Substrate Processing Apparatus and Substrate Mount Table Used in the Apparatus

• US 20100162956A1
• Filed: 08/04/2006
• Published: 07/01/2010
• Est. Priority Date: 08/05/2005
• Status: Abandoned Application

• Current Assignee: Tokyo Electron Limited
• Original Assignee: Tokyo Electron Limited
• Inventors: Murakami, Seishi, Ogose, Kei
• Application Number:
  US11/989,936
• Publication Number:
  US 20100162956A1
• Time in Patent Office: Days
• US Class Current: 118/725
• CPC Class Codes: C23C 16/4586 Elements in the interior of the support, e.g. electrodes, heating or cooling devices
• CPC Class Codes: H01J 2237/2001 Maintaining constant desired temperature
• CPC Class Codes: H01L 21/67109 mainly by convection
• CPC Class Codes: H01L 21/68735 characterised by edge profile or support profile
• CPC Class Codes: H01L 21/68742 characterised by a lifting arrangement, e.g. lift pins

Abstract

Disclosed is a susceptor which achieves uniform temperature distribution of a wafer placed on the susceptor, and also disclosed is a substrate processing apparatus provided with the susceptor. An annular recess 12a is formed in an intermediate portion between the central portion and the peripheral portion of a wafer support surface of the susceptor 12. Due to the provision of the recess, the substrate heating effect by thermal radiation from the susceptor is suppressed in the intermediate portion. The geometrical dimension of the recess is determined taking the chamber internal pressure into consideration.

Claims

1. A substrate processing apparatus that performs a heat treatment to a substrate, or performs a treatment while heating a substrate, said apparatus comprising:

a chamber;

an evacuating means that decreases pressure in the chamber;

a substrate mount table that supports the substrate in the chamber; and

a heater embedded in the substrate mount table to heat the substrate mount table thereby to heat the substrate supported on the substrate mount table,

wherein the substrate mount table has a first support surface formed in a center portion of the substrate mount table to support the substrate, a second support surface formed in a peripheral portion of the substrate mount table to support the substrate, and a recess formed between the first support surface and the second support surface, so that a gap is formed between the substrate placed on the substrate mount table and a bottom surface of the recess.

2. The substrate processing apparatus according to claim 1, wherein a size of the gap varies with location.

3. The substrate processing apparatus according to claim 2, wherein the bottom surface of the recess has a step.

4. The substrate processing apparatus according to claim 3, wherein the bottom surface of the recess has a plurality of annular areas which are arranged concentrically, and adjacent annular areas have different heights.

5. The substrate processing apparatus according to claim 1, wherein the substrate mount table is supported by a support member connected to a center portion of the substrate mount table.

6. The substrate processing apparatus according to claim 5, wherein a region where the first support surface is provided substantially corresponds to a region where the support member is provided.

9. The substrate processing apparatus according to claim 1, wherein the heating means heater includes a first heater element disposed in a center portion of the substrate mount table and a second heater element disposed to surround the first heater element.

19. The substrate processing apparatus according to claim 1, wherein the substrate mount table is made of a ceramic material.

7. (canceled)

8. (canceled)

10. A substrate mount table for supporting a substrate wherein:

a heater is embedded in said substrate mount table to heat said substrate mount table thereby to heat a substrate supported on said substrate mount table; and

said substrate mount table has a first support surface formed in a center portion of the substrate mount table to support the substrate, a second support surface formed in a peripheral portion of the substrate mount table to support the substrate, and a recess formed between the first support surface and the second support surface, so that a gap is formed between the substrate placed on the substrate mount table and a bottom surface of the recess.

11. The substrate mount table according to claim 10, wherein a size of the gap varies with location.

12. The substrate mount table according to claim 11, wherein the bottom surface of the recess has a step.

13. The substrate mount table according to claim 12, wherein the bottom surface of the recess has a plurality of annular areas which are arranged concentrically, and adjacent annular areas have different heights.

14. The substrate mount table according to claim 10, wherein the substrate mount table is supported by a support member connected to a center portion of the substrate support table.

15. The substrate mount table according to claim 14, wherein a region where the first support surface is provided substantially corresponds to a region where the support member is provided.

18. The substrate mount table according to claim 10, wherein the heater includes a first heater element disposed in a center portion of the substrate mount table and a second heater element disposed to surround the first heater element.

20. The substrate mount table according to claim 11, wherein said substrate mount table is made of a ceramic material.

16. (canceled)

17. (canceled)