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Three dimensional structure memory

  • US 20100173453A1
  • Filed: 07/04/2009
  • Published: 07/08/2010
  • Est. Priority Date: 04/04/1997
  • Status: Active Grant
First Claim
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1. A method of making a circuit structure comprising:

  • forming a first substrate with a first surface having interconnect contacts;

    forming a second substrate with a first surface having interconnect contacts and a second surface, wherein the second surface is opposite said first surface of the second substrate;

    bonding the first surface of the first substrate to the first surface of the second substrate;

    thinning the second substrate from the second surface;

    performing Chemical Mechanical Polishing of the second surface of the second substrate; and

    ,forming at least one vertical interconnection between one of the interconnect contacts of the first substrate and one of the interconnect contacts of the second substrate.

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