MICROFLUIDIC STRUCTURES WITH INTEGRATED DEVICES

• US 20100180961A1
• Filed: 12/21/2007
• Published: 07/22/2010
• Est. Priority Date: 12/29/2006
• Status: Abandoned Application

• Current Assignee: Corning Incorporated
• Original Assignee: Corning Incorporated
• Inventors: Marques, Paulo Gaspar Jorge, Tanguy, Ronan, Lobet, Olivier
• Application Number:
  US12/596,945
• Publication Number:
  US 20100180961A1
• Time in Patent Office: Days
• US Class Current: 137/341
• CPC Class Codes: B01F 25/62 of the gear type
• CPC Class Codes: B01F 33/30 Micromixers
• CPC Class Codes: B01F 33/452 using independent floating stirring elements
• CPC Class Codes: B01F 33/453 using supported or suspended stirring elements
• CPC Class Codes: B01J 19/0093 Microreactors, e.g. miniaturised or microfabricated reactors laboratory containers with capillary fluid transport in microfabricated channels or chambers B01L3/5027
• CPC Class Codes: B01J 2219/00783 Laminate assemblies, i.e. the reactor comprising a stack of plates
• CPC Class Codes: B01J 2219/00824 Ceramic
• CPC Class Codes: B01J 2219/00831 Glass
• CPC Class Codes: B01J 2219/0086 Dimensions of the flow channels
• CPC Class Codes: B01J 2219/00873 Heat exchange
• CPC Class Codes: B01J 2219/00889 Mixing micromixers B01F33/30
• CPC Class Codes: B01J 2219/00891 Feeding or evacuation
• CPC Class Codes: B01J 2219/0093 Electric or magnetic energy
• CPC Class Codes: B01L 3/5027 by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip B01L3/5023 takes precedence; micromixers B01F33/30; microreactors for synthesis B01J19/0093; microcapillary devices in general B81B1/00
• CPC Class Codes: B01L 7/00 Heating or cooling apparatus autoclaves B01J3/04; Heat insulating devices
• CPC Class Codes: B81B 1/00 Devices without movable or flexible elements, e.g. microcapillary devices
• CPC Class Codes: B81B 2201/058 Microfluidics not provided for in B81B2201/051 - B81B2201/054
• CPC Class Codes: F04C 2/18 with similar tooth forms F04C2/16 takes precedence
• CPC Class Codes: Y10T 137/6606 With electric heating element
• CPC Class Codes: Y10T 137/8593 Systems
• CPC Class Codes: Y10T 29/49826 : Assembling or joining

Abstract

A microfluidic device having a glass, glass-ceramic, or ceramic structure, said structure including one or more passages defined therein with at least one first passage accessible through at least one first port wherein the first passage contains at least one solid object disposed therein said solid object including a material having a coefficient of thermal expansion differeing from the glass, glass-ceramic, or ceramic of said structure, said solid object resting in said first passage substantially without compressive stress from an inside surface of said passage at room temperature.

Claims

1. A microfluidic device comprising:

a glass, glass-ceramic, or ceramic structure, said structure including one or more passages defined therein;

at least one first passage accessible through at least one first port;

wherein said first passage contains at least one solid object disposed therein, said solid object including a material having a coefficient of thermal expansion differeing from the glass, glass-ceramic, or ceramic of said structure, said solid object resting in said first passage substantially without compressive stress from an inside surface of said passage at room temperature.

2. The device according to claim 1 wherein the solid object comprises metal.

3. The device according to either claim 1 or claim 2 wherein the solid object is an extended tortuously shaped solid object and said first passage is a correspondingly shaped passage.

4. The device accordingly to any of claims 1-3 wherein said solid object comprises a resistance heater.

5. The device according to any of claims 1-4 wherein said solid object comprises a thermocouple.

6. The device according to any of claims 1-5 wherein said first passage within which said solid object is disposed includes a thermally conductive material disposed therein.

7. The device according to claim 6 wherein the thermally conductive material is a thermally conductive fluid, gel or paste.

8. The device according to either of claims 6 and 7 wherein said thermally conductive material is sealed in said first passage by pressure-relieving seals.

9. The device according to any of claims 1-8 wherein said solid object rests in said first passage substantially without compressive stress from the inside surface of said passage throughout an operating temperature range of said device including room temperature.

10. The device according to any of claims 1-9 wherein said solid object rests in said first passage substantially without compressive stress from the inside surface of said passage at room temperature but contacts the inside surface of said passage upon heating of said object.

11. The device according to any of claims 1-10 further comprising a second passage accessible through a fluidic entrance port and a fluidic exit port.

12. The device according to claim 11 wherein the first and second passages are not in fluid communication one with another within the device.

13. The device according to either claim 1 or claim 2 wherein the first port is a first fluid port such that the solid object is positioned so as to be in contact with such fluid as may be flowed into said first port during use of the microfluidic device.

14. The device according to claim 13 wherein the solid object comprises two mating gears adapted for pumping or flow measurement or the like.

15. The device according to any of claims 1-14 wherein said first passage is comprised of consolidated frit positioned and arranged between two or more substrates.

16. A method of making a microfluidic device comprising glass, glass-ceramic, or ceramic and having a solid structure incorporated therein having a thermal expansion coefficient differing from said glass, glass-ceramic, or ceramic, the method comprising:

providing a solid structure for incorporation into a microfluidic device;

forming, in a glass, glass-ceramic, or ceramic material, an open-ceiling passage;

positioning said solid structure in said passage;

enclosing said solid structure within said passage so as to form an enclosed passage within said device containing said solid structure.

17. The method according to claim 16 wherein the step of providing a solid structure comprises providing a solid structure comprising metal.

18. The method according to either claim 16 or claim 17 wherein providing said solid structure further comprises providing an extended tortuous solid structure.

19. The method according to claim 18 wherein the step of forming an open-ceiling passage comprises forming an extended tortuous passage having a shape corresponding to said extended tortuous structure.

20. The method according to either claim 16 or claim 17 wherein the step of positioning said solid structure in said passage comprises positioning said solid structure in a passage structured and arranged to receive fluids during us of the device.