MINIATURE MEMS CONDENSER MICROPHONE PACKAGES AND FABRICATION METHOD THEREOF
First Claim
1. A MEMS microphone package, comprising:
- a cavity enclosed by a top cover part, wherein a housing wall part surrounds and supports the top cover part, and a substrate supports the housing wall part and the cover part;
a MEMS sensing element and an IC chip disposed inside the cavity;
an opening comprising an acoustic passage connecting the cavity to an ambient space; and
a conductive casing enclosing the top cover part and the housing wall,wherein the conductive casing is soldered to a PCB board and is electrically connected to a common analog ground lead on the PCB board.
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Accused Products
Abstract
MEMS microphone packages and fabrication methods thereof are disclosed. A MEMS microphone package includes a cavity that houses a MEMS sensing element, an IC chip and other passive elements supported by a common substrate. The cavity is formed by a top cover member, a housing wall surrounds and supports the top cover member and the common substrate supports the housing wall. A conductive casing encloses and surrounds the cavity, and is electrically connected to a common analog ground lead on a PCB board. The top cover member and the housing wall are non-conductive. And the conductive casing is not connected directly to the ground leads of the package. An acoustic absorption layer is sandwiched between the conductive casing and the cavity which is formed by the top cover member, the housing wall and the substrate.
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Citations
26 Claims
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1. A MEMS microphone package, comprising:
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a cavity enclosed by a top cover part, wherein a housing wall part surrounds and supports the top cover part, and a substrate supports the housing wall part and the cover part; a MEMS sensing element and an IC chip disposed inside the cavity; an opening comprising an acoustic passage connecting the cavity to an ambient space; and a conductive casing enclosing the top cover part and the housing wall, wherein the conductive casing is soldered to a PCB board and is electrically connected to a common analog ground lead on the PCB board. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A method for fabricating a MEMS microphone package, comprising:
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providing a substrate; forming a cavity enclosed by a top cover part, wherein a housing wall part surrounds and supports the top cover part, and the substrate supports the housing wall part and the cover part; forming a MEMS sensing element and an IC chip inside the cavity; forming an opening comprising an acoustic passage connecting the cavity to an ambient space; and forming a conductive casing enclosing the top cover part and the housing wall, wherein the conductive casing is soldered to a PCB board and is electrically connected to a common analog ground lead on the PCB board. - View Dependent Claims (15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26)
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Specification