HEAT DISSIPATION DEVICE AND POWER MODULE

• US 20100172104A1
• Filed: 01/08/2010
• Published: 07/08/2010
• Est. Priority Date: 01/08/2009
• Status: Active Grant

• Current Assignee: Toyota Jidosha Kabushiki Kaisha (Toyota Motor Corporation)
• Original Assignee: Toyota Jidosha Kabushiki Kaisha (Toyota Motor Corporation)
• Inventors: Tashiro, Hiroki, Yoshida, Tadafumi
• Granted Patent: US 7,961,474 B2
• Time in Patent Office: Days
• US Class Current: 361/717
• CPC Class Codes: F28F 1/126 consisting of zig-zag shaped fins F28F1/105 takes precedence
• CPC Class Codes: F28F 2265/26 for allowing differential expansion between elements floating header box elements F28F9/0236
• CPC Class Codes: F28F 3/025 the means being corrugated, plate-like elements
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 7/209 Heat transfer by conduction from internal heat source to heat radiating structure H05K7/20909 takes precedence

Abstract

A radiator having a radiator fin sandwiched between and joined to a top plate and a bottom plate is provided on an insulating substrate, which has a semiconductor element arranged on one face side thereof, on the other face side thereof. The radiator fin is a corrugated fin that includes a first region that includes a joint peak portion joined to the bottom plate and has a height in an amplitude direction which is substantially equal to a distance between the top plate and the bottom plate, and a second region that includes a non-joint peak portion separated from the bottom plate by a predetermined gap and has a height in the amplitude direction which is smaller than the distance between the top plate and the bottom plate.

Claims

1. A heat dissipation device provided on one face side of an insulating substrate, which has a semiconductor element disposed on the other face side thereof, comprising:

a first planar member that includes an insulating substrate-side joint face joined to the insulating substrate, and a first joint face on the side of the first planar member opposite the insulating substrate-side joint face;

a second planar member that includes a second joint face that faces the first joint face; and

a radiator fin that is corrugated and arranged between the first planar member and the second planar member, wherein a peak portion of the radiator fin is joined to the first joint face, and the radiator fin includes a first region that has a height in an amplitude direction which is equal to a distance between the first planar member and the second planar member and includes a joint peak portion joined to the second joint face and a second region that has a height in the amplitude direction which is shorter than the distance between the first planar member and the second planar member and includes a non-joint peak portion separated from the second joint face by a gap.

2. The heat dissipation device according to claim 1, wherein

the radiator fin includes a plurality of first regions, and

the plurality of the first regions are provided at equidistant intervals.

3. The heat dissipation device according to claim 1, wherein

the gap separating the second region from the second joint face is at most 1 mm.

4. The heat dissipation device according to claim 1, wherein

a plurality of the radiator fins is provided between the fist planar member and the second planar member, is adjacent to one another across gaps having a predetermined width respectively, and is arranged out of phase with one another.

5. The heat dissipation device according to claim 1, further comprising

a heat dissipation plate that is arranged between the insulating substrate and the first planar member and that is made of a material having a higher thermal conductivity than the insulating substrate.

6. The heat dissipation device according to claim 1, wherein

the second planar member has a heating element fixing face that is located on the side of the second planar member opposite from the second joint face to fix a heating element.

7. The heat dissipation device according to claim 6, wherein

the heating element is a reactor or a DC/DC converter.

8. A power module comprising:

an insulating substrate;

a semiconductor element provided on one face of the insulating substrate;

a first planar member arranged on an opposite face side of the insulating substrate from the semiconductor element that includes an insulating substrate-side joint face joined to the insulating substrate, and a first joint face on the side of the first planar member opposite the insulating substrate-side joint face;

a second planar member that includes a second joint face that faces the first joint face; and

a radiator fin that is corrugated and arranged between the first planar member and the second planar member, wherein a peak portion of the radiator fin is joined to the first joint face, and the radiator fin includes a first region that has a height in an amplitude direction which is equal to a distance between the first planar member and the second planar member and includes a joint peak portion joined to the second joint face and a second region that has a height in the amplitude direction which is shorter than the distance between the first planar member and the second planar member and includes a non-joint peak portion separated from the second joint face by a gap.

9. The power module according to claim 8, wherein:

portions of the radiator fin joined to the first planar member on a side opposite from where the insulating substrate is joined to the first planar member include the joint peak portion and the non-joint peak portion; and

portions of the radiator fin joined to the first planar member on the side opposite from where the insulating substrate is not joined to the first planar member include only joint peak portions.

10. The power module according to claim 8, further comprising

a heating element that is fixed to that face of the second planar member opposite from the second joint face.

11. The power module according to claim 10, wherein

a heat conductive grease is applied between the second planar member and the heating element.

12. The power module according to claim 10, wherein

the heating element is a reactor or a DC/DC converter.