COMPOSITE SENSOR FOR DETECTING ANGULAR VELOCITY AND ACCELERATION

• US 20100194577A1
• Filed: 10/02/2008
• Published: 08/05/2010
• Est. Priority Date: 10/10/2007
• Status: Active Grant

• Current Assignee: Panasonic Intellectual Property Management Co., Ltd. (Panasonic Holdings Corporation)
• Original Assignee: Panasonic Corporation (Panasonic Holdings Corporation)
• Inventors: Ohkoshi, Hideo
• Granted Patent: US 9,069,000 B2
• Time in Patent Office: Days
• US Class Current: 340/669
• CPC Class Codes: G01C 19/5607 using vibrating tuning forks double-ended tuning forks using planar vibrating masses suspended at opposite ends G01C19/5719
• CPC Class Codes: G01C 21/10 by using measurements of speed or acceleration G01C21/24, G01C21/26 take precedence
• CPC Class Codes: G01P 1/02 Housings
• CPC Class Codes: G01P 1/023 for acceleration measuring devices
• CPC Class Codes: G01P 15/00 Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
• CPC Class Codes: G01P 15/18 in two or more dimensions
• CPC Class Codes: G01P 3/00 Measuring linear or angular speed; Measuring differences of linear or angular speeds G01P5/00 - G01P11/00 take precedence; direction and speed indication G01P13/045; counting mechanisms G06M
• CPC Class Codes: H01L 2224/04042 Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
• CPC Class Codes: H01L 2224/0554 External layer
• CPC Class Codes: H01L 2224/0555 Shape
• CPC Class Codes: H01L 2224/0556 Disposition
• CPC Class Codes: H01L 2224/0557 the external layer being disposed on a via connection of the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/05571 the external layer being disposed in a recess of the surface
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

A composite sensor for detecting angular velocity and acceleration includes an angular velocity detecting element, an acceleration detecting element, an angular velocity signal processing IC, an acceleration signal processing IC, and a housing. The housing is formed of a multilayered circuit board and accommodates the angular velocity detecting element, the acceleration detecting element, the angular velocity signal processing IC, and the acceleration signal processing IC. The housing connects the angular velocity detecting element electrically to the angular velocity signal processing IC, and also connects the acceleration detecting element electrically to the acceleration signal processing IC.

Claims

1. A composite sensor for detecting angular velocity and acceleration comprising:

an angular velocity detecting element capable of detecting angular velocity;

an acceleration detecting element capable of detecting acceleration;

an angular velocity signal processing IC configured to process an output signal supplied from the angular velocity detecting element;

an acceleration signal processing IC configured to process an output signal supplied from the acceleration detecting element; and

a housing accommodating the angular velocity detecting element, the acceleration detecting element, the angular velocity signal processing IC, and the acceleration signal processing IC,

wherein the housing is formed of a multilayered circuit board, and electrically connects the angular velocity detecting element to the angular velocity signal processing IC, and also electrically connects the acceleration detecting element to the acceleration signal processing IC.

2. The composite sensor for detecting angular velocity and acceleration according to claim 1,

wherein the angular velocity signal processing IC and the acceleration signal processing IC are layered together in the housing.

3. The composite sensor for detecting angular velocity and acceleration according to claim 2,

wherein the angular velocity signal processing IC and the acceleration signal processing IC are bonded together,

each of the angular velocity signal processing IC and the acceleration signal processing IC includes a non-functional section respectively on the bonded faces, and a functional section respectively on a face opposite to each one of the bonded faces, and

the respective functional section includes an external connection electrode.

4. The composite sensor for detecting angular velocity and acceleration according to claim 3,

wherein an upper IC of the layered ICs is referred to as a first IC and a lower IC of the layered ICs is referred to as a second IC,

the housing includes a mounting face on which the first IC is placed, and a first housing connection electrode formed on the mounting face,

the first IC is connected electrically to the first housing connection electrode with the external connection electrode provided on the functional section.

5. The composite sensor for detecting angular velocity and acceleration according to claim 4,

wherein the external connection electrode of the first IC is connected electrically to the first housing connection electrode with an electrode bump.

6. The composite sensor for detecting angular velocity and acceleration according to claim 3,

wherein the housing includes:

a mounting face on which the angular velocity signal processing IC and the acceleration signal processing IC are placed,

a wiring face as high as the angular velocity signal processing IC and the acceleration signal processing IC layered together on the mounting face, and

a second housing connection electrode formed on the wiring face,

a lower layered IC of the ICs bonded together is referred to as a first IC and an upper layered IC of the ICs bonded together is referred to as a second IC, and

the second IC is electrically connected to the second housing connection electrode with the external connection electrode provided on the functional section.

7. The composite sensor for detecting angular velocity and acceleration according to claim 6,

wherein the external connection electrode of the second IC is electrically connected to the second housing connection electrode with a wire.

8. The composite sensor for detecting angular velocity and acceleration according to claim 1,

wherein the housing has:

a first face accommodating the angular velocity detecting element, the acceleration detecting element, the angular velocity signal processing IC, and the acceleration signal processing IC,

a second face opposite to the first face, and

a housing power-supply electrode, a housing GND electrode, a housing angular velocity output electrode, and a housing acceleration output electrode, all on the second face,

the housing power-supply electrode is connected to the angular velocity detecting element via wiring in the housing and the angular velocity signal processing IC, and also connected to the acceleration detecting element via the acceleration signal processing IC,

the housing GND electrode and the housing angular velocity output electrode are connected to the angular velocity detecting element via wiring in the housing and the angular velocity signal processing IC, and

the housing acceleration output electrode is connected to the acceleration detecting element via wiring of the housing and the acceleration signal processing IC.