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MULTI-CHIP SEMICONDUCTOR DEVICES HAVING CONDUCTIVE VIAS AND METHODS OF FORMING THE SAME

  • US 20100193930A1
  • Filed: 01/29/2010
  • Published: 08/05/2010
  • Est. Priority Date: 02/02/2009
  • Status: Abandoned Application
First Claim
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1. A multi-chip device comprising:

  • a signal line having via contacts;

    a plurality of chips in a stair-step arrangement formed on the signal line and having respective chip pads thereon;

    a mold packaging material encapsulating the plurality of chips; and

    at least one conductive via formed through the mold packaging material and electrically connecting one of the chip pads to one of the via contacts.

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