LIGHT EMITTING SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE THEREOF

• US 20100193822A1
• Filed: 01/28/2010
• Published: 08/05/2010
• Est. Priority Date: 01/30/2009
• Status: Active Grant

• Current Assignee: Nichia Corporation
• Original Assignee: Nichia Corporation
• Inventors: Kamada, Kazuhiro, INOBE, Mototaka, Yamada, Motokazu
• Granted Patent: US 8,415,693 B2
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2933/005 relating to encapsulations
• CPC Class Codes: H01L 2933/0058 relating to optical field-shaping elements
• CPC Class Codes: H01L 2933/0066 relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 33/20 with a particular shape, e.g. curved or truncated substrate
• CPC Class Codes: H01L 33/32 containing nitrogen
• CPC Class Codes: H01L 33/52 Encapsulations
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

The light emitting device has a substrate, metallization including silver established on the surface of the substrate, a light emitting element mounted on the substrate, conducting wire that electrically connects the metallization and the light emitting element, light reflective resin provided on the substrate to reflect light from the light emitting element, and insulating material that covers at least part of the metallization surfaces. The insulating material is established to come in contact with the side of the light emitting element. This arrangement can suppress the leakage of light emitting element light from the substrate, and can achieve a light emitting device with high light extraction efficiency.

Claims

1. A light emitting device comprising:

a substrate;

metallization provided on the surface of the substrate that has metal including silver;

a light emitting element mounted on the substrate;

conducting wire that electrically connects the metallization and the light emitting element;

light reflective resin provided on the substrate to reflect light from the light emitting element; and

insulating material that covers at least part of the metallization surfaces;

wherein the insulating material is established to come in contact with the side of the light emitting element.

2. The light emitting device as cited in claim 1 wherein the substrate has cavities with bottom and side surfaces;

the cavities include a first cavity where light emitting element is mounted, and second cavities inside the first cavity having bottom surfaces positioned lower than the first cavity; and

the light reflective resin is established on metallization inside the second cavities.

3. The light emitting device as cited in claim 2 wherein the insulating material covers side-walls of the second cavities that connect with the first cavity.

4. The light emitting device as cited in claim 2 wherein the light reflective resin extends upwards from the second cavities to a position above the bottom surface of first cavity.

8. The light emitting device as cited in claim 1 wherein the insulating material is established to cover the surfaces of conducting wire continuously from the upper surface of the light emitting element.

9. The light emitting device as cited in claim 1 wherein the insulating material covers essentially the entire upper surface of the substrate.

10. The light emitting device as cited in claim 1 wherein encapsulating material is provided on the upper surface of the substrate to encapsulate the light emitting element, essentially all surfaces of the conducting wire, and at least part of the insulating material.

11. The light emitting device as cited in claim 1 wherein the insulating material has light transparency.

12. The light emitting device as cited in claim 1 wherein the insulating material is an inorganic compound.

13. The light emitting device as cited in claim 1 wherein the insulating material is SiO₂.

14. The light emitting device as cited in claim 1 wherein the light emitting element is mounted on the metallization, and the metallization functions as an electrode.

5. A light emitting device comprising:

a substrate;

metallization provided on the surface of the substrate that has metal including silver;

a light emitting element mounted on the substrate;

conducting wire that electrically connects the metallization and the light emitting element;

light reflective resin provided on the substrate to reflect light from the light emitting element; and

insulating material that covers at least part of the metallization surfaces;

wherein the insulating material is established continuously over metallization surfaces and on the upper surface of the light emitting element.

6. The light emitting device as cited in claim 5 wherein the insulating material is established intervening between the metallization and the light reflective resin, and the insulating material extends continuously over the upper surface of the light emitting element.

7. The light emitting device as cited in claim 5 wherein the insulating material is established on the surface of the light reflective resin, and the insulating material extends continuously over the upper surface of the light emitting element.

15. A method of manufacturing a light emitting device, the method comprising:

providing a substrate that has a first cavity, and second cavities inside the first cavity with bottom surfaces positioned below the first cavity;

establishing metallization on the upper surface of the substrate;

providing a light emitting element on top of the metallization, and connect the metallization and light emitting element with conducting wire;

covering continuously with insulating material the surfaces of metallization on the bottom surfaces inside the second cavities, the side-walls that join with the first cavity, the surface of metallization in the first cavity, surface of the light emitting element, and the conducting wire; and

providing light reflective resin in the second cavities to reflect light from the light emitting element.