METHOD OF ATTACHING DIE USING SELF-ASSEMBLING MONOLAYER AND PACKAGE SUBSTRATE INCLUDING DIE ATTACHED THERETO USING SELF-ASSEMBLING MONOLAYER

• US 20100187002A1
• Filed: 04/15/2009
• Published: 07/29/2010
• Est. Priority Date: 01/29/2009
• Status: Active Grant

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: Yim, Soon Gyu, Han, Jong Woo, Lee, Seung Seoup
• Granted Patent: US 8,656,582 B2
• Time in Patent Office: Days
• US Class Current: 174/260
• CPC Class Codes: H01L 2224/83193 wherein the layer connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/838 Bonding techniques
• CPC Class Codes: H01L 2224/95085 being a liquid, e.g. for fluidic self-assembly
• CPC Class Codes: H01L 2224/95146 by surface tension
• CPC Class Codes: H01L 2224/95147 by molecular lock-key, e.g. by DNA
• CPC Class Codes: H01L 24/29 of an individual layer connector
• CPC Class Codes: H01L 24/32 of an individual layer connector
• CPC Class Codes: H01L 24/75 Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 24/95 at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
• CPC Class Codes: H01L 25/0655 the devices being arranged next to each other
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01015 Phosphorus [P]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01047 Silver [Ag]
• CPC Class Codes: H01L 2924/01074 Tungsten [W]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: Y10T 156/10 : Methods of surface bonding and/or assembly therefor
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

Disclosed herein are a method of attaching a die using a self-assembling monolayer and a package substrate including a die attached thereto using a self-assembling monolayer. A first self-assembling monolayer formed on a die and a second self-assembling monolayer formed on a substrate are provided with the same hydrophilic or hydrophobic functional group, so that the die is attached to the substrate using an attractive force acting between the first and second self-assembling monolayers. An accuracy of alignment between the die and the substrate can be improved by the simple solution.

Claims

1. A method of attaching a die using a self-assembling monolayer, comprising:

(A) forming a first self-assembling monolayer on one side of a die including a pad on the other side;

(B) forming a second self-assembling monolayer on a die attach region on a substrate; and

(C) picking up the die using a pickup head, and transferring the die to the die attach region of the substrate so that the die is automatically aligned with the substrate using an attractive force acting between the first and second self-assembling monolayers.

2. The method according to claim 1, wherein the first and second self-assembling monolayers have a hydrophilic or hydrophobic functional group.

3. The method according to claim 2, wherein, in the (C), the alignment between the die and the substrate is executed by the attractive force acting between the first and second self-assembling monolayers having the same functional group.

4. The method according to claim 1, wherein the (A) comprises:

(A1) forming an insulating film on the one side of the die including the pad on the other side; and

(A2) forming the first self-assembling monolayer on the insulating film.

5. The method according to claim 1, wherein the (B) comprises:

(B1) coating a surface of a transfer stamp with a self-assembling molecule;

(B2) applying a gold (Au) thin film on the substrate; and

(B3) bringing the transfer stamp into contact with the substrate through a contact printing process thus forming the second self-assembling monolayer.

6. The method according to claim 5, wherein, in the (B1), the transfer stamp is made of silicon rubber or polydimethylsiloxane.

7. The method according to claim 1, wherein the (B) comprises:

(B1) applying a gold (Au) thin film on the die attach region of the substrate; and

(B2) dipping the substrate into a solution which is prepared by dissolving self-assembling molecules such as alkane thiol in ethanol solvent, so that the second self-assembling monolayer is formed on the gold (Au) thin film on the substrate.

8. The method according to claim 1, wherein the (C) comprises:

(C1) disposing the substrate in a solution contained in an alignment chamber;

(C2) picking up the die in a face-up manner using a pickup head and transferring the die into the alignment chamber; and

(C3) automatically aligning the die with the substrate using the attractive force acting between the first and second self-assembling monolayers having a hydrophobic functional group.

9. The method according to claim 8, wherein, in the (C2), the die is transferred near the second self-assembling monolayer on the substrate using the pickup head.

10. The method according to claim 1, wherein the (C) comprises:

(C1) forming a solution drop on the second self-assembling monolayer on the substrate;

(C2) picking up the die in a face-up manner using the pickup head and transferring the die into the solution drop; and

(C3) automatically aligning the die with the substrate using an attractive force acting between the first and second self-assembling monolayers having a hydrophilic functional group.

11. The method according to claim 10, wherein, in the (C1), the solution drop is a water drop.

12. A package substrate including a die attached thereto using a self-assembling monolayer, the package substrate comprising:

a die including a pad on one side thereof and a first self-assembling monolayer on the other side thereof; and

a substrate including a second self-assembling monolayer on a die attach region thereof,

wherein the die is attached to and mounted on the substrate using an attractive force acting between the first and second self-assembling monolayers.

13. The package substrate according to claim 12, wherein an insulating film is applied to the other side of the die, and the first self-assembling monolayer is formed on the insulating film.

14. The package substrate according to claim 12, wherein a gold (Au) thin film is applied to the die attach region of the substrate, and the second self-assembling monolayer is formed on the gold (Au) thin film.

15. The package substrate according to claim 12, wherein the first and second self-assembling monolayers have the same hydrophilic or hydrophobic functional group.