QUANTUM WELL MOSFET CHANNELS HAVING UNI-AXIAL STRAIN CAUSED BY METAL SOURCE/DRAINS, AND CONFORMAL REGROWTH SOURCE/DRAINS
First Claim
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1. A method comprising:
- removing a first portion of a top barrier layer and of a channel layer of a quantum well in a substrate to form a first junction region and a different second portion of the top barrier layer and a channel layer to form a second junction region in the substrate; and
forming a thickness of a junction material in the first junction region and in the second junction region;
wherein the junction material has a lattice spacing different than a lattice spacing of a channel material of the channel layer and causes a uni-axial strain in a third portion of the channel layer between the first and second junction regions.
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Abstract
Embodiments described include straining transistor quantum well (QW) channel regions with metal source/drains, and conformal regrowth source/drains to impart a uni-axial strain in a MOS channel region. Removed portions of a channel layer may be filled with a junction material having a lattice spacing different than that of the channel material to causes a uni-axial strain in the channel, in addition to a bi-axial strain caused in the channel layer by a top barrier layer and a bottom buffer layer of the quantum well.
43 Citations
23 Claims
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1. A method comprising:
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removing a first portion of a top barrier layer and of a channel layer of a quantum well in a substrate to form a first junction region and a different second portion of the top barrier layer and a channel layer to form a second junction region in the substrate; and forming a thickness of a junction material in the first junction region and in the second junction region; wherein the junction material has a lattice spacing different than a lattice spacing of a channel material of the channel layer and causes a uni-axial strain in a third portion of the channel layer between the first and second junction regions. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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18. A transistor comprising:
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a quantum well in a substrate, the quantum well comprising a channel layer between a top barrier layer and a bottom buffer layer, wherein the top barrier layer and the bottom buffer layer each comprise a material having a lattice spacing different than a lattice spacing of a channel material of the channel layer and each causing a bi-axial strain in the channel layer; a first junction region adjacent to the quantum well, the first junction region through the channel layer, and to the bottom buffer layer; a different second junction region adjacent to the quantum well, the second junction region through the channel layer, and to the bottom buffer layer; a junction material in the first junction region and in the second junction region having a lattice spacing different than a lattice spacing of the channel material, and causing a uni-axial strain in the channel layer, in addition to the bi-axial strain. - View Dependent Claims (19, 20, 21, 22)
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23. An apparatus comprising:
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a transistor quantum well in a substrate, the quantum well comprising a channel layer between a top barrier layer and a bottom buffer layer, wherein the top barrier layer and the bottom buffer layer each comprise a material having a lattice spacing smaller than a lattice spacing of a channel material of the channel layer to each cause a bi-axial compressive strain in the channel layer; a first junction region adjacent to a portion of the quantum well, the first junction region extending through the top barrier layer, through the channel layer, and to the bottom buffer layer; a different second junction region adjacent to the portion of the quantum well, the second junction region extending through the top barrier layer, through the channel layer, and to the bottom buffer layer; a junction material in the first junction region and in the second junction region, the junction material having a lattice spacing greater than a lattice spacing of the channel material to cause a uni-axial compressive strain in the channel layer, in addition to the bi-axial compressive strain.
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Specification