Platform Integrated Phased Array Transmit/Receive Module
First Claim
1. An apparatus, comprising:
- a plurality of substrate layers,the plurality of substrate layers including a first substrate layer having one or more phased array elements;
an integrated circuit to exchange one or more radio frequency (RF) signals with the one or more phased array elements; and
a connector module to exchange one or more further signals with the integrated circuit, the one or more further signals corresponding to the one or more RF signals.
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Accused Products
Abstract
Disclosed are integration approaches for mm-wave planar phased array type architectures using multilayer substrate technologies. For instance, an apparatus may include a plurality of substrate layers, an integrated circuit, and a connector module. The plurality of substrate layers includes a first substrate layer having one or more phased array elements. The integrated circuit exchange one or more radio frequency (RF) signals (e.g., mm-wave signals) with the one or more phased array elements. The connector module exchange further signals with the integrated circuit that correspond to the one or more RF signals. For example, these further signals may be baseband or intermediate frequency (IF) signals.
62 Citations
20 Claims
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1. An apparatus, comprising:
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a plurality of substrate layers, the plurality of substrate layers including a first substrate layer having one or more phased array elements; an integrated circuit to exchange one or more radio frequency (RF) signals with the one or more phased array elements; and a connector module to exchange one or more further signals with the integrated circuit, the one or more further signals corresponding to the one or more RF signals. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. An apparatus, comprising
a host module; - and
a phased array transmit and receive module wherein the phased array transmit and receive module includes; a plurality of substrate layers, the plurality of substrate layers including a first substrate layer having one or more phased array elements, an integrated circuit to exchange one or more radio frequency (RF) signals with the one or more phased array elements, and a connector module to exchange one or more further signals with the integrated circuit, the one or more further signals corresponding to the one or more RF signals; wherein the host module is to exchange the further signals with the connector module through a cable. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification