SYSTEMS, APPARATUS AND METHODS FOR MOVING SUBSTRATES

• US 20100178137A1
• Filed: 01/08/2010
• Published: 07/15/2010
• Est. Priority Date: 01/11/2009
• Status: Abandoned Application

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Brodine, Jeffrey A., Foster, Jason K., Axelrod, Boris, Cho, Tom K., Ng, Edward, Sundar, Satish, Chintalapati, Prudhvi R., Silvetti, Mario Dave
• Application Number:
  US12/684,754
• Publication Number:
  US 20100178137A1
• Time in Patent Office: Days
• US Class Current: 414/222.10
• CPC Class Codes: H01L 21/67742 Mechanical parts of transfer devices robots in general in B25J
• CPC Class Codes: H01L 21/68707 the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Abstract

Systems, methods and apparatus are provided for moving substrates in electronic device manufacturing. In some aspects, end effectors having a base portion and at least three pads are provided. Each of the pads has a contact surface, and at least one of the contact surfaces has a curved shape. A substrate supported by the end effector may be moved at a relatively high lateral g-force without significant slipping relative to the pads. Additional aspects are provided.

Claims

7-1. The end effector of claim 16, wherein the contact surface having a curved shape has a radius of curvature of about 0.64 mm to about 9.53 mm.

15. An end effector for moving substrates, comprising:

a base portion comprised of Ti-doped alumina ceramic; and

three pads comprised of Ti-doped alumina ceramic disposed on the base portion wherein each of the three pads includes a contact surface having a curved shape with a radius of curvature of about 0.64 mm to about 9.53 mm and a roughness of about 45 Ra to about 65 Ra.

16. An end effector for moving substrates, comprising:

a base portion; and

at least three pads disposed on the base portion wherein each of the pads has a contact surface and at least one of the contact surfaces has a curved shape and a roughness of about 45 Ra to about 65 Ra.

1. A system for moving substrates in an electronic device manufacturing process, comprising:

a robot for moving substrates, the robot comprising an end effector, the end effector comprising

a base portion, and

at least three pads disposed on the base portion wherein each of the pads comprises a contact surface and at least one contact surface has a curved shape and a roughness of about 45 Ra to about 65 Ra.

2. The system of claim 1, consisting essentially of three pads.

3. The system of claim 1, comprising four pads.

4. The system of claim 1, comprising more than four pads.

5. The system of claim 1, wherein the at least one contact surface has a radius of curvature of about 0.64 mm to about 9.53 mm.

6. The system of claim 1, wherein the base portion and at least one of the pads are comprised of electrically conductive material.

7. An end effector for moving substrates, comprising:

a base portion; and

three pads disposed on the base portion wherein each of the pads has a contact surface and at least one of the contact surfaces has a curved shape.

8. The end effector of claim 7, wherein the contact surface having a curved shape has a radius of curvature of about 0.64 mm to about 9.53 mm.

9. The end effector of claim 7, wherein the contact surface having a curved shape has a surface roughness of about 45 Ra to about 65 Ra.

10. The end effector of claim 7, wherein the base portion is comprised of electrically conductive material.

11. The end effector of claim 7, wherein the base portion is comprised of conductive material chosen from the group consisting of stainless steel, alumina, nickel-plated aluminum, zirconia and silicon carbide.

12. The end effector of claim 7, wherein at least one pad is comprised of electrically conductive material.

13. The end effector of claim 7, wherein at least one pad is comprised of conductive material chosen from the group consisting of stainless steel, alumina, nickel-plated aluminum, zirconia and silicon carbide.

14. The end effector of claim 7, wherein the pads and the base portion are machined from a single piece of material.

18. The end effector of claim 16, wherein the base portion is comprised of electrically conductive material.

19. The end effector of claim 16, wherein at least one pad is comprised of electrically conductive material.

20. The end effector of claim 16, wherein the pads and the base portion are machined from a single piece of material.

21. A method for moving a substrate in an electronic device manufacturing process, comprising:

providing a substrate carrying robot, the robot comprising a robot arm;

providing an end effector on the robot arm, the end effector comprising a base portion and at least three pads disposed thereon wherein each of the pads comprises a contact surface and at least one of the contact surfaces has a curved shape and a roughness of about 45 Ra to about 65 Ra;

placing the substrate in contact with the end effector; and

moving the robot arm.

22. The method of claim 21, wherein the end effector will maintain substrate placement within ±

0.13 mm while moving with an acceleration of at least 0.13 g.

23. The method of claim 22, wherein the end effector will maintain substrate placement within ±

0.085 mm while moving with an acceleration of at least 0.13 g.

24. The method of claim 23, wherein the end effector will maintain substrate placement within ±

0.02 mm while moving with an acceleration of at least 0.13 g.