LIGHT EMITTING DIODE

• US 20100163891A1
• Filed: 05/13/2009
• Published: 07/01/2010
• Est. Priority Date: 12/26/2008
• Status: Active Grant

• Current Assignee: Foxconn Technology Co., Ltd., Fuzhun Precision Industry Company Limited (Foxconn Technology Co., Ltd.)
• Original Assignee: Foxconn Technology Co., Ltd., Fuzhun Precision Industry Company Limited (Foxconn Technology Co., Ltd.)
• Inventors: RUAN, QING-HAI, KU, CHIN-LONG
• Granted Patent: US 8,247,825 B2
• Time in Patent Office: Days
• US Class Current: 257/88
• CPC Class Codes: F21S 10/02 changing colors F21S10/002 - F21S10/007, F21S10/04 take precedence
• CPC Class Codes: F21S 41/37 characterised by their material, surface treatment or coatings
• CPC Class Codes: F21V 1/17 the material comprising photoluminescent substances
• CPC Class Codes: F21V 13/14 the elements being filters or photoluminescent elements, reflectors and refractors
• CPC Class Codes: F21V 23/0442 activated by means of a sensor, e.g. motion or photodetectors
• CPC Class Codes: F21V 3/08 the material comprising photoluminescent substances
• CPC Class Codes: F21V 3/12 the coatings comprising photoluminescent substances
• CPC Class Codes: F21V 5/10 comprising photoluminescent material
• CPC Class Codes: F21V 7/0008 providing for indirect lighting
• CPC Class Codes: F21V 7/26 the material comprising photoluminescent substances
• CPC Class Codes: F21V 7/30 the coatings comprising photoluminescent substances
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/451 with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
• CPC Class Codes: H01L 2224/48092 Helix
• CPC Class Codes: H01L 2224/49107 on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/49 : of a plurality of wire connectors
• CPC Class Codes: H01L 25/0753 : the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H01L 33/50 : Wavelength conversion elements
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H05B 45/18 : using temperature feedback
• CPC Class Codes: H05B 45/3725 : Switched mode power supply [SMPS]

Abstract

An LED includes a substrate, two LED dies mounted on the substrate, an encapsulant molded on the substrate and sealing the two LED dies, and two phosphors contained within the encapsulant and surrounding the two LED dies, respectively. The two phosphors are distributed on the two LED dies in same density and different thicknesses, whereby the mixed light from one LED die and one phosphor has a color temperature different from that mixed from another LED die and another phosphor.

Claims

1. An LED comprising:

two LED dies;

an encapsulant sealing the two LED dies; and

two phosphors received in the encapsulant and corresponding to the two LED dies, respectively;

wherein one of the two phosphors has an amount of particulates different from that of another one of the two phosphors.

2. The LED as claimed in claim 1, wherein the two phosphors have same densities and different thicknesses.

3. The LED as claimed in claim 1, wherein the two phosphors have different densities and same thicknesses.

4. The LED as claimed in claim 1 further comprising two additional encapsulants, wherein the two LED dies are respectively sealed by the two additional encapsulants and further by the encapsulant.

10. The LED as claimed in claim 1 further comprising a substrate supporting the two LED dies and two spiral wires electrically connecting each LED die to the substrate.

5. The LED as claimed in claim 5, wherein the two phosphors are respectively doped within the two additional encapsulants uniformly.

6. The LED as claimed in claim 5, wherein the two phosphors are respectively applied on outer surfaces of the two additional encapsulants.

7. The LED as claimed in claim 5, wherein the two additional encapsulants have different sizes.

8. The LED as claimed in claim 5, wherein the two additional encapsulants are made of a transparent material different from that of the encapsulant.

9. The LED as claimed in claim 8, wherein the two additional encapsulants have a refractive index larger than that of the encapsulant.

11. An LED comprising:

a first LED die and a second LED die;

a first encapsulant enveloping the first and second LED dies therein; and

a first phosphor and a second phosphor contained in the first encapsulant;

wherein the first phosphor absorbs light emitted from the first LED die more than that absorbed by the second phosphor from the second LED die, and the first phosphor is excited to emanate light more than that emanated by the second phosphor.

12. The LED as claimed in claim 11, wherein the first phosphor has an amount of particulates larger than that of the second phosphor.

13. The LED as claimed in claim 11 further comprising two second encapsulants, wherein the first LED die and the second LED die are sealed within the two second encapsulants and further within the first encapsulant.

14. The LED as claimed in claim 13, wherein the light emitted from the first and second LED dies are absorbed in the two second encapsulants.

15. The LED as claimed in claim 13, wherein the light emitted from the first and second LED dies are absorbed near outer surfaces of the two second encapsulants.

16. The LED as claimed in claim 13, wherein the two second encapsulants have different sizes and are cured prior to the first encapsulant.

17. The LED as claimed in claim 13, wherein the two second encapsulants are made from a transparent material different from that of the first encapsulant.