METHOD OF TRANSFERRING A DEVICE AND METHOD OF MANUFACTURING A DISPLAY APPARATUS

• US 20100186883A1
• Filed: 12/28/2009
• Published: 07/29/2010
• Est. Priority Date: 01/29/2009
• Status: Abandoned Application

• Current Assignee: Sony Corporation (Sony Group Corp.)
• Original Assignee: Sony Corporation (Sony Group Corp.)
• Inventors: TOMODA, Katsuhiro
• Application Number:
  US12/647,826
• Publication Number:
  US 20100186883A1
• Time in Patent Office: Days
• US Class Current: 156/220
• CPC Class Codes: H01L 2224/04105 Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
• CPC Class Codes: H01L 2224/73267 Layer and HDI connectors
• CPC Class Codes: H01L 2224/92244 the second connecting process involving a build-up interconnect
• CPC Class Codes: H01L 24/19 Manufacturing methods of high density interconnect preforms
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 27/1214 comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
• CPC Class Codes: H01L 27/1266 the substrate on which the devices are formed not being the final device substrate, e.g. using a temporary substrate
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/15788 Glasses, e.g. amorphous oxides, nitrides or fluorides
• CPC Class Codes: H01L 33/0093 Wafer bonding; Removal of the growth substrate
• CPC Class Codes: Y10T 156/1041 Subsequent to lamination

Abstract

A method of transferring a device includes: arranging a release layer and a device in the stated lamination order on a first substrate having light transmitting property via a bonding layer having light transmitting property; arranging an adhesive layer formed on a second substrate so that the adhesive layer is opposed to a surface of the first substrate on which the device is arranged; and ablating the release layer by performing light irradiation on the release layer from the first substrate side and transferring the device onto the second substrate with the bonding layer being left on the first substrate.

Claims

1. A method of transferring a device, comprising:

arranging a release layer and a device in the stated lamination order on a first substrate having light transmitting property via a bonding layer having light transmitting property;

arranging an adhesive layer formed on a second substrate so that the adhesive layer is opposed to a surface of the first substrate on which the device is arranged; and

ablating the release layer by performing light irradiation onto the release layer from the first substrate side and transferring the device onto the second substrate with the bonding layer being left on the first substrate.

2. The method of transferring a device according to claim 1,

wherein the release layer is formed of a resin material, and

wherein the light irradiation is performed at energy by which the release layer is completely ablated.

3. The method of transferring a device according to claim 1,

wherein the bonding layer is formed of one of a material containing at least one of fluorine (F) and silicon (Si) and that formed of an ionomer resin, and

wherein the light irradiation is performed using a pulse laser beam having a wavelength of 450 nm or less.

4. The method of transferring a device according to claim 1,

wherein an interface of the device on the release layer side includes an electrode formed of a metal material, and

wherein the electrode functions as a photothermal conversion layer in the light irradiation.

5. A method of manufacturing a display apparatus, comprising:

arranging a release layer and a light emitting device in the stated lamination order on a first substrate having light transmitting property via a bonding layer having light transmitting property;

arranging an adhesive layer formed on a second substrate so that the adhesive layer is opposed to a surface of the first substrate on which the light emitting device is arranged; and

ablating the release layer by performing light irradiation on the release layer from the first substrate side and transferring the light emitting device onto the second substrate with the bonding layer being left on the first substrate.