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SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

  • US 20100164086A1
  • Filed: 08/02/2007
  • Published: 07/01/2010
  • Est. Priority Date: 08/11/2006
  • Status: Active Grant
First Claim
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1. A semiconductor device comprising:

  • a semiconductor substrate comprising an electronic component formed on a top surface of the semiconductor substrate;

    a supporting member having a bottom surface and a top surface and bonded to the semiconductor substrate;

    an adhesive layer attaching the bottom surface of the supporting member to the top surface of the semiconductor substrate; and

    an electrode disposed on the bottom surface of the supporting member and electrically connected with the electronic component,wherein the supporting member comprises a depressed portion formed from the top surface of the supporting member.

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