Contact System

• US 20100190387A1
• Filed: 11/22/2007
• Published: 07/29/2010
• Est. Priority Date: 01/31/2007
• Status: Abandoned Application

• Current Assignee: Gigaset Communications GmbH (Gigaset AG)
• Original Assignee: Gigaset Communications GmbH (Gigaset AG)
• Inventors: Hünting, Ralf, Fels, Christoph, Busch, Georg
• Application Number:
  US12/525,243
• Publication Number:
  US 20100190387A1
• Time in Patent Office: Days
• US Class Current: 439/816
• CPC Class Codes: H01H 1/04 Co-operating contacts of different material
• CPC Class Codes: H01H 1/403 Contacts forming part of a printed circuit multilayer keyboard switches H01H13/702; thumbwheel switches H01H19/001; for rotary switches with axial contact pressure H01H19/585
• CPC Class Codes: H01R 12/52 connecting to other rigid printed circuits or like structures
• CPC Class Codes: H01R 12/57 surface mounting terminals
• CPC Class Codes: H01R 13/03 characterised by the material, e.g. plating, or coating materials
• CPC Class Codes: H05K 2201/035 Paste overlayer, i.e. conductive paste or solder paste over conductive layer
• CPC Class Codes: H05K 2201/10265 Metallic coils or springs, e.g. as part of a connection element
• CPC Class Codes: H05K 3/249 comprising carbon particles as main constituent
• CPC Class Codes: H05K 3/325 by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor adaptations of leads inserted in holes for press-fit connections H05K3/308

Abstract

The invention relates to a contact system comprising a spring and an accordingly associated printed circuit board surface, with which the spring is in contact. The printed circuit board surface to be contacted is a carbon printed circuit board surface. Increased contact resistance between the spring and the carbon printed circuit board surface, which is associated with the contact system according to the invention, is furthermore compensated for by electric and/or electronic means. The spring that is used is provided with a spring force adapted to the carbon printed circuit surface.

Claims

1. A contact system, having a spring which makes contact with a carbon printed-circuit board surface, characterized in that electrical and/or electronic means are connected to the contact system, by means of which a higher contact resistance, which results from the use of the carbon printed-circuit board surface for making contact with the spring, between the spring and the carbon printed-circuit board surface is compensated for, and in that the spring has an increased spring force acting on the carbon printed-circuit board surface.

2. The contact system as claimed in claim 1, characterized in that the spring is a gold spring or a gold-coated spring.