Cooling arrangement for an equipment assembly

• US 20100177478A1
• Filed: 01/09/2009
• Published: 07/15/2010
• Est. Priority Date: 01/09/2009
• Status: Abandoned Application

• Current Assignee: Alcatel-Lucent USA, Inc. (Nokia Corporation)
• Original Assignee: Alcatel-Lucent USA, Inc. (Nokia Corporation)
• Inventors: Akalanne, Lucius Chidi, Batten, Mark Vivian
• Application Number:
  US12/319,587
• Publication Number:
  US 20100177478A1
• Time in Patent Office: Days
• US Class Current: 361/690
• CPC Class Codes: H05K 7/20127 Natural convection
• CPC Class Codes: H05K 7/20409 Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
• CPC Class Codes: H05K 7/20518 Unevenly distributed heat load, e.g. different sectors at different temperatures, localised cooling, hot spots

Abstract

An equipment assembly includes a core cooling slot to manage thermal effects brought about by the generation of heat from components therein. The cooling slot is positioned within the equipment assembly so that only air that is external to the equipment assembly passes through the cooling slot to provide external convection-based cooling for components in a core section inside the equipment assembly. The cooling slot also acts as a thermal barrier for redistributing heat generated by the one or more components inside the equipment assembly.

Claims

1. An equipment assembly adapted to receive one or more components housed together within a core section of the equipment assembly, comprising:

a cooling slot defined within the core section of the equipment assembly through which only air that is external to the equipment assembly can pass through to provide convection-based cooling for at least the one or more components that are housed together within the equipment assembly,

wherein the cooling slot is positioned within the equipment assembly to provide a thermal barrier for redistributing heat generated by at least the one or more components housed together within the core section inside the equipment assembly.

2. The equipment assembly as recited in claim 1, wherein the cooling slot extends inwardly a predetermined distance from a top surface of the equipment assembly into the core section, and wherein the cooling slot is open at the top surface.

3. The equipment assembly as recited in claim 1, wherein the cooling slot extends inwardly from a respective surface other than a top surface of the equipment assembly into the core section and wherein the cooling slot is open at the respective surface.

4. The equipment assembly as recited in claim 1, wherein the cooling slot extends laterally across substantially the entire width of the equipment assembly and wherein the cooling slot is open at opposing sides of the equipment assembly.

6. The equipment assembly as recited in claim 1, wherein the cooling slot comprises spaced-apart side walls extending into the core section of the equipment assembly.

7. The equipment assembly as recited in claim 1, wherein the cooling slot is positioned within the equipment assembly so that at least two components are located adjacent to and in proximity of opposite spaced-apart sidewalls of the cooling slot.

9. The equipment assembly as recited in claim 1, wherein the equipment assembly houses components for a telecommunications wireless base station.

11. The equipment assembly as recited in claim 1, wherein the cooling slot is positioned to further provide the thermal barrier between components in the core section and one or more periphery sections relative to the core section within the equipment assembly.

12. The equipment assembly as recited in claim 1, wherein the cooling slot is positioned to provide the thermal barrier between components such that thermal margins of respective components are maintained to not exceed predefined maximum operating temperatures.

13. The equipment assembly as recited in claim 1, wherein the equipment assembly is substantially airtight to substantially prevent elements external to the equipment assembly from entering into the equipment assembly.

14. The equipment assembly as recited in claim 1, wherein the cooling slot is positioned to channel air external to the equipment assembly across surfaces of the cooling slot to provide the convection-based cooling.

5. (canceled)

8. (canceled)

10. (canceled)

15. An apparatus comprising:

an equipment enclosure having a plurality of electronic components housed together therein, with one or more of the plurality of electronic components being located and housed together within a core section of the equipment enclosure; and

a cooling slot defined within the core section of the enclosure such that only air that is external to the enclosure can flow through the cooling slot to provide convection-based cooling for at least the one or more of the plurality of electronic components that are housed together inside the core section of the enclosure,

wherein the cooling slot serves as a thermal barrier for redistributing heat generated by the plurality of electronic components that are housed together within the core section inside the enclosure.

16. The apparatus according to claim 15, wherein the enclosure is substantially airtight to substantially prevent elements external to the enclosure from entering into the enclosure.

17. The apparatus according to claim 15, wherein the cooling slot extends inwardly a predetermined distance from a top surface of the enclosure into the core section and wherein the cooling slot is open at the top surface.

18. The apparatus according to claim 15, wherein the cooling slot extends inwardly from a respective surface other than a top surface of the enclosure into the core section and wherein the cooling slot is open at the respective surface.

19. The apparatus according to claim 15, wherein the cooling slot extends laterally across substantially the entire width of the enclosure and wherein the cooling slot is open at opposing sides of the enclosure.

20. The apparatus according to claim 15, wherein the cooling slot is positioned to further provide the thermal barrier between components in a core section and one or more periphery sections relative to the core section within the enclosure.

21. The apparatus according to claim 15, wherein the cooling slot is positioned to provide the thermal barrier between components such that thermal margins of respective components are maintained to not exceed predefined maximum operating temperatures of respective ones of the components.

22. The apparatus according to claim 15, wherein the cooling slot is positioned to channel air external to the enclosure across surfaces of the cooling slot to provide the convection-based cooling.

23. A method of cooling an equipment cabinet adapted to house a plurality of components, comprising:

incorporating a cooling slot within a core section of the cabinet so that only air that is external to the cabinet can flow through the cooling slot to provide convection-based cooling for the plurality of components that are housed together within the core section inside the cabinet; and

positioning the cooling slot within the core section of the cabinet

such that the cooling slot acts as a thermal barrier for redistributing heat generated by the plurality of components that are housed together within the core section inside the cabinet.

24. A method of operating an equipment cabinet adapted to house a plurality of components, comprising:

using a cooling slot to provide external convection-based cooling for the plurality of components that are housed together inside the cabinet, wherein the cooling slot is defined within a core section of the cabinet and such that only air that is external to the cabinet flows through the cooling slot; and

using the cooling slot as a thermal barrier for redistributing heat generated by the plurality of components that are housed together within the core section inside the cabinet.