RETICLE ERROR REDUCTION BY COOLING

• US 20100186942A1
• Filed: 12/21/2009
• Published: 07/29/2010
• Est. Priority Date: 01/23/2009
• Status: Abandoned Application

• Current Assignee: Nikon Corporation
• Original Assignee: Nikon Corporation
• Inventors: Uehara, Yusaku, Yoshimoto, Hiromitsu, Kato, Noriya, Watson, Douglas C., Phillips, Alton H., Kho, Leonard Wai Fung
• Application Number:
  US12/643,932
• Publication Number:
  US 20100186942A1
• Time in Patent Office: Days
• US Class Current: 165/253
• CPC Class Codes: F25B 21/02 using Peltier effect; using Nernst-Ettinghausen effect
• CPC Class Codes: F28F 3/12 Elements constructed in the shape of a hollow panel, e.g. with channels F28D1/02, F28D1/03 take precedence
• CPC Class Codes: G03B 27/52 Details

Abstract

Methods and apparatus for cooling a reticle are disclosed. According to one aspect of the present invention, an apparatus for providing top side cooling to a reticle includes a heat exchanger arrangement and an actuator. The heat exchanger arrangement includes a first surface arranged to facilitate heat transfer between the reticle and the heat exchanger arrangement. The heat transfer provides cooling to at least some portions of the reticle. The actuator positions the first surface of the heat exchanger arrangement at a distance over the reticle.

Claims

1. An apparatus for providing top side cooling to a reticle, the apparatus comprising:

a heat exchanger arrangement, the heat exchanger arrangement including a first surface, the first surface being arranged to facilitate heat transfer between the reticle and the heat exchanger arrangement, the heat transfer being arranged to cool at least some portions of the reticle; and

an actuator, the actuator being arranged to position the first surface of the heat exchanger arrangement at a distance over the reticle.

2. The apparatus of claim 1 wherein the heat exchanger arrangement includes a heat exchanger and a removable adapter plate, the removable adapter plate including the first surface.

3. The apparatus of claim 2 wherein the reticle includes a mask pattern having a pattern size, and wherein the removable adapter plate has a plate size, the plate size being approximately equal to the pattern size.

4. The apparatus of claim 3 wherein the adapter plate includes an array of protrusions and recesses arranged to affect a relative amount of cooling in individual zones.

5. The apparatus of claim 2 wherein the heat exchanger is a copper heat exchanger.

6. The apparatus of claim 1 wherein the heat exchanger arrangement includes a heat exchanger, a resistive heater array, and a controller arrangement, the resistive heater array being arranged to define the first surface, the controller arrangement being arranged to control the resistive heater array.

7. The apparatus of claim 6 wherein the resistive heater array includes a plurality of individually controlled zones and the controller arrangement is arranged to individually control each individually controlled zone of the plurality of individually controlled zones.

8. The apparatus of claim 7 wherein the plurality of individually controlled zones each includes an associated resistive element, and wherein each individually controlled zone of the plurality of individually controlled zones is arranged to be individually heated.

9. The apparatus of claim 8 wherein the plurality of individually controlled zones each includes a thermistor.

10. The apparatus of claim 1 wherein the heat exchanger arrangement includes a heat exchanger, at least one thermoelectric module (TEM), and a controller arrangement, the at least one TEM being arranged to define the first surface, the controller arrangement being arranged to control the at least one TEM.

11. The apparatus of claim 10 wherein the at least on TEM is an array of TEMS, and wherein each TEM of the array of TEMS is arranged to be individually controlled by the controller arrangement.

12. The apparatus of claim 11 wherein each TEM of the array of TEMS includes a thermistor.

13. The apparatus of claim 11 wherein each TEM of the array of TEMS is arranged to be individually heated and individually cooled relative to a temperature of the heat exchanger arrangement.

14. A stage apparatus comprising the apparatus of claim 1

15. An exposure apparatus comprising the stage apparatus of claim 14.

16. A wafer formed using the exposure apparatus of claim 15.

17. A cooling device suitable for providing top side cooling to a reticle, the cooling device comprising:

a heat exchanger, the heat exchanger being arranged to absorb heat associated with the reticle;

a sensing arrangement, the sensing arrangement being configured to obtain at least one temperature; and

a heating arrangement, the heating arrangement being coupled to the heat exchanger, the heating arrangement having a plurality of heating elements and a first arrangement, the first arrangement being arranged to individually control each heating element of the plurality of heating elements based on the at least one temperature.

18. The cooling device of claim 17 wherein the plurality of heating elements is a plurality of resistive heaters.

19. The cooling device of claim 18 wherein each resistive heater of the plurality of resistive heaters is arranged to be activated to compensate for cooling provided by the heat exchanger.

20. The cooling device of claim 17 wherein the heat exchanger is a liquid cooled heat exchanger.

21. The cooling device of claim 17 wherein the plurality of heating elements is a plurality of thermoelectric modules (TEMs).

22. The cooling device of claim 21 wherein each TEM of the plurality of TEMs is arranged to be activated to compensate for cooling provided by the heat exchanger.

23. The cooling device of claim 22 wherein the plurality of TEMs include a plurality of thermistors.

24. The cooling device of claim 20 wherein each TEM of the plurality of TEMs includes at least one sensor arranged to obtain temperature information associated with a cooling surface associated with the heating arrangement.

25. A stage apparatus comprising the cooling device of claim 17.

26. An exposure apparatus comprising the stage apparatus of claim 25.

27. A wafer formed using the exposure apparatus of claim 26.

34. The cooling device of claim 18 wherein each resistive heater of the plurality of resistive heaters is further arranged to be activated to distort the reticle to compensate for lens distortion.

35. The cooling device of claim 18 wherein each resistive heater of the plurality of resistive heaters is further arranged to be activated to distort the reticle to improve overlay associated with the reticle.

28. A method for cooling a reticle, the method comprising:

identifying at least one zone associated with the reticle;

determining if a temperature associated with the at least one zone indicates that the at least one zone is to be cooled;

activating a first heating element associated with the at least one zone if it is determined that the at least one zone is not to be cooled, wherein activating the first heating element compensates for cooling provided by a heat exchanger; and

cooling the at least one zone using the heat exchanger if it is determined that the at least one zone is to be cooled.

29. The method of claim 28 wherein the first heating element is included in an array of heating elements, the array of heating elements and the heat exchanger being associated with a top side cooling device, the method further including:

positioning the top side cooling device at a distance over a top surface of the reticle, wherein positioning the top side cooling device at the distance over the top surface of the reticle includes maintaining a gap between the top side cooling device and the top surface of the reticle.

30. The method of claim 29 wherein the first heating element is a resistive heating element.

31. The method of claim 29 wherein the first heating element is a thermoelectric chip (TEC).

32. The method of claim 29 wherein determining if a temperature associated with the at least one zone indicates that the at least one zone is to be cooled includes determining the temperature in the gap that is associated with the at least one zone.

33. The method of claim 28 wherein activating the first heating element associated with the at least one zone if it is determined that the at least one zone is not to be cooled includes activating the first heating element to a first temperature, and wherein cooling the at least one zone using the heat exchanger if it is determined that the at least one zone is to be cooled includes activating the first heating element to a second temperature, the first temperature being higher than the second temperature.