Method and Apparatus for Configurable Circuitry

• US 20100175916A1
• Filed: 03/29/2010
• Published: 07/15/2010
• Est. Priority Date: 09/22/2004
• Status: Active Grant

• Current Assignee: Digi International Inc.
• Original Assignee: Digi International Inc.
• Inventors: Feng, Jun, Hoffman, John W., Rogers, Norman L., Krauter, Charles
• Granted Patent: US 9,767,241 B2
• Time in Patent Office: Days
• US Class Current: 174/261
• CPC Class Codes: G06F 30/39 Circuit design at the physical level physical level design for reconfigurable circuits G06F30/347
• CPC Class Codes: H05K 1/0206 by printed thermal vias
• CPC Class Codes: H05K 1/029 having a programmable lay-out, i.e. adapted for choosing between a few possibilities
• CPC Class Codes: H05K 1/0295 adapted for choosing between different types or different locations of mounted components
• CPC Class Codes: H05K 1/111 Pads for surface mounting, e.g. lay-out
• CPC Class Codes: H05K 1/114 Pad being close to via, but not surrounding the via
• CPC Class Codes: H05K 2201/093 Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
• CPC Class Codes: H05K 2201/09309 Core having two or more power planes; Capacitive laminate of two power planes
• CPC Class Codes: H05K 2201/09418 Special orientation of pads, lands or terminals of component, e.g. radial or polygonal orientation
• CPC Class Codes: H05K 2201/09454 Inner lands, i.e. lands around via or plated through-hole in internal layer of multilayer PCB
• CPC Class Codes: H05K 2201/09663 Divided layout, i.e. conductors divided in two or more parts
• CPC Class Codes: H05K 2201/09954 More mounting possibilities, e.g. on same place of PCB, or by using different sets of edge pads
• CPC Class Codes: H05K 2201/10022 Non-printed resistor
• CPC Class Codes: H05K 2201/10166 Transistor
• CPC Class Codes: H05K 2201/10636 Leadless chip, e.g. chip capacitor or resistor
• CPC Class Codes: H05K 2203/173 Adding connections between adjacent pads or conductors, e.g. for modifying or repairing
• CPC Class Codes: H05K 3/0005 for designing circuits by computer
• CPC Class Codes: H05K 3/0064 onto a polymeric substrate
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49124 : On flat or curved insulated base, e.g., printed circuit, etc.

Abstract

A method and apparatus for configurable circuitry have been disclosed.

Claims

1. A printed circuit board comprising:

a solder pad;

a plated via having a first connection point and a second connection point, said first connection point connected to said solder pad; and

an isolated island of thermally conductive material having a connection to said second connection point.

2. A method comprising;

connecting a solder pad to a first connection of a via; and

connecting a second connection of said via to an electrically isolated thermally conductive material.

3. A printed circuit board comprising:

one or more electrically conductive layers separated by one or more insulating layers; and

a stiffener having a plurality of plated through vias, said stiffener non-electrically connectedly attached to said one or more electrically conductive layers separated by one or more insulating layers.