GAMING APPARATUS WITH COOLING OF CERTAIN COMPONENTS

• US 20100160018A1
• Filed: 11/08/2007
• Published: 06/24/2010
• Est. Priority Date: 11/09/2006
• Status: Active Grant

• Current Assignee: Sg Gaming, Inc. (Scientific Games Corporation)
• Original Assignee: WMS Gaming Incorporated (Scientific Games Corporation)
• Inventors: Landsman, Andrew
• Granted Patent: US 8,303,419 B2
• Time in Patent Office: Days
• US Class Current: 463/16
• CPC Class Codes: G06F 1/206 comprising thermal management
• CPC Class Codes: G07F 17/32 for games, toys, sports, or amusements
• CPC Class Codes: G07F 17/3202 Hardware aspects of a gaming system, e.g. components, construction, architecture thereof
• CPC Class Codes: H01L 23/38 Cooling arrangements using the Peltier effect
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A system includes a gaming machine, one or more heat generating components within the gaming machine, and a thermoelectric cooler apparatus located within the gaming machine to draw heat from the one or more heat generating components.

Claims

1. A system comprising:

a gaming machine;

one or more heat generating components within the gaming machine; and

a thermoelectric cooler apparatus located within the gaming machine to draw heat from the one or more heat generating components.

2. The system of claim 1, wherein the one or more heat generating components includes a CPU.

3. The system of claim 1, wherein the one or more heat generating components includes a hard drive.

4. The system of claim 1, including an enclosure located within the gaming machine and housing one or more of the one or more heat generating components, wherein the thermoelectric cooler apparatus is mounted within the enclosure.

5. The system of claim 1, including an enclosure located within the gaming machine and housing one or more of the one or more heat generating components, wherein the thermoelectric heater is mounted to the enclosure.

6. The system of claim 1, wherein the thermoelectric cooler apparatus is mounted to an outer housing wall of the gaming machine and configured to direct heat out of the gaming machine.

7. The system of claim 1, wherein the thermoelectric cooler apparatus includes a thermoelectric cooler device, at least one heat sink mounted to the thermoelectric cooler device, and at least one fan directing air over the at least one heat sink.

8. The system of claim 1, wherein the thermoelectric cooler apparatus includes a thermoelectric cooler device sandwiched between a first heat sink and a second heat sink.

9. The system of claim 8, wherein the thermoelectric cooler apparatus is mounted within a cooling enclosure, and at least one fan is mounted to the cooling enclosure.

10. The system of claim 9, wherein the cooling enclosure is mounted to a housing of the gaming machine and the at least one fan directs air out of the housing of the gaming machine.

11. The system of claim 1, wherein the thermoelectric cooler apparatus is mounted directly on at least one of the one or more heat generating components.

12. A system comprising:

a gaming machine including a housing;

one or more heat generating components within the gaming machine; and

a thermoelectric cooler apparatus located within the gaming machine, the thermoelectric cooler apparatus including a thermoelectric cooler device, a first heat sink mounted to the thermoelectric cooler device, and at least one fan, wherein the thermoelectric cooler apparatus is located so as to draw heat from the one or more heat generating components.

13. The system of claim 12, wherein the one or more heat generating components includes a CPU.

14. The system of claim 12, wherein the one or more heat generating components includes a hard drive.

15. The system of claim 12, including an enclosure located within the gaming machine and housing one or more of the one or more heat generating components, wherein the thermoelectric heater is mounted proximate to or within the enclosure.

16. The system of claim 12, wherein the housing includes one or more openings and the thermoelectric cooler apparatus is mounted adjacent to the one or more openings.

17. The system of claim 12, wherein the thermoelectric cooler device is sandwiched between the first heat sink and a second heat sink.

18. The system of claim 12, wherein the thermoelectric cooler apparatus is mounted within a cooling enclosure, and the at least one fan is mounted to the cooling enclosure.

19. A method comprising:

mounting a thermoelectric cooler apparatus within a gaming machine housing, the gaming machine including one or more heat generating components; and

drawing heat away from the one or more heat generating components via the thermoelectric cooler apparatus.

20. The method of claim 19, wherein the thermoelectric cooler apparatus includes a thermoelectric cooler device, at least one heat sink mounted to the thermoelectric cooler device, and at least one fan directing air over the at least one heat sink.

21. The method of claim 19, wherein the one or more heat generating components includes a CPU.

22. The method of claim 19, wherein the one or more heat generating components includes a hard drive.

23. The method of claim 19, wherein the thermoelectric cooler apparatus is mounted to the housing of the gaming machine and configured to direct heat out of the gaming machine.

24. The method of claim 19, wherein the thermoelectric cooler apparatus is mounted directly on or adjacent to at least one of the one or more heat generating components.