Probe Test Card with Flexible Interconnect Structure

• US 20100176831A1
• Filed: 01/14/2009
• Published: 07/15/2010
• Est. Priority Date: 01/14/2009
• Status: Abandoned Application

• Current Assignee: SV Probe Pte Ltd. (Nidec Corporation)
• Original Assignee: SV Probe Pte Ltd. (Nidec Corporation)
• Inventors: Palcisko, William M., Tunaboylu, Bahadir, Back, Gerald W.
• Application Number:
  US12/353,879
• Publication Number:
  US 20100176831A1
• Time in Patent Office: Days
• US Class Current: 324/756.30
• CPC Class Codes: G01R 1/07357 with flexible bodies, e.g. buckling beams
• CPC Class Codes: G01R 1/07378 using an intermediate adapter, e.g. space transformers G01R1/07371 takes precedence

Abstract

A probe test card assembly for testing of a device under test includes a printed circuit board (PCB), a space transformer, a probe head structure and a flexible interconnect structure. The space transformer has a first plurality of electrical contacts disposed thereon for providing electrical connections with a plurality of contacts disposed on the PCB and a second plurality of electrical contacts disposed thereon for making contact with a plurality of test probes. Each test probe from the plurality of test probes has a first end for making electrical contact with a device under test and a second end for making electrical contact with one of the electrical contacts from the second plurality of electrical contacts on the space transformer. The flexible interconnect structure provides electrical connections between the first plurality of electrical contacts on the space transformer and the plurality of electrical contacts on the PCB.

Claims

1. A probe test card assembly comprising:

a printed circuit board having a plurality of electrical contacts disposed thereon;

a space transformer having a first plurality of electrical contacts disposed thereon for providing electrical connections with the plurality of electrical contacts disposed on the printed circuit board and a second plurality of electrical contacts for making contact with a plurality of test probes;

a probe head structure supporting the plurality of test probes, each test probe in the plurality of test probes having a first end for making electrical contact with a device under test and a second end for making electrical contact with one of the electrical contacts from the second plurality of electrical contacts on the space transformer; and

a flexible interconnect structure connected to the first plurality of electrical contacts on the space transformer and to the plurality of electrical contacts on the printed circuit board for providing electrical contact between the first plurality of electrical contacts on the space transformer and the plurality of electrical contacts on the printed circuit board.

2. The probe test card assembly recited in claim 1, further comprising one or more clamping mechanisms for attaching the flexible interconnect structure to one or more of the plurality of electrical contacts on the printed circuit board or the first plurality of electrical contacts on the space transformer.

3. The probe test card assembly recited in claim 1, further comprising one or more wire bond bumps disposed on the plurality of electrical contacts on the printed circuit board or the first plurality of electrical contacts on the space transformer.

4. The probe test card assembly recited in claim 1, further comprising one or more wire bond bumps disposed on the flexible interconnect structure to improve the contact between the flexible interconnect structure and the plurality of electrical contacts on the printed circuit board or the first plurality of electrical contacts on the space transformer.

5. The probe test card assembly recited in claim 1, wherein the flexible interconnect structure is solder bonded to the plurality of electrical contacts on the printed circuit board.

6. The probe test card assembly recited in claim 1, wherein:

the flexible interconnect structure is bonded to the printed circuit board, and

the probe test card assembly further comprises one or more wire bonds connected between the flexible interconnect structure and the plurality of electrical contacts on the printed circuit board.

7. The probe test card assembly recited in claim 1, wherein:

the flexible interconnect structure is bonded to the space transformer, and

the probe test card assembly further comprises one or more wire bonds connected between the flexible interconnect structure and the first plurality of electrical connections on the space transformer.

8. The probe test card assembly recited in claim 1, wherein:

the flexible interconnect structure is solder bonded to the plurality of electrical contacts on the printed circuit board,

the flexible interconnect structure is bonded to the space transformer, and

the probe test card assembly further comprises one or more wire bonds connected between the flexible interconnect structure and the first plurality of electrical connections on the space transformer.

9. The probe test card assembly recited in claim 1, wherein the space transformer is a multi-layer silicon space transformer.

10. The probe test card assembly recited in claim 1, wherein the flexible interconnect structure is one or more flexible circuits.

11. The probe test card assembly recited in claim 1, wherein the probe head structure includes:

a first guide plate having a plurality of apertures disposed therein, and

a second guide plate having a plurality of apertures disposed therein,

wherein the plurality of test probes extend through the plurality of apertures disposed in the first guide plate and the plurality of apertures disposed in the second guide plate.

12. The probe test card assembly recited in claim 6, wherein the plurality of apertures disposed in the first guide plate and the plurality of apertures disposed in the second guide plate are coated with a non-conductive material.

13. The probe test card assembly recited in claim 1, wherein the space transformer is a multi-layer silicon space transformer.

14. A probe test card assembly comprising:

a printed circuit board having a plurality of electrical contacts disposed thereon;

a space transformer having a first plurality of electrical contacts disposed thereon and that are electrically connected to the plurality of electrical contacts on the printed circuit board, the space transformer further having a second plurality of electrical contacts; and

a probe head structure supporting a plurality of test probes, each test probe in the plurality of test probes having a first end for making electrical contact with a device under test and a second end for making electrical contact with one of the electrical contacts from the second plurality of electrical contacts on the space transformer, wherein the probe head structure comprises;

a first guide plate having a plurality of apertures formed therein,

a second guide plate having a plurality of apertures formed therein, and

wherein the plurality of test probes are disposed through both the plurality of apertures in the first guide plate and the plurality of apertures in the second guide plate.

15. The probe test card assembly recited in claim 14, wherein one or more test probes from the plurality of test probes are pre-buckled so that they deflect in a specified direction when in contact with the device under test.

16. The probe test card assembly recited in claim 15, wherein the one or more test probes have a generally rectangular cross sectional shape.

17. The probe test card assembly recited in claim 16, wherein the plurality of apertures in the first guide plate and the plurality of apertures in the second guide plate are generally rectangular in shape to receive the one or more test probes having a generally rectangular cross sectional shape.

18. The probe test card assembly recited in claim 14, wherein:

the second guide plate is adjacent the first end of each of the plurality of test probes, and

the second guide plate is made of a rigid material.

19. The probe test card assembly recited in claim 14, wherein the plurality of apertures in the second guide plate is coated with a non-conductive material.

20. The probe test card assembly recited in claim 14, wherein:

the first guide plate is adjacent the second end of each of the plurality of test probes, and

the first guide plate is made of a plastic material.

21. The probe test card assembly recited in claim 14, further comprising a flexible interconnect structure that provides electrical connections between the first plurality of electrical contacts on the printed circuit board and the first plurality of electrical contacts on the space transformer.