Through-Silicon Via With Low-K Dielectric Liner
First Claim
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1. A semiconductor device comprising:
- a semiconductor substrate having a circuit side and a backside opposite the circuit side;
a through-silicon via extending through the semiconductor substrate; and
a first dielectric layer interposed between the through-silicon via and the semiconductor substrate, the first dielectric layer extending over at least a portion of a surface of the backside of the semiconductor substrate.
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Abstract
A semiconductor substrate having a through-silicon via with an air gap interposed between the through-silicon via and the semiconductor substrate is provided. An opening is formed partially through the semiconductor substrate. The opening is first lined with a first liner and then the opening is filled with a conductive material. A backside of the semiconductor substrate is thinned to expose the first liner, which is subsequently removed and a second liner formed with a low-k or extra low-k dielectric is formed in its place.
87 Citations
19 Claims
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1. A semiconductor device comprising:
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a semiconductor substrate having a circuit side and a backside opposite the circuit side; a through-silicon via extending through the semiconductor substrate; and a first dielectric layer interposed between the through-silicon via and the semiconductor substrate, the first dielectric layer extending over at least a portion of a surface of the backside of the semiconductor substrate. - View Dependent Claims (2, 3, 4, 5)
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6. A method of forming a semiconductor device, the method comprising:
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providing a semiconductor substrate, the semiconductor substrate having first side and a second side opposite the first side; forming an opening extending from the first side of the semiconductor substrate into the semiconductor substrate; forming a first liner along sidewalls of the opening; forming a conductive material over the first liner in the opening; thinning the second side of the semiconductor substrate, thereby exposing at least a portion of the first liner; removing at least a portion of the first liner interposed between the conductive material and the semiconductor substrate; and forming, after the removing, a second liner interposed between the conductive material and the semiconductor substrate. - View Dependent Claims (7, 8, 9, 10, 11, 12)
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13. A method of forming a semiconductor device, the method comprising:
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providing a semiconductor substrate having a through-silicon via extending from a circuit side partially through the semiconductor substrate, a first liner being interposed between the through-silicon via and the semiconductor substrate; thinning a backside of the semiconductor substrate such that at least a portion of the first liner is exposed; removing at least a portion of the first liner interposed between the through-silicon via and the semiconductor substrate, thereby forming an opening around the through-silicon via on the backside of the semiconductor substrate; and forming a second liner in the opening. - View Dependent Claims (14, 15, 16, 17, 18, 19)
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Specification