Contacts in Semiconductor Devices
First Claim
Patent Images
1. A method of manufacturing a structural building block of a semiconductor device, the method comprising:
- coating a first photo resist layer over a substrate;
using a first mask, patterning the first photo resist layer thereby forming first features, the first mask comprising a first plurality of lines oriented in a first direction;
after patterning the first photo resist layer, coating a second photo resist layer;
using a second mask, patterning the second photo resist layer thereby forming second features, wherein the second mask comprises a second plurality of lines oriented in a second direction orthogonal to the first direction;
after patterning the second photo resist layer, coating a third photo resist layer; and
using a third mask, patterning the third photo resist layer thereby forming third features, wherein the first, the second, and the third features comprise a pattern for forming contact holes.
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Abstract
Mask sets, layout design, and methods for forming contacts in devices are described. In one embodiment, a semiconductor device includes a plurality of contacts disposed over a substrate, the plurality of contacts being disposed as rows and columns on an orthogonal grid, each row of the plurality of contacts is spaced from an neighboring row of the plurality of contacts by a first distance, and each column of the plurality of contacts is spaced from an neighboring column of the plurality of contacts by a second distance.
31 Citations
26 Claims
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1. A method of manufacturing a structural building block of a semiconductor device, the method comprising:
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coating a first photo resist layer over a substrate; using a first mask, patterning the first photo resist layer thereby forming first features, the first mask comprising a first plurality of lines oriented in a first direction; after patterning the first photo resist layer, coating a second photo resist layer; using a second mask, patterning the second photo resist layer thereby forming second features, wherein the second mask comprises a second plurality of lines oriented in a second direction orthogonal to the first direction; after patterning the second photo resist layer, coating a third photo resist layer; and using a third mask, patterning the third photo resist layer thereby forming third features, wherein the first, the second, and the third features comprise a pattern for forming contact holes. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A semiconductor device comprising:
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a first plurality of contacts disposed over a first region of a substrate, the first plurality of contacts being disposed as rows and columns on a first orthogonal grid, each row of the first plurality of contacts being spaced by a first distance, and each column of the first plurality of contacts being spaced by a second distance; and a second plurality of contacts disposed over a second region of a substrate, the second plurality of contacts being disposed as rows and columns on a second orthogonal grid, each row of the second plurality of contacts being spaced by a third distance, and each column of the second plurality of contacts being spaced by a fourth distance. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21)
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22. A SRAM cell comprising:
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a first access transistor and a second access transistor; a first NMOS transistor and a second NMOS transistor; and a first PMOS transistor and a second PMOS transistor, wherein a first source/drain contact of the first access transistor, a first source/drain contact of the second PMOS transistor, and a first source/drain contact of the second NMOS transistor are disposed on a first row, wherein a gate contact of the first access transistor and a gate contact common to the second NMOS and the second PMOS transistors is disposed on a second row, wherein a second source/drain contact of the first access transistor, a first source/drain contact of the first PMOS transistor, a second source/drain contact of the second PMOS transistor, the second source/drain contact of the second NMOS transistor is disposed on a third row, wherein a gate contact common for the first NMOS and the first PMOS transistors and a gate contact of the second access transistor are disposed in a fourth row, wherein a second source/drain contact of the first NMOS transistor, a second source/drain contact of the first PMOS transistor, and a second source/drain of the second access transistor are disposed on a fifth row. - View Dependent Claims (23, 24, 25, 26)
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Specification