SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE HEAT SPREADER AND DUAL ADHESIVES

• US 20100193830A1
• Filed: 04/12/2010
• Published: 08/05/2010
• Est. Priority Date: 03/25/2008
• Status: Active Grant

• Current Assignee: Bridge Semiconductor Corporation
• Original Assignee: Bridge Semiconductor Corporation
• Inventors: Lin, Charles W.C., Lim, Sangwhoo, Wang, Chia-Chung
• Granted Patent: US 9,018,667 B2
• Time in Patent Office: Days
• US Class Current: 257/99
• CPC Class Codes: H01L 21/486 Via connections through the substrate with or without pins
• CPC Class Codes: H01L 2224/32188 the layer connector connecting to a bonding area protruding from the surface of the item
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/85205 Ultrasonic bonding
• CPC Class Codes: H01L 23/3677 Wire-like or pin-like cooling fins or heat sinks
• CPC Class Codes: H01L 23/49575 Assemblies of semiconductor devices on lead frames
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01012 Magnesium [Mg]
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/01046 Palladium [Pd]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01087 Francium [Fr]
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H01L 33/483 Containers
• CPC Class Codes: H01L 33/642 : characterized by the shape
• CPC Class Codes: H05K 1/0204 : using means for thermal conduction connection in the thickness direction of the substrate H05K1/0207 takes precedence
• CPC Class Codes: H05K 2201/09054 : Raised area or protrusion of metal substrate
• CPC Class Codes: H05K 2201/10106 : Light emitting diode [LED]
• CPC Class Codes: H05K 2201/10969 : Metallic case or integral heatsink of component electrically connected to a pad on PCB
• CPC Class Codes: H05K 3/0061 : onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20
• CPC Class Codes: H05K 3/386 : by the use of an organic polymeric bonding layer, e.g. adhesive

Abstract

A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and first and second adhesives. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The heat spreader includes a post and a base. The post extends upwardly from the base through an opening in the first adhesive, and the base extends laterally from the post. The first adhesive extends between the base and the conductive trace and the second adhesive extends between the post and the conductive trace. The conductive trace provides signal routing between a pad and a terminal.

Claims

1. A semiconductor chip assembly, comprising:

a semiconductor device;

a heat spreader that includes a post and a base, wherein the post is adjacent to the base and extends above the base in an upward direction, and the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions;

a first adhesive and a second adhesive, wherein the first adhesive includes an opening, contacts the second adhesive at an adhesive interface and extends laterally from the adhesive interface in the lateral directions, and the second adhesive extends upwardly from the adhesive interface above the first adhesive in the upward direction; and

a conductive trace that includes a pad and a terminal;

wherein the semiconductor device is above and overlaps the post, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the post and thereby thermally connected to the base;

wherein the first adhesive is mounted on and extends above the base, extends between the conductive trace and the base and extends laterally from the adhesive interface to or beyond the terminal;

wherein the second adhesive extends into a gap between the post and the pad;

wherein the pad is mounted on the first adhesive and extends above the base; and

wherein the post extends through the opening, and the base extends below the semiconductor device and the pad.

2. The assembly of claim 1, wherein the semiconductor device is an LED package that includes an LED chip.

3. The assembly of claim 2, wherein the LED package is electrically connected to the pad using a first solder joint and is thermally connected to the heat spreader using a second solder joint.

4. The assembly of claim 1, wherein the semiconductor device is a semiconductor chip.

5. The assembly of claim 4, wherein the chip is electrically connected to the pad using a wire bond and is thermally connected to the heat spreader using a die attach.

6. The assembly of claim 1, wherein the first adhesive extends to peripheral edges of the assembly.

7. The assembly of claim 1, wherein the second adhesive extends to peripheral edges of the assembly.

8. The assembly of claim 1, wherein the first adhesive is an adhesive tape and the second adhesive is a solder mask.

9. The assembly of claim 1, wherein the first adhesive contacts the base outside the gap and the second adhesive contacts the post in the gap.

10. The assembly of claim 1, wherein the first adhesive conformally coats a top surface of the base outside the post and the second adhesive conformally coats sidewalls of the post.

11. The assembly of claim 1, wherein the first adhesive surrounds the post in the lateral directions, the second adhesive surrounds the post in the lateral directions and the first and second adhesives in combination cover the post in the lateral directions.

12. The assembly of claim 1, wherein the post is integral with the base.

13. The assembly of claim 1, wherein the post is coplanar with the first adhesive at the base.

14. The assembly of claim 1, wherein the post has a cut-off conical shape in which its diameter decreases as it extends upwardly from the base to its flat top.

15. The assembly of claim 1, wherein the base covers the semiconductor device, the post, the conductive trace and the adhesives in the downward direction and extends to peripheral edges of the assembly.

16. A semiconductor chip assembly, comprising:

a semiconductor device;

a heat spreader that includes a post and a base, wherein the post is adjacent to the base and extends above the base in an upward direction, and the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions;

a first adhesive and a second adhesive, wherein the first adhesive includes an opening, contacts the second adhesive at an adhesive interface and extends laterally from the adhesive interface in the lateral directions, and the second adhesive extends upwardly from the adhesive interface above the first adhesive in the upward direction;

a substrate that includes a dielectric layer, wherein an aperture extends through the substrate; and

a conductive trace that includes a pad and a terminal;

wherein the semiconductor device is above and overlaps the post, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the post and thereby thermally connected to the base;

wherein the first adhesive is mounted on and extends above the base, extends laterally from the post to or beyond the terminal and is sandwiched between the base and the substrate;

wherein the second adhesive extends into a gap in the aperture between the post and the substrate, extends laterally from the post to or beyond the terminal and is sandwiched between the post and the dielectric layer;

wherein the substrate is mounted on the first adhesive and extends above the base; and

wherein the post extends through the opening into the aperture, and the base extends below the semiconductor device, the substrate and the adhesives.

17. The assembly of claim 16, wherein the semiconductor device is an LED package that includes an LED chip, is mounted on the pad using a first solder joint and on the post using a second solder joint, is electrically connected to the pad using the first solder joint and is thermally connected to the post using the second solder joint.

18. The assembly of claim 16, wherein the semiconductor device is a semiconductor chip that is electrically connected to the pad using a wire bond and is thermally connected to the post using a die attach.

19. The assembly of claim 16, wherein the first adhesive is an adhesive tape and the second adhesive is a solder mask.

20. The assembly of claim 16, wherein the first adhesive extends in a lateral direction away from the post beyond and is overlapped by the conductive trace and the second adhesive extends in a lateral direction away from the post beyond and overlaps the conductive trace.

21. The assembly of claim 16, wherein the first adhesive contacts the base and the dielectric layer outside the gap and the second adhesive contacts the post and the dielectric layer in the gap.

22. The assembly of claim 16, wherein the first adhesive surrounds the post in the lateral directions, the second adhesive surrounds the post in the lateral directions and the first and second adhesives in combination cover the post in the lateral directions.

23. The assembly of claim 16, wherein the adhesive interface laterally surrounds the post.

24. The assembly of claim 16, wherein the adhesive interface is proximate to a corner of the heat spreader between the post and the base.

25. The assembly of claim 16, wherein the substrate contacts the adhesives, is spaced from the post and the base and is a laminated structure.

26. The assembly of claim 16, wherein the conductive trace contacts the dielectric layer and the second adhesive and is spaced from the post, the base and first adhesive, and the dielectric layer contacts the adhesives and is spaced from the post and the base.

27. The assembly of claim 16, wherein the pad is coplanar with the terminal above the dielectric layer.

28. The assembly of claim 16, wherein the post is coplanar with the first adhesive below the dielectric layer at the base.

29. The assembly of claim 16, wherein the post has a cut-off conical shape in which its diameter decreases as it extends upwardly from the base to its flat top.

30. The assembly of claim 16, wherein the base covers the semiconductor device, the post, the substrate and the adhesives in the downward direction and extends to peripheral edges of the assembly.

31. A semiconductor chip assembly, comprising:

a semiconductor device;

a heat spreader that includes a post and a base, wherein the post is adjacent to and integral with the base and extends above the base in an upward direction, and the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions;

a first adhesive and a second adhesive, wherein the first adhesive includes an opening, contacts the second adhesive at an adhesive interface and extends laterally from the adhesive interface in the lateral directions, and the second adhesive extends upwardly from the adhesive interface above the first adhesive in the upward direction; and

a substrate that includes a pad, a terminal, a routing line and a dielectric layer, wherein the pad, the terminal and the routing line contact and extend above the dielectric layer, an electrically conductive path between the pad and the terminal includes the routing line, and an aperture extends through the substrate;

wherein the semiconductor device is mounted on and overlaps the post, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the post and thereby thermally connected to the base;

wherein the first adhesive is mounted on and extends above the base, is sandwiched between the base and the substrate, surrounds the post in the lateral directions, is overlapped by the pad, the terminal and the routing line and extends to peripheral edges of the assembly;

wherein the second adhesive extends into a gap in the aperture between the post and the substrate, extends across most or all of the dielectric layer in the gap, is sandwiched between the post and the dielectric layer in the gap, surrounds the post in the lateral directions, overlaps the routing line and extends to peripheral edges of the assembly;

wherein the substrate is mounted on the first adhesive and extends above the base; and

wherein the post extends through the opening into the aperture and above the dielectric layer, and the base extends below the semiconductor device, the substrate and the adhesives, covers the post, the substrate and the adhesives in the downward direction and extends to peripheral edges of the assembly.

32. The assembly of claim 31, wherein the semiconductor device is an LED package that includes an LED chip, is mounted on the pad using a first solder joint and on the post using a second solder joint, is electrically connected to the pad using the first solder joint and is thermally connected to the post using the second solder joint.

33. The assembly of claim 31, wherein the first adhesive is an adhesive tape and the second adhesive is a solder mask.

34. The assembly of claim 31, wherein the first adhesive contacts the base and the dielectric layer outside the gap, the second adhesive contacts the post and the dielectric layer in the gap, the adhesive interface laterally surrounds the post and is proximate to a corner of the heat spreader between the post and the base and the adhesives extend to peripheral edges of the assembly.

35. The assembly of claim 31, wherein the post has a cut-off conical shape in which its diameter decreases as it extends upwardly from the base to its flat top and the post is coplanar with the first adhesive below the dielectric layer at the base.