WAFER LEVEL LENS REPLICATION ON MICRO-ELECTRICAL-MECHANICAL SYSTEMS

• US 20100177411A1
• Filed: 01/09/2009
• Published: 07/15/2010
• Est. Priority Date: 01/09/2009
• Status: Abandoned Application

• Current Assignee: Aptina Imaging Corporation (ON Semiconductor Corporation)
• Original Assignee: Aptina Imaging Corporation (ON Semiconductor Corporation)
• Inventors: Hegde, Shashikant, Boettiger, Ulrich C., Duparre, Jacques, Lake, Rick
• Application Number:
  US12/351,366
• Publication Number:
  US 20100177411A1
• Time in Patent Office: Days
• US Class Current: 359/823
• CPC Class Codes: G02B 26/0875 by means of one or more refracting elements
• CPC Class Codes: G02B 3/0075 characterized by non-optical structures, e.g. having integrated holding or alignment means
• CPC Class Codes: G02B 7/08 adapted to co-operate with a remote control mechanism

Abstract

Movable lens structures in which a lens is formed on a micro-electrical-mechanical system and methods of making the same. A method of forming the lens includes forming a micro-electrical-mechanical system on a substrate, arranging a first mold inside the micro-electrical-mechanical system, and forming a lens on the micro-electrical-mechanical system using the first mold.

Claims

1. A method of making a movable lens structure, the method comprising:

forming a lens moving structure on a substrate, the substrate and the lens moving substrate defining a cavity;

arranging a first mold inside the cavity; and

forming a lens on the lens moving structure and the first mold.

2. The method of claim 1, further comprising removing the first mold from the cavity.

3. The method of claim 1, further comprising forming an opening in the substrate to expose the first mold.

4. The method of claim 3, further comprising removing the first mold from the cavity by dissolving the first mold and extracting the dissolved first mold through the opening.

5. The method of claim 3, wherein the first mold is arranged inside the cavity by inserting the first mold through the opening.

6. The method of claim 5, wherein the first mold is removed from inside the cavity by withdrawing the first mold through the opening.

7. The method of claim 1, further comprising arranging the first mold inside the cavity by deposition or sputtering.

8. The method of claim 1, further comprising embossing the first mold to form a lens shaped depression after arranging the first mold inside the cavity and before forming the lens.

9. The method of claim 1, wherein the first mold comprises polynorbornene, polycarbonate, polyvinyl alcohol, or an ultra-violet curable polymer.

10. The method of claim 1, wherein the lens is formed by arranging curable material on the first mold and the lens moving structure and shaping the ultra-violet curable material between the first mold and a second mold to form the lens.

11. The method of claim 1, wherein the lens moving structure comprises a micro-electrical-mechanical system.

12. A method of making a lens wafer, the method comprising:

forming a plurality of micro-electrical-mechanical systems on a first substrate;

respectively providing a plurality of first molds inside the plurality of micro-electrical-mechanical systems;

providing a curable material on the first molds and on the plurality of micro-electrical-mechanical systems;

shaping the curable material, using the plurality of first molds and a plurality of second molds, into a plurality of lenses respectively associated with the plurality of the micro-electrical-mechanical systems;

forming a plurality of openings at locations corresponding to the micro-electrical-mechanical systems through the substrate; and

removing the first molds from inside of the plurality of micro-electrical-mechanical systems.

13. The method of claim 12, wherein:

the plurality of openings are formed after shaping the curable material; and

wherein the plurality of first molds are removed through the plurality of openings by dissolving the first molds.

14. The method of claim 12, wherein:

the plurality of openings are formed before shaping the curable material; and

the plurality of first molds are arranged inside the plurality of micro-electrical-mechanical systems by inserting the plurality of first molds through the plurality of openings.

15. A method of forming an imaging device comprising:

forming a first wafer by a method comprising;

forming a micro-electrical-mechanical system on a substrate,

arranging a first mold inside the micro-electrical-mechanical system,

forming a lens on the micro-electrical-mechanical system using the first mold,

removing the first mold from inside the micro-electrical-mechanical system; and

coupling the first wafer to a second wafer containing a pixel array, such that said pixel array can receive an image through said lens.

16. The method of claim 15, wherein the lens is formed by arranging curable material on the first mold and the lens moving structure and shaping the ultra-violet curable material between the first mold and a second mold to form the lens.

17. A lens structure comprising:

a substrate;

a micro-electrical-mechanical system arranged on the substrate; and

a lens connected to the micro-electrical-mechanical system.

18. The lens structure of claim 17, further comprising an opening formed in the substrate.

19. The lens structure of claim 18, wherein the opening is aligned with the micro-electrical-mechanical system.

20. The lens structure of claim 18, further comprising a cavity arranged inside the micro-electrical-mechanical system and between the lens and the substrate.

21. The lens structure of claim 17, wherein the lens comprises a first curved side facing away from the substrate and a second substantially flat side facing towards the substrate.

22. The lens structure of claim 17, wherein the lens comprises a first curved side facing away from the substrate and a second curved side facing towards the substrate.

23. The lens structure of claim 17, wherein the lens comprises an ultra-violet curable material.

24. An imaging device comprising:

a first wafer comprising;

a substrate,

a micro-electrical-mechanical system arranged on the substrate,

a lens connected directly to the micro-electrical-mechanical system,

an opening formed in the substrate, and

a cavity arranged inside the micro-electrical-mechanical system; and

a second wafer coupled to the first wafer and comprising a pixel array and associated circuitry,

wherein the pixel array is aligned with the lens.

25. The imaging device claim 24, wherein the micro-electrical-mechanical system is capable of adjusting a distance between the lens and the pixel array.