Multi-Electrode Assembly for an Implantable Medical Device

• US 20100192374A1
• Filed: 04/08/2010
• Published: 08/05/2010
• Est. Priority Date: 07/26/2006
• Status: Active Grant

• Current Assignee: LivaNova USA, Inc. (LivaNova Plc)
• Original Assignee: Cyberonics, Inc
• Inventors: Maschino, Steven E., Byerman, Bryan P.
• Granted Patent: US 8,483,846 B2
• Time in Patent Office: Days
• US Class Current: 29/882
• CPC Class Codes: A61N 1/0551 Spinal or peripheral nerve electrodes
• CPC Class Codes: A61N 1/0553 Paddle shaped electrodes, e.g. for laminotomy
• CPC Class Codes: Y10T 29/49218 with deforming

Abstract

A method, system, and apparatus are provided for an electrode assembly comprising a plurality of electrodes for use with an implantable medical device for conducting an electrical signal between the implantable medical device and a target tissue. The electrode assembly includes a helical member and first and second electrodes formed upon the helical member. The first and second electrodes are adapted to deliver the electrical signal. The electrode assembly also includes a first conductive element formed upon the helical member and operatively coupled to the first electrode. The electrode assembly also includes a second conductive element formed upon the helical member and operatively coupled to the second electrode.

Claims

1. A method for forming a helical electrode assembly for carrying an electrical signal associated with an implantable medical device, comprising:

forming a first layer on a generally flat substrate;

forming a first conducting structure as a second layer upon said first layer, said first conducting structure comprising a first electrode and a first conductive strip operatively coupled to said first electrode;

forming a third, non-conductive layer above said first and second layers;

forming a second conducting structure as a fourth layer upon said third layer, said second conducting structure comprising a second electrode and a second conductive strip operatively coupled to said second electrode; and

forming said generally flat substrate into a helical structure.

2. The method of claim 1, wherein forming said first and second conducting structures comprises:

performing a photolithography process to imprint said first conducting structure upon said first layer and said second conducting structure upon said third layer; and

performing an etch process to control at least one dimension relating to each of said first and second conducting structures within respective predetermined tolerances.

3. The method of claim 2, further comprising performing a chemical-mechanical polishing process.

4. The method of claim 1, further comprising forming a fifth, non-conducting layer above said third and fourth layers, and forming a third conducting structure as a sixth layer upon said fifth layer, said third conducting structure comprising a third electrode and a third conductive strip operatively coupled to said third electrode, wherein forming said fifth layer comprises performing a deposition process.

5. The method of claim 1, wherein forming said first and second conducting structures comprises:

performing a metal deposition process to deposit a conductive material for forming said first and second conducting structures; and

performing an etch process to control at least one dimension relating to each of said first and second conducting structures within predetermined tolerances.

6. The method of claim 1, wherein forming said first and second conducting structures comprises offsetting said first conducting structure from said second conducting structure such that said first and second electrodes are exposed on the surface of said electrode assembly.

7. The method of claim 1, further comprising:

forming a fifth, non-conducting layer above said third and fourth layers, and forming a third conducting structure as a sixth layer upon said fifth layer, said third conducting structure comprising a third electrode and a third conducting strip operatively coupled to said third electrode; and

forming a seventh non-conducting layer above said fifth and sixth layers, and forming a fourth conducting structure as an eighth layer upon said seventh layer, said fourth conducting structure comprising a fourth electrode and a fourth conducting strip operatively coupled to said fourth electrode.

8. The method of claim 1, further comprising:

forming a first connection pad on the surface of said electrode assembly, said first connection pad being electrically coupled to said first conductive strip; and

forming a second connection pad on the surface of said electrode assembly, said second connection pad being electrically coupled to said second conductive strip.

9. The method of claim 1, further comprising:

forming a first via to electrically couple said first conductive strip to said first electrode; and

forming a second via to electrically couple said second conductive strip to said second electrode.

10. A method for forming a helical electrode assembly for carrying a signal associated with an implantable medical device, comprising:

forming a first layer on a generally flat substrate;

forming a first conducting structure and a second conducting structure upon said first layer, said first conducting structure comprising a first electrode and a first conductive strip operatively coupled to said first electrode, and said second conducting structure comprising a second electrode and a second conducting strip operatively coupled to said second electrode;

forming a second, non-conductive layer such that said first and second conductive strips are substantially covered by said second layer and said first and second electrodes remain exposed; and

forming said generally flat substrate and first and second layers into a helical structure.