SEALING TECHNIQUE FOR DECREASING THE TIME IT TAKES TO HERMETICALLY SEAL A DEVICE AND THE RESULTING HERMETICALLY SEALED DEVICE
First Claim
1. A method for hermetically sealing a device, said method comprising the steps of:
- cooling an un-encapsulated device;
sputtering a target material consisting of SnO and BPO4 to deposit a single thin film layer of a sealing material over at least a portion of said cooled device to form an encapsulated device; and
wherein the thin film sealing material layer forms a hermetic barrier on the device.
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Abstract
A sealing method for decreasing the time it takes to hermetically seal a device and the resulting hermetically sealed device (e.g., a hermetically sealed OLED device) are described herein. The sealing method includes the steps of: (1) cooling an un-encapsulated device; (2) depositing a sealing material over at least a portion of the cooled device to form an encapsulated device; and (3) heat treating the encapsulated device to form a hermetically sealed device. In one embodiment, the sealing material is a low liquidus temperature inorganic (LLT) material such as, for example, tin-fluorophosphate glass, tungsten-doped tin fluorophosphate glass, chalcogenide glass, tellurite glass, borate glass and phosphate glass. In another embodiment, the sealing material is a Sn2+-containing inorganic oxide material such as, for example, SnO, SnO+P2O5 and SnO+BPO4.
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Citations
22 Claims
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1. A method for hermetically sealing a device, said method comprising the steps of:
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cooling an un-encapsulated device; sputtering a target material consisting of SnO and BPO4 to deposit a single thin film layer of a sealing material over at least a portion of said cooled device to form an encapsulated device; and wherein the thin film sealing material layer forms a hermetic barrier on the device. - View Dependent Claims (4, 5, 6, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 21)
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2-3. -3. (canceled)
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7. (canceled)
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20. (canceled)
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22-25. -25. (canceled)
Specification