COATING COMPOSITION, METHOD FOR MAKING THE SAME, RESIN FORMING PRODUCT, AND METHOD FOR MAKING THE RESIN FORMING PRODUCT

• US 20100189993A1
• Filed: 06/26/2006
• Published: 07/29/2010
• Est. Priority Date: 06/24/2005
• Status: Abandoned Application

• Current Assignee: Nippon Kasei Chemical Company Limited (Mitsubishi Chemical Group Corp.)
• Original Assignee: Nippon Kasei Chemical Company Limited (Mitsubishi Chemical Group Corp.)
• Inventors: Tsuruta, Yuko, Shimoyama, Masaru, Mori, Yutaka
• Application Number:
  US11/993,710
• Publication Number:
  US 20100189993A1
• Time in Patent Office: Days
• US Class Current: 428/317.500
• CPC Class Codes: C08J 2400/14 Water soluble or water swellable polymers, e.g. aqueous gels
• CPC Class Codes: C08J 7/0427 with only one layer of a composition containing a polymer binder with more layers C08J7/042
• CPC Class Codes: C08J 7/043 Improving the adhesiveness of the coatings per se, e.g. forming primers adhesives in the form of films or foils characterised by the primer layers between the polymer carriers and the adhesives C09J7/50
• CPC Class Codes: C08J 7/046 Forming abrasion-resistant coatings; Forming surface-hardening coatings
• CPC Class Codes: C08J 7/05 Forming flame retardant coatings or fire resistant coatings
• CPC Class Codes: C08J 7/054 Forming anti-misting or drip-proofing coatings
• CPC Class Codes: C08J 7/056 Forming hydrophilic coatings
• CPC Class Codes: C08K 3/34 Silicon-containing compounds
• CPC Class Codes: C08K 7/24 inorganic
• CPC Class Codes: C09D 7/61 inorganic
• CPC Class Codes: C09D 7/69 Particle size larger than 1000 nm
• CPC Class Codes: D06M 11/79 with silicon dioxide, silicic acids or their salts
• CPC Class Codes: D06M 15/263 of unsaturated carboxylic acids; Salts or esters thereof
• CPC Class Codes: Y10T 428/249984 Adhesive or bonding component contains voids

Abstract

A coating composition excellent in coating characteristics and/or appearance of the coated surface is provided. The composition can provide a resin forming product excellent in dew condensation resistance, moisture conditioning effect, anti-fouling effect, cooling effect (moisture-releasing cooling effect, moisture-releasing endothermic properties), and/or endurance.

The coating composition includes at least an inorganic porous material, a binder resin, and a solvent, wherein (1) the inorganic porous material contains at least one silicon compound; (2) the binder resin has (a) a solid hydroxyl value in the range of 5 mgKOH/g to 80 mgKOH/g and (b) a glass transition temperature (Tg) in the range of −5° C. to 40° C.; and (3) the solvent contains at least one organic solvent.

Claims

1. A coating composition comprising at least an inorganic porous material, a binder resin, and a solvent, wherein

(1) the inorganic porous material comprises at least one silicon compound;

(2) the binder resin has;

(a) a solid hydroxyl value in the range of 5 mgKOH/g to 80 mgKOH/g and

(b) a glass transition temperature (Tg) in the range of −

5°

C. to 40°

C., and

(3) the solvent comprises at least one organic solvent.

2. The coating composition according to claim 1, wherein the binder resin has an average regin diameter that is smaller than the mode particle diameter of the inorganic porous material and larger than the mode diameter of pores of the inorganic porous material.

3. The coating composition according to either claim 1 or claim 2, wherein the inorganic porous material has a mode particle diameter in the range of 1.0 μ

m to 50 μ

m.

4. A resin forming product prepared by applying the coating composition of claim 1 on a base material and removing the solvent.

8. The resin forming product according to any one of claim 4 to claim 6, further comprising an organic filler.

9. The resin forming product according to any one of claim 4 to claim 6, wherein

the inorganic porous material of the resin forming product has a silanol content in the range of 2 nm⁻

2 to 10 nm<sup>−

2</sup>.

10. The resin forming product according to any one of claim 4 to claim 6, wherein

the weight ratio of the inorganic porous material to the solid content of the binder resin is in the range of 0.6 to 10.0.

11. The resin forming product according to any one of claim 4 to claim 6, wherein

the weight ratio of the total solid content to the solid content of the binder resin is in the range of 1.6 to 11.0.

12. The resin forming product according to any one of claim 4 to claim 6, further comprising a base material, wherein

the inorganic porous material is fixed to at least part of the base material by the binder resin.

13. The resin forming product according to claim 12, wherein the base material comprises at least a sheet.

14. The resin forming product according to claim 12, wherein the base material comprises at least a film.

15. The resin forming product according to claim 12, wherein the base material comprises at least a fiber.

16. A method for making the coating composition according to claim 1 or 2, comprising at least the step of:

mixing the binder resin, the inorganic porous material, and the solvent.

17. A method for making the resin forming product according to any one of claims 4 to 6, comprising at least the steps of:

mixing the binder resin, the inorganic porous material, and the solvent; and

removing the solvent.

5. A resin forming product comprising at least an inorganic porous material and a binder resin, wherein

(1) the inorganic porous material comprises at least one silicon compound, and

(2) the binder resin has:

(a) a solid hydroxyl value in the range of 5 mgKOH/g to 80 mgKOH/g and

(b) a glass transition temperature (Tg) in the range of −

5°

C. to 40°

C.

6. A resin forming product comprising at least an inorganic porous material and a binder resin, wherein

the resin forming product has a void volume per unit area and unit thickness in the range of 0.33 ml/m²·

μ

m to 0.99 ml/m²·

μ

m.

7. The resin forming product according to claim 6, wherein

(1) the inorganic porous material comprises at least one silicon compound, and

(2) the binder resin has:

(a) a solid hydroxyl value in the range of 5 mgKOH/g to 80 mgKOH/g and

(b) a glass transition temperature (Tg) in the range of −

5°

C. to 40°

C.