METHOD OF TEACHING EYEPOINTS FOR WIRE BONDING AND RELATED SEMICONDUCTOR PROCESSING OPERATIONS
First Claim
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1. A method of teaching an eyepoint for a wire bonding operation, the method comprising the steps of:
- (1) selecting a group of shapes from a region of a semiconductor device for use as an eyepoint; and
(2) teaching the eyepoint to a wire bonding machine using at least one of (a) a sample semiconductor device, or (b) predetermined data related to the semiconductor device, the teaching step including defining locations of each of the shapes with respect to one another.
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Abstract
A method of teaching an eyepoint for a wire bonding operation is provided. The method includes (1) selecting a group of shapes from a region of a semiconductor device for use as an eyepoint, and (2) teaching the eyepoint to a wire bonding machine using at least one of (a) a sample semiconductor device, or (b) predetermined data related to the semiconductor device. The teaching step includes defining locations of each of the shapes with respect to one another.
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Citations
21 Claims
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1. A method of teaching an eyepoint for a wire bonding operation, the method comprising the steps of:
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(1) selecting a group of shapes from a region of a semiconductor device for use as an eyepoint; and (2) teaching the eyepoint to a wire bonding machine using at least one of (a) a sample semiconductor device, or (b) predetermined data related to the semiconductor device, the teaching step including defining locations of each of the shapes with respect to one another. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method of operating a wire bonding machine, the method comprising the steps of:
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(1) selecting a group of shapes from a region of a semiconductor device for use as an eyepoint; (2) teaching the eyepoint to the wire bonding machine using at least one of (a) a sample semiconductor device, or (b) predetermined data related to the semiconductor device, the teaching step including defining locations of each of the shapes with respect to one another; (3) indexing a first semiconductor device configured to be wire bonded into a predetermined position of the wire bonding machine; and (4) scanning selected portions of the first semiconductor device using a vision system of the wire bonding machine, the selected portions corresponding to the taught eyepoint. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21)
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Specification