SYSTEMS, APPARATUS AND METHODS FOR MOVING SUBSTRATES
First Claim
Patent Images
7-1. The end effector of claim 16, wherein the contact surface having a curved shape has a radius of curvature of about 0.64 mm to about 9.53 mm.
1 Assignment
0 Petitions
Accused Products
Abstract
Systems, methods and apparatus are provided for moving substrates in electronic device manufacturing. In some aspects, end effectors having a base portion and at least three pads are provided. Each of the pads has a contact surface, and at least one of the contact surfaces has a curved shape. A substrate supported by the end effector may be moved at a relatively high lateral g-force without significant slipping relative to the pads. Additional aspects are provided.
-
Citations
24 Claims
-
7-1. The end effector of claim 16, wherein the contact surface having a curved shape has a radius of curvature of about 0.64 mm to about 9.53 mm.
-
15. An end effector for moving substrates, comprising:
-
a base portion comprised of Ti-doped alumina ceramic; and three pads comprised of Ti-doped alumina ceramic disposed on the base portion wherein each of the three pads includes a contact surface having a curved shape with a radius of curvature of about 0.64 mm to about 9.53 mm and a roughness of about 45 Ra to about 65 Ra.
-
-
16. An end effector for moving substrates, comprising:
-
a base portion; and at least three pads disposed on the base portion wherein each of the pads has a contact surface and at least one of the contact surfaces has a curved shape and a roughness of about 45 Ra to about 65 Ra. - View Dependent Claims (1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 18, 19, 20)
-
-
21. A method for moving a substrate in an electronic device manufacturing process, comprising:
-
providing a substrate carrying robot, the robot comprising a robot arm; providing an end effector on the robot arm, the end effector comprising a base portion and at least three pads disposed thereon wherein each of the pads comprises a contact surface and at least one of the contact surfaces has a curved shape and a roughness of about 45 Ra to about 65 Ra; placing the substrate in contact with the end effector; and moving the robot arm. - View Dependent Claims (22, 23, 24)
-
Specification