exhibit popcorning in a dry atmosphere at 260°

C.

9. The moisture resistant composition of claim 1, wherein a molded part comprising the moisture resistant composition of claim 1, and having a thickness of from 1 to 3 mm does not exhibit popcorning at 60°

C./60% relative humidity at 260°

C.

10. The moisture resistant composition of claim 1, wherein a molded part comprising the moisture resistant composition of claim 1, and having a thickness of from 1 to 3 mm does not exhibit popcorning at 80°

C./85% relative humidity at 260°

C.

11. The moisture resistant composition of claim 1, wherein a molded part comprising the moisture resistant composition of claim 1, and having a thickness of from 1 to 3 mm exhibits a warpage of less than or equal to 0.5 mm in a dry atmosphere at 260°

C.

12. The moisture resistant composition of claim 1, wherein a molded part comprising the moisture resistant composition of claim 1, and having a thickness of from 1 to 3 mm exhibits a warpage of less than or equal to 0.5 mm at 30°

C./60% relative humidity at 260°

C.

13. The moisture resistant composition of claim 1, wherein a molded part comprising the moisture resistant composition of claim 1, and having a thickness of from 1 to 3 mm exhibits a warpage of less than or equal to 0.5 mm at 60°

C./60% relative humidity at 260°

C.

14. The moisture resistant composition of claim 1, wherein a molded part comprising the moisture resistant composition of claim 1, and having a thickness of from 1 to 3 mm exhibits a warpage of less than or equal to 0.5 mm at 80°

C./85% relative humidity at 260°

C.

15. A reflector substrate comprising a moisture resistant layer metalized with a reflective layer, wherein the moisture resistant layer comprises:

a) from 20 to 80 weight percent based on the total weight of the composition of a polyetherimide copolymer made from a monomer mixture comprising 3,3′

bisphenol-A dianhydride (BPADA), and 4,4′

-diaminodiphenyl sulfone (DDS);

b) from 5 to 75 weight percent based on the total weight of the composition of polyetheretherketone (PEEK); and

c) from 0 to 30 weight percent based on the total weight of the composition of a filler;

wherein a molded part comprising the moisture resistant composition of the composition and having a thickness of from 1 to 3 mm does not exhibit popcorning in a dry atmosphere at 260°

C.

16. The reflector substrate according to claim 15, wherein the reflective layer is selected from the group consisting of silver, aluminum, and combinations thereof.

17. The reflector substrate of claim 15, wherein the substrate is a substrate of a light emitting diode.

18. The reflector substrate of claim 15, wherein the substrate is a part and a component in surface mount technologies and soldering processes with lead free solders

19. The reflector substrate of claim 15, wherein the reflector substrate does not contain a primer.

21. The method of claim 17, further comprising drying the moisture resistant layer prior to applying the reflective layer.

22. The method of claim 17, wherein the reflective layer is applied by electroplating.

23. The method of claim 17, wherein the reflective layer is applied by vapor deposition.

20. A method for producing a metalized coating without a primer comprising applying a reflective layer directly to a moisture resistant layer in the absence of a primer, wherein the moisture resistant layer comprises:

a) from 20 to 80 weight percent based on the total weight of the composition of a polyetherimide copolymer made from a monomer mixture comprising 3,3′

bisphenol-A dianhydride (BPADA), and 4,4′

-diaminodiphenyl sulfone (DDS);

b) from 5 to 75 weight percent based on the total weight of the composition of polyetheretherketone (PEEK); and

c) from 0 to 30 weight percent based on the total weight of the composition of a filler.