NONVOLATILE MEMORY CELL COMPRISING A REDUCED HEIGHT VERTICAL DIODE
First Claim
Patent Images
1. A nonvolatile memory cell comprising:
- a rail-shaped first conductor formed at a first height above a substrate;
a rail-shaped second conductor formed above the first conductor; and
a vertically oriented first pillar comprising a p-i-n first diode,wherein the first pillar is disposed between the second conductor and the first conductor;
wherein the first diode comprises an intrinsic or lightly doped region; and
wherein the intrinsic or lightly doped region has a first thickness of about 300 angstroms or greater.
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Abstract
A nonvolatile memory cell includes: a rail-shaped first conductor formed at a first height above a substrate; a rail-shaped second conductor formed above the first conductor; and a vertically oriented first pillar comprising a p-i-n first diode; wherein the first pillar is disposed between the second conductor and the first conductor; wherein the first diode comprises an intrinsic or lightly doped region; and wherein the intrinsic or lightly doped region has a first thickness of about 300 angstroms or greater. Numerous additional aspects are provided.
74 Citations
55 Claims
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1. A nonvolatile memory cell comprising:
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a rail-shaped first conductor formed at a first height above a substrate; a rail-shaped second conductor formed above the first conductor; and a vertically oriented first pillar comprising a p-i-n first diode, wherein the first pillar is disposed between the second conductor and the first conductor; wherein the first diode comprises an intrinsic or lightly doped region; and wherein the intrinsic or lightly doped region has a first thickness of about 300 angstroms or greater. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24)
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25. A monolithic three dimensional memory array comprising:
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i) a first memory level, the first memory level comprising; a) a plurality of substantially parallel, substantially coplanar first conductors formed above a substrate; b) a plurality of substantially parallel, substantially coplanar second conductors formed above the first conductors; and c) a plurality of vertically oriented first junction diodes; wherein each first junction diode is disposed between one of the plurality of substantially parallel, substantially coplanar first conductors and one of the plurality of substantially parallel, substantially coplanar second conductors; wherein the first junction diodes have a first height between about 500 angstroms and about 3500 angstroms; and ii) at least a second memory level monolithically formed on the first memory level. - View Dependent Claims (26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46)
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47. A method for forming a nonvolatile memory cell, the method comprising:
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forming a rail-shaped first conductor above a substrate; forming a rail-shaped second conductor above the first conductor; and forming a substantially vertical first pillar disposed between the first conductor and the second conductor, wherein the first pillar comprises a vertically oriented p-i-n diode, and the p-i-n diode comprises; a) a bottom heavily doped region having a first conductivity type, b) a middle intrinsic or lightly doped region, and c) a top heavily doped region having a second conductivity type opposite the first conductivity type, wherein the bottom heavily doped region is doped by implantation of arsenic ions and the top heavily doped region is doped by implantation of BF2 ions. - View Dependent Claims (48, 49, 50, 51)
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52. A method for forming a monolithic three dimensional memory array, the method comprising:
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forming a plurality of substantially parallel, substantially coplanar rail-shaped first conductors above a substrate; forming a plurality of substantially parallel, substantially coplanar rail-shaped second conductors above the first conductors; and forming a plurality of substantially vertical first pillars; wherein each first pillar is disposed between one of the first conductors and one of the second conductors; wherein each of the first pillars comprises a vertically oriented p-i-n diode; and wherein each p-i-n diode comprises; a) a bottom heavily doped region having a first conductivity type; b) a middle intrinsic or lightly doped region; and c) a top heavily doped region having a second conductivity type opposite the first conductivity type; wherein the bottom heavily doped region is doped by implantation of arsenic ions and the top heavily doped region is doped by implantation of BF2 ions. - View Dependent Claims (53, 54, 55)
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Specification