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CHIP CARRIER BEARING LARGE SILICON FOR HIGH PERFORMANCE COMPUTING AND RELATED METHOD

  • US 20100164030A1
  • Filed: 12/31/2008
  • Published: 07/01/2010
  • Est. Priority Date: 12/31/2008
  • Status: Abandoned Application
First Claim
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1. An integrated circuit (IC) chip package comprising:

  • an IC chip; and

    a substrate coupled to the IC chip, the substrate comprising;

    a glass fiber re-enforced epoxy core, a plurality copper circuitry containing particle re-enforced epoxy layers symmetrically-oriented to each surface of the glass fiber re-enforced epoxy core, and an outermost amorphous glass layer on each surface of the plurality of layers,wherein the IC chip is coupled to copper circuitry bonded to one of the outermost amorphous glass layers.

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