Electric Circuit Device, Electric Circuit Module, and Power Converter

• US 20100165577A1
• Filed: 03/01/2010
• Published: 07/01/2010
• Est. Priority Date: 04/27/2006
• Status: Active Grant

• Current Assignee: Hitachi Astemo Ltd. (Hitachi, Ltd.)
• Original Assignee: Hitachi, Ltd.
• Inventors: TOKUYAMA, Takeshi, Kawabata, Atushi, Nakatsu, Kinya
• Granted Patent: US 8,081,472 B2
• Time in Patent Office: Days
• US Class Current: 361/717
• CPC Class Codes: H01G 2/08 Cooling arrangements; Heating arrangements; Ventilating arrangements
• CPC Class Codes: H01G 4/224 Housing; Encapsulation
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73215 Layer and wire connectors
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/1305 Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/13055 Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/30107 Inductance
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H02M 7/003 Constructional details, e.g. physical layout, assembly, wiring or busbar connections
• CPC Class Codes: H05K 7/02 : Arrangements of circuit components or wiring on supporting structure
• CPC Class Codes: Y02T 10/70 : Energy storage systems for electromobility, e.g. batteries

Abstract

The present invention provides an electric circuit device in which it is possible to achieve simultaneously the improvement of cooling performance and reduction in operating loss due to line inductance.

The above object can be attained by constructing multiple plate-like conductors so that each of these conductors electrically connected to multiple semiconductor chips is also thermally connected to both chip surfaces of each such semiconductor chip to release heat from the chip surfaces of each semiconductor chip, and so that among the above conductors, a DC positive-polarity plate-like conductor and a DC negative-polarity plate-like conductor are opposed to each other at the respective conductor surfaces.

Claims

1. An electric circuit device comprising:

a plurality of semiconductor chips; and

a plurality of plate-shaped conductors electrically connected to said plurality of semiconductor chips;

wherein said plurality of plate-shaped conductors are constructed such that both chip surfaces of each of said plural semiconductor chips are each thermally connected to one of said plurality of plate-shaped conductors in order to release heat from both chip surfaces of each semiconductor chip through said plate-shaped conductor, and such that among said plurality of plate-shaped conductors, a plate-shaped conductor for direct-current positive polarity and a plate-shaped conductor for direct-current negative polarity are opposed to each other.