PIEZOELECTRIC DEVICES AND METHODS FOR MANUFACTURING SAME
First Claim
1. A method for manufacturing a piezoelectric device, comprising:
- preparing a lid wafer defining multiple lids;
preparing a piezoelectric wafer in which are formed multiple piezoelectric vibrating pieces each comprising first and second electrodes;
preparing a base wafer made of glass and having a first surface, the base wafer defining multiple bases each comprising first and second metal wires extending through the glass, each wire having a respective end and a respective side surface at the end that protrude at least partially from the first surface;
forming a wafer sandwich comprising the base wafer, the piezoelectric wafer superposed on and aligned with the base wafer, and the lid wafer superposed on and aligned with the piezoelectric wafer, such that respective lids, bases, and piezoelectric vibrating pieces are registered with each other, and the protruding ends of the first and second wires contact respective first and second electrodes;
anodic bonding the layers of the wafer sandwich together, the anodic bonding also bonding the protruding ends of the first and second wires to the respective first and second electrodes; and
cutting the bonded three-wafer sandwich to separate individual piezoelectric devices thus formed in the sandwich from each other.
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Abstract
Piezoelectric devices and associated fabrication methods are disclosed. An exemplary piezoelectric device includes a piezoelectric vibrating piece having first and second electrodes and first and second surfaces, a glass base having first and second surfaces, and a lid. These three parts also form the device package. The first surface of the piezoelectric vibrating piece is mounted to the base, and the lid is mounted to the second surface of the piezoelectric vibrating piece to seal the package. The glass base includes first and second metal wires having ends that protrude from the surfaces of the base. The side surfaces of the protruding wire ends are connected to the first and the second electrodes, respectively. Manufacture is performed using whole wafers that are processed, sandwiched, bonded, and then cut to produce individual devices.
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Citations
8 Claims
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1. A method for manufacturing a piezoelectric device, comprising:
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preparing a lid wafer defining multiple lids; preparing a piezoelectric wafer in which are formed multiple piezoelectric vibrating pieces each comprising first and second electrodes; preparing a base wafer made of glass and having a first surface, the base wafer defining multiple bases each comprising first and second metal wires extending through the glass, each wire having a respective end and a respective side surface at the end that protrude at least partially from the first surface; forming a wafer sandwich comprising the base wafer, the piezoelectric wafer superposed on and aligned with the base wafer, and the lid wafer superposed on and aligned with the piezoelectric wafer, such that respective lids, bases, and piezoelectric vibrating pieces are registered with each other, and the protruding ends of the first and second wires contact respective first and second electrodes; anodic bonding the layers of the wafer sandwich together, the anodic bonding also bonding the protruding ends of the first and second wires to the respective first and second electrodes; and cutting the bonded three-wafer sandwich to separate individual piezoelectric devices thus formed in the sandwich from each other. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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Specification