Method and Apparatus for Configurable Circuitry
First Claim
Patent Images
1. A printed circuit board comprising:
- a solder pad;
a plated via having a first connection point and a second connection point, said first connection point connected to said solder pad; and
an isolated island of thermally conductive material having a connection to said second connection point.
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Abstract
A method and apparatus for configurable circuitry have been disclosed.
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Citations
3 Claims
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1. A printed circuit board comprising:
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a solder pad; a plated via having a first connection point and a second connection point, said first connection point connected to said solder pad; and an isolated island of thermally conductive material having a connection to said second connection point.
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2. A method comprising;
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connecting a solder pad to a first connection of a via; and connecting a second connection of said via to an electrically isolated thermally conductive material.
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3. A printed circuit board comprising:
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one or more electrically conductive layers separated by one or more insulating layers; and a stiffener having a plurality of plated through vias, said stiffener non-electrically connectedly attached to said one or more electrically conductive layers separated by one or more insulating layers.
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Specification