INFRARED ENDPOINT DETECTION FOR PHOTORESIST STRIP PROCESSES

• US 20100190098A1
• Filed: 01/27/2009
• Published: 07/29/2010
• Est. Priority Date: 01/27/2009
• Status: Abandoned Application

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: DAVIS, MATHEW F., LU, DANNY CHIEN, WALKER, QUENTIN E.
• Application Number:
  US12/360,701
• Publication Number:
  US 20100190098A1
• Time in Patent Office: Days
• US Class Current: 430/30
• CPC Class Codes: G03F 7/427 using plasma means only
• CPC Class Codes: H01J 37/32935 Monitoring and controlling tubes by information coming from the object and/or discharge
• CPC Class Codes: H01J 37/32963 End-point detection
• CPC Class Codes: H01L 21/31138 by dry-etching

Abstract

Methods and apparatus for monitoring and detecting absorbed infrared radiation endpoint(s) are provided herein. In some embodiments, a method for determining an endpoint of a photoresist removal process may include removing a photoresist from a substrate disposed in a process chamber using reactive species provided to the process chamber from a remote plasma source. Infrared radiation is directed into the at least one of the reactive species or process byproducts while removing the photoresist. A quantity of infrared radiation absorbed by at least one of the reactive species or process byproducts during the removal process is monitored. The photoresist removal process may be ended based upon the monitored quantity reaching a predetermined level.

Claims

1. A method for determining an endpoint of a photoresist removal process, comprising:

removing a photoresist from a substrate disposed in a process chamber using reactive species provided to the process chamber from a remote plasma source;

directing infrared radiation into the at least one of the reactive species or process byproducts while removing the photoresist;

monitoring a quantity of infrared radiation absorbed by at least one of the reactive species or process byproducts during the removal process; and

ending the photoresist removal process based upon the monitored quantity reaching a predetermined level.

2. The method of claim 1, wherein the infrared radiation is generated by an infrared radiation source including a broadband or laser source.

3. The method of claim 1, further comprising:

an infrared radiation apparatus having an infrared radiation source and an infrared radiation detector coupled to a gas cell, wherein the gas cell is coupled to the process chamber and configured to receive at least one of the reactive species or process byproducts therein.

4. The method of claim 1, further comprising:

an infrared radiation apparatus having an infrared radiation source for providing infrared radiation and an infrared radiation detector for detecting a quantity of infrared radiation absorbed by the at least one of the reactive species or process byproducts.

5. The method of claim 4, wherein the infrared radiation apparatus detects a wavelength range of about 1300-4200 cm⁻

1.

6. The method of claim 4, wherein the infrared radiation apparatus further comprises two or more bandpass filters.

7. The method of claim 6, wherein the two or more filters include a first bandpass filter for a first wavelength range and a second bandpass filter for a second wavelength range.

8. The method of claim 7, wherein the first wavelength range Is between about 2000-2300 cm1, the second wavelength range Is between about 2200-2400 cm-1.

9. The method of claim 8, further comprising a third bandpass filter for a third wavelength range selected to filter out background noise.

10. The method of claim 1, wherein monitoring the quantity of infrared radiation absorbed further comprises sampling the infrared radiation absorbed at a desired frequency.

11. The method of claim 10, wherein the desired frequency is about 1 Hz.

12. The method of claim 1, wherein the infrared radiation of byproducts including at least one of CO (carbon monoxide), CO₂ (carbon dioxide), or H₂O (water) are monitored.

13. The method of claim 1, wherein the infrared radiation of reactive species including at least one of N₂ (nitrogen), O₂ (oxygen), or H₂O (water) are monitored.

14. The method of claim 1, wherein directing infrared radiation into the process chamber further comprises directing infrared radiation into a processing volume of the process chamber or directing infrared radiation into an exhaust line of the process chamber.

15. The method of claim 1, wherein the chamber pressure ranges from about 1 mTorr to about 100 Torr.

16. The method of claim 1, wherein the infrared radiation is supplied at a power of up to about 8000 Watts.

17. The method of claim 1, wherein a wavelength of infrared radiation absorbed by the byproducts is monitored between about 2000-2300 cm⁻

1.

18. The method of claim 1, wherein a wavelength of infrared radiation absorbed by the byproducts is monitored between about 2200-2400 cm⁻

1.

19. The method of claim 1, wherein a wavelength of infrared radiation absorbed by the byproducts is monitored between about 2000-2400 cm⁻

1.

20. The method of claim 1, further comprising:

altering the process photoresist removal process based upon the monitored quantity reaching a second predetermined level prior to ending the photoresist removal process.