Microfabricated Elastomeric Valve And Pump Systems

• US 20100187105A1
• Filed: 09/09/2009
• Published: 07/29/2010
• Est. Priority Date: 06/28/1999
• Status: Active Grant

• Current Assignee: California Institute of Technology
• Original Assignee: California Institute of Technology
• Inventors: Unger, Marc A., Chou, Hou-Pu, Scherer, Axel, Quake, Stephen R., Thorsen, Todd A.
• Granted Patent: US 8,124,218 B2
• Time in Patent Office: Days
• US Class Current: 204/400
• CPC Class Codes: B01J 2219/00355 peristaltic
• CPC Class Codes: B01J 2219/00378 Piezoelectric or ink jet dispensers
• CPC Class Codes: B01J 2219/00396 Membrane valves
• CPC Class Codes: B01J 2219/00398 in multiple arrangements
• CPC Class Codes: B01J 2219/00439 using micromirror arrays
• CPC Class Codes: B01J 2219/005 Beads
• CPC Class Codes: B01J 2219/00527 Sheets
• CPC Class Codes: B01J 2219/00605 the compounds being directly bound or immobilised to solid supports
• CPC Class Codes: B01J 2219/00612 the surface being inorganic
• CPC Class Codes: B01J 2219/00659 Two-dimensional arrays
• CPC Class Codes: B01J 2219/00707 separated from the reactor apparatus
• CPC Class Codes: B01J 2219/00722 Nucleotides
• CPC Class Codes: B01J 2219/00725 Peptides
• CPC Class Codes: B01L 2200/025 Align devices or objects to ensure defined positions relative to each other
• CPC Class Codes: B01L 2200/027 for microfluidic devices
• CPC Class Codes: B01L 2200/0605 Metering of fluids
• CPC Class Codes: B01L 2200/10 Integrating sample preparation and analysis in single entity, e.g. lab-on-a-chip concept
• CPC Class Codes: B01L 2300/0681 Filter
• CPC Class Codes: B01L 2300/0861 Configuration of multiple channels and/or chambers in a single devices
• CPC Class Codes: B01L 2300/0887 Laminated structure
• CPC Class Codes: B01L 2300/123 : Flexible; Elastomeric
• CPC Class Codes: B01L 2300/14 : Means for pressure control
• CPC Class Codes: B01L 2300/18 : Means for temperature control
• CPC Class Codes: B01L 2400/046 : Chemical or electrochemical formation of bubbles
• CPC Class Codes: B01L 2400/0481 : squeezing of channels or chambers
• CPC Class Codes: B01L 2400/0655 : pinch valves
• CPC Class Codes: B01L 2400/0688 : surface tension valves, capillary stop, capillary break
• CPC Class Codes: B01L 3/502707 : characterised by the manufacture of the container or its components by shaping or joining plastic parts B29C59/00, B29C65/00; by laminating B32B37/00; manufacture of microstructural devices in general B81C
• CPC Class Codes: B01L 3/50273 : characterised by the means or forces applied to move the fluids micropumps F04B19/006, of the membrane type F04B43/043
• CPC Class Codes: B01L 3/502738 : characterised by integrated valves microvalves F16K99/0001
• CPC Class Codes: B01L 7/54 : using spatial temperature gradients
• CPC Class Codes: B01L 9/527 : for microfluidic devices, e.g. used for lab-on-a-chip
• CPC Class Codes: B32B 2037/1081 : using a magnetic force
• CPC Class Codes: B32B 3/00 : Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
• CPC Class Codes: B81B 2201/036 : Micropumps
• CPC Class Codes: B81B 2201/054 : Microvalves
• CPC Class Codes: B81B 3/0032 : Structures for transforming energy not provided for in groups B81B3/0021 - B81B3/0029
• CPC Class Codes: B81B 3/0051 : For defining the movement, i.e. structures that guide or limit the movement of an element mechanical arrangements for preventing or damping vibration or shock H01H3/60
• CPC Class Codes: B81C 1/00119 : Arrangement of basic structures like cavities or channels, e.g. suitable for microfluidic systems
• CPC Class Codes: B81C 2201/019 : Bonding or gluing multiple substrate layers
• CPC Class Codes: C12Q 1/6874 : involving nucleic acid arrays, e.g. sequencing by hybridisation
• CPC Class Codes: C12Q 2535/125 : Allele specific primer extension
• CPC Class Codes: F04B 43/043 : Micropumps
• CPC Class Codes: F04B 43/14 : having plate-like flexible members
• CPC Class Codes: F15C 5/00 : Manufacture of fluid circuit elements; Manufacture of assemblages of such elements integrated circuits
• CPC Class Codes: F16K 2099/0074 : using photolithography, e.g. etching
• CPC Class Codes: F16K 2099/0076 : using electrical discharge machining [EDM], milling or drilling
• CPC Class Codes: F16K 2099/0078 : using moulding or stamping
• CPC Class Codes: F16K 2099/008 : Multi-layer fabrications
• CPC Class Codes: F16K 2099/0094 : Micropumps
• CPC Class Codes: F16K 99/0001 : Microvalves microdevices B81B1/00; manufacture or treatment of devices or systems in or on a substrate B81C1/00; microfluidic structures B01L3/5027; micropumps F04B19/006
• CPC Class Codes: F16K 99/0015 : Diaphragm or membrane valves
• CPC Class Codes: F16K 99/0046 : using magnets
• CPC Class Codes: F16K 99/0051 : using electrostatic means
• CPC Class Codes: F16K 99/0059 : actuated by a pilot fluid
• CPC Class Codes: Y10T 137/0491 : Valve or valve element assembling, disassembling, or replacing
• CPC Class Codes: Y10T 137/2224 : Structure of body of device
• CPC Class Codes: Y10T 137/87716 : For valve having a flexible diaphragm valving member
• CPC Class Codes: Y10T 137/87804 : Valve or deflector is tubular passageway
• CPC Class Codes: Y10T 137/87812 : Pivoted valve or deflector
• CPC Class Codes: Y10T 137/87893 : With fluid actuator
• CPC Class Codes: Y10T 156/10 : Methods of surface bonding and/or assembly therefor
• CPC Class Codes: Y10T 156/1002 : with permanent bending or reshaping or surface deformation of self sustaining lamina
• CPC Class Codes: Y10T 156/1064 : Partial cutting [e.g., grooving or incising]
• CPC Class Codes: Y10T 428/24479 : including variation in thickness
• CPC Class Codes: Y10T 428/2457 : Parallel ribs and/or grooves
• CPC Class Codes: Y10T 428/24612 : Composite web or sheet
• CPC Class Codes: Y10T 428/24744 : Longitudinal or transverse tubular cavity or cell

Abstract

A method of fabricating an elastomeric structure, comprising: forming a first elastomeric layer on top of a first micromachined mold, the first micromachined mold having a first raised protrusion which forms a first recess extending along a bottom surface of the first elastomeric layer; forming a second elastomeric layer on top of a second micromachined mold, the second micromachined mold having a second raised protrusion which forms a second recess extending along a bottom surface of the second elastomeric layer; bonding the bottom surface of the second elastomeric layer onto a top surface of the first elastomeric layer such that a control channel forms in the second recess between the first and second elastomeric layers; and positioning the first elastomeric layer on top of a planar substrate such that a flow channel forms in the first recess between the first elastomeric layer and the planar substrate.

Claims

1. A composite structure comprising:

a nonelastomer substrate having a surface bearing a first recess;

a flexible elastomer membrane with a Young'"'"'s Modulus between about 50 Pa and about 10 MPa overlying the non-elastomer substrate, the membrane able to be actuated into the first recess; and

a layer overlying the flexible elastomer membrane.

2. The composite structure of claim 1 wherein the layer comprises an elastomeric material.

3. The composite structure of claim 1 wherein the layer comprises a non-elastomeric material.

4. The composite structure of claim 1 wherein the layer defines a second recess overlying the membrane and crossing-over the first recess, such that a variation of a pressure in the channel causes the membrane to be actuated into the first recess.

5. The composite structure of claim 1 wherein the first recess comprises a channel.

6. A composite structure comprising:

an elastomer component with a Young'"'"'s Modulus between about 50 Pa and about 10 MPa including at least one of a recess and a flexible membrane portion; and

a substantially planar nonelastomer component sealed against the elastomer component, the nonelastomer component including an active device interacting with at least one of the membrane portion and a material present in the recess.

7. The composite structure of claim 6 wherein the active device is an optical structure selected from the group consisting of a photodiode, a fiber optic device, a fiber optic interconnect, a light emitting diode, a laser diode, vertical cavity surface emitting laser (VCSEL), a micromirror, a CMOS imaging array, a CCD camera, a waveguide, and a source or a receiver for visible, infrared, or ultraviolet regions of the electromagnetic spectrum.

8. The composite structure of claim 6 wherein the active device is an electronic structure selected from the group consisting of a resistor, a capacitor, a transistor, a chemical field effect transistor, a amperometric/coulometric electrochemical sensor, an accelerometer, a pressure sensor, a flow sensor, an electronic logic structure, a microprocessor, a chemical sensor, a strain gauge, an inductor, an actuator, a coil, a magnet, an electromagnet, a magnetic sensor, a radio frequency source, a radio frequency receiver, a microwave frequency source, a microwave frequency receiver, a radioactive particle counter, and an electrometer.

9. The composite structure of claim 6 wherein the active device is a thermal structure selected from the group consisting of a thermistor, a Peltier cooler, and a resistive heater.

10. The composite structure of claim 6 wherein the active device is an electrode that electrostatically drives the membrane portion into the recess.

11. A method of fabricating a composite structure comprising:

forming a recess in an elastomer component, wherein the elastomer component has a Young'"'"'s Modulus between about 50 Pa and about 10 MPa;

forming a substantially planar nonelastomer component including an active device; and

sealing the elastomer component against the nonelastomer component, such that the active device may interact with at least one of a flexible membrane portion of the elastomer component and a material present within the recess.

12. The method of claim 11 wherein the elastomer component is sealed against the elastomeric component by formation of a Van der Waals chemical bond.

13. The method of claim 11 wherein the elastomer component is placed against the non-elastomeric component with a liquid layer, and the liquid layer is then removed.

14. The method of claim 11 wherein the elastomer component is sealed against the nonelastomer component by formation of a covalent chemical bond.

15. The method of claim 11 wherein the elastomer component is sealed against the nonelastomer component by formation of an ionic chemical bond.

16. The method of claim 11 wherein the active device formed in the nonelastomer component is an optical structure selected from the group consisting of a photodiode, a fiber optic device, a fiber optic interconnect, a light emitting diode, a laser diode, vertical cavity surface emitting laser (VCSEL), a micromirror, a CMOS imaging array, a CCD camera, a waveguide, and a source or a receiver for visible, infrared, or ultraviolet regions of the electromagnetic spectrum.

17. The method of claim 11 wherein the active device formed in the nonelastomer component is an electronic structure selected from the group consisting of a resistor, a capacitor, a transistor, a chemical field effect transistor, a amperometric/coulometric electrochemical sensor, an accelerometer, a pressure sensor, a flow sensor, an electronic logic structure, a microprocessor, a chemical sensor, a strain gauge, an inductor, an actuator, a coil, a magnet, an electromagnet, a magnetic sensor, a radio frequency source, a radio frequency receiver, a microwave frequency source, a microwave frequency receiver, a radioactive particle counter, and an electrometer.

18. The method of claim 11 wherein the active device formed in the nonelastomeric component is a thermal structure selected from the group consisting of a thermistor, a Peltier cooler, and a resistive heater.

19. The method of claim 11 wherein the active device is formed in the nonelastomeric component by a technique selected from the group consisting of PCB technology, CMOS, surface micromachining, bulk micromachining, printable polymer electronics, Thin Film Transistor, and other amorphous/polycrystalline material techniques.

20. A method of microfabricating an elastomeric structure, the method comprising:

microfabricating a first elastomeric layer with a Young'"'"'s Modulus between about 50 Pa and about 10 MPa including a recess-bearing face and a non-recess-bearing face;

microfabricating a second elastomeric layer including a recess-bearing face and a non-recess-bearing face;

placing the first elastomeric layer against the second elastomeric layer; and

bonding the first elastomeric layer to the second elastomeric layer.

21. The method of claim 20 wherein the recess-bearing face of the second elastomeric layer is placed against the non-recess-bearing face of the first elastomeric layer.

22. The method of claim 20 wherein the recess-bearing face of the second elastomeric layer is placed against the recess-bearing face of the first elastomeric layer.

23. The method of claim 20 wherein the non-recess-bearing face of the second elastomeric layer is placed against the non-recess-bearing face of the first elastomeric layer.

24. A method of forming a composite structure comprising:

forming a recess in a first nonelastomer substrate;

filling the recess with a sacrificial material;

forming a thin coat of elastomer material with a Young'"'"'s Modulus between about 50 Pa and about 10 MPa over the nonelastomer substrate and the filled recess;

curing the elastomer to form a thin membrane; and

removing the sacrificial material.

25. The method of claim 24 further comprising forming a further elastomer structure over the thin membrane.

26. The method of claim 24 further comprising forming a second nonelastomer substrate over the thin membrane.

27. The method of claim 24 further comprising forming an active device in the first nonelastomer substrate, wherein the active device is an optical structure selected from the group consisting of a photodiode, a fiber optic device, a fiber optic interconnect, a light emitting diode, a laser diode, vertical cavity surface emitting laser (VCSEL), a micromirror, a CMOS imaging array, a CCD camera, a waveguide, and a source or a receiver for visible, infrared, or ultraviolet regions of the electromagnetic spectrum.

28. The method of claim 24 further comprising forming an active device in the first nonelastomer substrate, wherein the active device is an electronic structure selected from the group consisting of a resistor, a capacitor, a transistor, a chemical field effect transistor, a amperometric/coulometric electrochemical sensor, an accelerometer, a pressure sensor, a flow sensor, an electronic logic structure, a microprocessor, a chemical sensor, a strain gauge, an inductor, an actuator, a coil, a magnet, an electromagnet, a magnetic sensor, a radio frequency source, a radio frequency receiver, a microwave frequency source, a microwave frequency receiver, a radioactive particle counter, and an electrometer.

29. The method of claim 24 further comprising forming an active device in the first nonelastomer substrate, wherein the active device is a thermal structure selected from the group consisting of a thermistor, a Peltier cooler, and a resistive heater.

30. The method of claim 24 wherein an active device is formed in the nonelastomer substrate by a technique selected from the group consisting of PCB technology, CMOS, surface micromachining, bulk micromachining, printable polymer electronics, Thin Film Transistor, and other amorphous/polycrystalline material techniques.