LIGHT SOURCE MODULE AND LIGHTING APPARATUS

• US 20100165624A1
• Filed: 12/18/2009
• Published: 07/01/2010
• Est. Priority Date: 12/26/2008
• Status: Active Grant

• Current Assignee: Toshiba Lighting & Technology Corporation (Toshiba Corporation)
• Original Assignee: Toshiba Lighting & Technology Corporation (Toshiba Corporation)
• Inventors: Oyaizu, Tsuyoshi, Takei, Haruki, Nishimura, Kiyoshi, Ogawa, Kozo, Shibahara, Yusuke, Kawashima, Seiko
• Granted Patent: US 8,408,724 B2
• Time in Patent Office: Days
• US Class Current: 362/235
• CPC Class Codes: F21S 8/02 of recess-mounted type, e.g. downlighters specially adapted for vehicle exteriors F21S41/00-F21S45/00
• CPC Class Codes: F21Y 2105/10 comprising a two-dimensional array of point-like light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A light source module includes a module substrate, a metal conductor, a plurality of semiconductor light emitting elements, a white diffuse reflection layer, and translucent sealing members. The metal conductor is provided in a predetermined pattern on a front surface of the module substrate. The semiconductor light emitting elements are electrically connected to the metal conductor and mounted on the front surface of the module substrate. The white diffuse reflection layer includes a plurality of holes in which the semiconductor light emitting elements are located, is thinner than the semiconductor light emitting elements, and is laminated to the front surface of the module substrate. The translucent sealing members bury the semiconductor light emitting elements, project below the diffuse reflection layer, and are mixed with a phosphor.

Claims

1. A light source module comprising:

a module substrate;

a metal conductor provided in a predetermined pattern on a front surface of the module substrate;

a plurality of semiconductor light emitting elements electrically connected to the metal conductor and mounted on the front surface of the module substrate;

a white diffuse reflection layer comprising a plurality of holes in which the semiconductor light emitting elements are located, being thinner than the semiconductor light emitting elements, and laminated to the front surface of the module substrate; and

translucent sealing members burying the semiconductor light emitting elements, projecting below the diffuse reflection layer, and mixed with a phosphor.

2. A light source module of claim 1, wherein distal ends of the semiconductor light emitting elements project below the diffuse reflection layer.

3. A light source module of claim 1, wherein the sealing members are stemmed individually by the holes of the diffuse reflection layer.

4. A light source module of claim 1, wherein each said sealing member is formed having a substantially spherical surface with a diameter-to-height ratio of 2.0˜

7.8 to 1.

5. A lighting apparatus comprising:

a light source module of claim 1;

an apparatus main body comprising a base wall portion and an open bottom portion underlying the base wall portion, the light source module being fixed to a lower surface of the base wall portion; and

a translucent cover supported by the apparatus main body, closing the open bottom portion, and covering the light source module from below.

6. A lighting apparatus of claim 5, wherein distal ends of the semiconductor light emitting elements project below the diffuse reflection layer.

7. A lighting apparatus of claim 5, wherein the sealing members are stemmed individually by the holes of the diffuse reflection layer.

8. A lighting apparatus of claim 5, wherein each said sealing member is formed having a substantially spherical surface with a diameter-to-height ratio of 2.0˜

7.8 to 1.