LIGHT EMITTING DEVICES WITH PHOSPHOR WAVELENGTH CONVERSION AND METHODS OF MANUFACTURE THEREOF

• US 20100181582A1
• Filed: 01/19/2010
• Published: 07/22/2010
• Est. Priority Date: 01/22/2009
• Status: Abandoned Application

• Current Assignee: Intematix Corporation
• Original Assignee: Intematix Corporation
• Inventors: Melman, Jonathan, Collier, Ian, Li, Yi-Qun
• Application Number:
  US12/689,449
• Publication Number:
  US 20100181582A1
• Time in Patent Office: Days
• US Class Current: 257/91
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2933/0041 relating to wavelength conversion elements
• CPC Class Codes: H01L 2933/005 relating to encapsulations
• CPC Class Codes: H01L 33/44 characterised by the coatings, e.g. passivation layer or anti-reflective coating
• CPC Class Codes: H01L 33/501 characterised by the materials, e.g. binder
• CPC Class Codes: H01L 33/54 having a particular shape

Abstract

A light emitting device comprises: a package (low temperature co-fired ceramic) having a plurality of recesses (cups) in which each recess houses at least one LED chip and at least one phosphor material applied as coating to the light emitting light surface of the LED chips, wherein the phosphor material coating is conformal in form. In another arrangement a light emitting device comprises: a planar substrate (metal core printed circuit board); a plurality of light emitting diode chips mounted on, and electrically connected to, the substrate; a conformal coating of at least one phosphor material on each light emitting diode chip; and a lens formed over each light emitting diode chip.

Claims

1. A light emitting device comprising:

a) a package having a plurality of light reflective recesses in which each recess houses at least one light emitting diode chip and

b) at least one phosphor material applied as coating to the light emitting surface of the light emitting diode chips, wherein the phosphor material coating is conformal in form.

2. The device according to claim 1, wherein the package is selected from the group consisting of:

a high temperature polymer package, a ceramic package and a low temperature co-fired ceramic package.

3. The device according to claim 1, wherein the wall of each recess is inclined such as to promote the emission of light from the device.

4. The device according to claim 1, wherein the phosphor coating is of a thickness in a range 20 μ

m to 200 μ

m.

5. The device according to claim 1, wherein the phosphor coating comprises a mixture of at least one phosphor material and a light transmissive polymer material and wherein a weight loading of the at least one phosphor material to polymer material is in a range 50 to 99 parts per 100.

6. A method of manufacturing the device according to claim 1 comprising:

a mold having a plurality of projections that are configured to fit into a respective recess wherein each projection has an aperture configured to surround the respective at least one light emitting diode chip, the method comprising;

a) positioning the mold on the package such that each aperture overlies a respective light emitting diode chip;

b) filling each cell with a pre-selected volume of a mixture of at least one phosphor material and a light transmissive polymer material;

c) at least partially curing the polymer material; and

d) removing the mold.

7. The method according to claim 6, and further comprising an insert having a plurality of projections that are configured to fit in a respective aperture of the mold and to limit the volume of each aperture to a preselected volume, the method further comprising inserting the insert in the mold, filling each aperture with the phosphor/polymer mixture and removing the mold insert such as to allow the phosphor/polymer mixture to drain from the insert into its respective aperture.

8. The method according to claim 6, wherein the mold further comprises radial fins extending from one or more of the projections, the fins being configured to enable the mold to be accurately positioned relative to the package.

9. The method according to claim 6, and further comprising applying a release agent to surfaces of the mold and/or insert.

10. The method according to claim 9, wherein the release agent is selected from the group consisting of a hydrophilic material and a polyvinyl alcohol.

11. The method according to claim 1, wherein the polymer material is thermally curable and comprising in c) heating the mold and/or mold/package assembly.

12. The method according to claim 6, wherein the polymer material is ultraviolet curable and the mold comprises a material which is substantially transmissive to ultraviolet radiation and comprising in c) irradiating the phosphor/polymer mixture with ultraviolet radiation through the mold.

13. The method according to claim 6, wherein the mold comprises a material selected from the group consisting of:

a metal, a glass, a polymer, a polycarbonate, an acrylic, a silicone, an epoxy and PTFE.

14. A light emitting device comprising:

(a) a substantially planar substrate;

(b) a plurality of light emitting diode chips mounted on, and electrically connected to, the substrate;

(c) a conformal coating of at least one phosphor material on each light emitting diode chip; and

(d) a lens formed over each light emitting diode chip.

15. The device according to claim 14, wherein the substrate is selected from the group consisting of:

a metal core printed circuit board, a printed circuit board and a ceramic circuit board.

16. The device according to claim 14, wherein the phosphor coating is of a thickness in a range 20 μ

m to 200 μ

m.

17. The device according to claim 14, wherein the phosphor coating comprises a mixture of at least one phosphor material and a light transmissive polymer material and wherein a weight loading of the at least one phosphor material to polymer material is in a range 50 to 99 parts per 100.

18. A method of manufacturing the device according to claim 14 comprising:

a) mounting the plurality of light emitting diode chips on the substrate;

b) providing a first mold having a respective aperture corresponding to each light emitting diode chip;

c) positioning the first mold on the substrate such that each aperture overlies a respective light emitting diode chip;

d) filling each cell with a mixture of the at least one phosphor material and a light transmissive polymer material;

e) at least partially curing the polymer;

f) removing the first mold;

g) providing a second mold having a respective open cell corresponding to each light emitting diode chip, each cell being configured in the form of a lens;

h) filling each cell with a light transmissive polymer material;

i) positioning the substrate on the second mold such that each light emitting diode chip is located within a respective cell;

j) at least partially curing the light transmissive polymer material;

k) removing the second mold.

19. The method according to claim 18, and further comprising applying a release agent to surfaces of the first and/or second molds.

20. The method according to claim 19, wherein the release agent is selected from the group consisting of a hydrophilic material and a polyvinyl alcohol.

21. The method according to claim 18, wherein the first and/or second molds further comprise a coating of non-stick material.

22. The method according to claim 21, wherein the non-stick material comprises a PTFE.

23. The method according to claim 18, wherein the polymer material is thermally curable and comprising heating the first and/or second molds.

24. The method according to claim 18, wherein the polymer material is ultraviolet curable and the first and/or second molds comprise a material which is substantially transmissive to ultraviolet radiation and comprising in e) and/or j) irradiating the polymer mixture with ultraviolet radiation through the first and/or second mold.

25. The method according to claim 18, wherein the first and/or second mold is resiliently deformable to thereby aid its removal.

26. The method according to claim 18, wherein the first and/or second molds comprise a material selected from the group consisting of a metal, a glass, a polymer, a polycarbonate, an acrylic, a silicone, an epoxy and PTFE.

27. The method according to claim 18, wherein the polymer material is selected from the group consisting of:

silicone and an epoxy.

28. The method according to claim 18, and further comprising inter-cooperating features on the substrate and first and/or second molds for positioning the molds on the substrate.

29. A method of manufacturing the device according to claim 14 comprising a light transmissive cover having on a first face a respective lens corresponding to each light emitting diode chip and on an opposite planar face an open cell corresponding to each light emitting diode chip, the method comprising:

a) mounting a plurality of light emitting diode chips on the substrate;

b) filling each cell with a mixture of the at least one phosphor material and a light transmissive polymer material;

c) positioning the substrate on the mold such that each light emitting diode chip is within a respective cell; and

d) at least partially curing the polymer material.