Layered Structure Connection and Assembly

• US 20100195301A1
• Filed: 06/10/2008
• Published: 08/05/2010
• Est. Priority Date: 07/09/2007
• Status: Active Grant

• Current Assignee: Power Concepts NZ Limited
• Original Assignee: Power Concepts NZ Limited
• Inventors: Fotherby, Christopher William
• Granted Patent: US 8,351,216 B2
• Time in Patent Office: Days
• US Class Current: 361/775
• CPC Class Codes: H01R 12/523 by an interconnection through aligned holes in the boards or multilayer board
• CPC Class Codes: H01R 2103/00 Two poles
• CPC Class Codes: H01R 24/50 mounted on a PCB [Printed Circuit Board]
• CPC Class Codes: H01R 4/34 Conductive members located under head of screw
• CPC Class Codes: H02M 7/003 Constructional details, e.g. physical layout, assembly, wiring or busbar connections
• CPC Class Codes: H05K 1/144 Stacked arrangements of planar printed circuit boards
• CPC Class Codes: H05K 2201/042 Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
• CPC Class Codes: H05K 2201/09809 Coaxial layout reduction of cross-talk, noise or interference by printed shielding conductors for shielding around a single via or around a group of vias H05K1/0222
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49126 Assembling bases
• CPC Class Codes: Y10T 29/49158 with molding of insulated base
• CPC Class Codes: Y10T 29/49165 by forming conductive walled aperture in base

Abstract

The present invention relates to a layered structure assembly (1) for a DC to AC inverter comprising: a first layered structure (10) with first (12) and second (13) conductive layers, a second layered structure (14) with third (16) and fourth (17) conductive layers, and at least one connector (21) providing a low resistance/inductance interconnection between layered structures (10, 14), the connecter (21) comprising a rod (23) inside a sleeve (26).

Claims

1. A layered structure assembly for a DC to AC inverter comprising:

a first layered structure with first and second conductive layers on opposing sides, one or both of the conductive layers comprising or adapted for supporting components of a circuit,

a second layered structure with third and fourth conductive layers on opposing sides, one or both of the conductive layers comprising or adapted for supporting components of a circuit,

wherein the first and second layered structures are arranged such that the second conductive layer is at least partially facing the third conductive layer,

and

at least one connector providing a connection between the first conductive layer and the fourth conductive layer, and a connection between the second conductive layer and the third conductive layer, the connector comprising;

a rod electrically connected to the first conductive layer and extending from the first layered structure to the second layered structure, the rod also being electrically connected to the fourth conductive layer, and

a sleeve mounted around the rod and extending between the first and second layered structures and being electrically connected to the second conductive layer and the third conductive layer,

wherein the rod and sleeve are separated by a minimal gap to reduce the inductance of the connection.

2. A layered structure assembly according to claim 1 comprising one or more additional layered structures, wherein for each additional layered structure the assembly comprises:

at least one connector providing a connection between conductive layers of one of the first or second layered structures and corresponding conductive layers on the additional layered structure, the connector comprising;

a rod electrically connected to an outer conductive layer of the first or second layered structure and extending from the first or second layered structure to the additional layered structure, the rod being electrically connected to the corresponding outer conductive layer of the additional layered structure, and

a sleeve mounted around the rod and extending between the first or second layered structure and the additional layered structure and electrically connected to the inner conductive layer of the first or second layered structure and the corresponding inner conductive layer of the additional layered structure,

wherein the rod and sleeve are separated by a minimal gap to reduce inductance of the connection.

3. A layered structure assembly according to claim 1 wherein one of more of the layered structures comprise more than two conductive layers supported on or in a corresponding substrate of the layered structure, corresponding conductive layers of the layered structure comprising internal connections.

4. A layered structure assembly according to claim 1 with one or more additional portions on each layered structure, each portion comprising conductive layers interconnected with connectors as defined in claim 1.

5. A layered structure assembly according to claim 3 wherein one or more of the conductive layers of a layered structure are connected to one or more other conductive layers of that layered structure wherein the internal connections are vias positioned close to a connector.

8. A layered structured assembly or a DC to AC inverter comprising a layered structured assembly according to any one of claims 1, 6 or 7 wherein one or more of the layered structures is a PCB and the remaining layered structures are laminated busbars.

9. A layered structured assembly or a DC to AC inverter comprising a layered structured assembly according to any one of claims 1, 6 or 7 wherein one or more of the layered structures is a laminated busbar and the remaining layered structures are PCBs.

6. A DC to AC inverter comprising a layered structure assembly, the assembly comprising:

a first layered structure with first and second conductive layers on opposing sides, one or both of the conductive layers comprising or adapted for supporting components of a circuit,

a second layered structure with third and fourth conductive layers on opposing sides, one or both of the conductive layers comprising or adapted for supporting components of a circuit,

wherein the first and second layered structures are arranged such that the second conductive layer is at least partially facing the third conductive layer,

and

at least one connector providing a connection between the first conductive layer and the fourth conductive layer, and a connection between the second conductive layer and the third conductive layer, the connector comprising;

a rod electrically connected to the first conductive layer and extending from the first layered structure to the second layered structure, the rod also being electrically connected to the fourth conductive layer, and

a sleeve mounted around the rod and extending between the first and second layered structures and being electrically connected to the second conductive layer and the third conductive layer,

wherein the rod and sleeve are separated by a minimal gap to reduce the inductance of the connection.

7. A layered structure assembly for a DC to AC inverter comprising:

a first layered structure with first and second conductive layers,

a second layered structure with third and fourth conductive layers, and

at least one connector providing a low resistance/inductance interconnection between layered structures, the connecter comprising a rod inside a sleeve.

10. A PCB assembly for a DC to AC inverter comprising:

a first PCB with first and second conductive layers on opposing sides, one or both of the conductive layers comprising or adapted for supporting components of a circuit,

a second PCB with third and fourth conductive layers on opposing sides, one or both of the conductive layers comprising or adapted for supporting components of a circuit,

wherein the first and second PCBs are arranged such that the second conductive layer is at least partially facing the third conductive layer,

and

at least one connector providing a connection between the first conductive layer and the fourth conductive layer, and a connection between the second conductive layer and the third conductive layer, the connector comprising;

a rod electrically connected to the first conductive layer and extending from the first PCB to the second PCB, the rod also being electrically connected to the fourth conductive layer, and

a sleeve mounted around the rod and extending between the first and second PCBs and being electrically connected to the second conductive layer and the third conductive layer,

wherein the rod and sleeve are separated by a minimal gap to reduce the inductance of the connection.

11. A laminated busbar assembly for a DC to AC inverter comprising:

a first laminated busbar with first and second conductive layers on opposing sides, one or both of the conductive layers comprising or adapted for supporting components of a circuit,

a second laminated busbar with third and fourth conductive layers on opposing sides, one or both of the conductive layers comprising or adapted for supporting components of a circuit,

wherein the first and second laminated busbar are arranged such that the second conductive layer is at least partially facing the third conductive layer,

and

at least one connector providing a connection between the first conductive layer and the fourth conductive layer, and a connection between the second conductive layer and the third conductive layer, the connector comprising;

a rod electrically connected to the first conductive layer and extending from the first laminated busbar to the second laminated busbar, the rod also being electrically connected to the fourth conductive layer, and

a sleeve mounted around the rod and extending between the first and second laminated busbars and being electrically connected to the second conductive layer and the third conductive layer,

wherein the rod and sleeve are separated by a minimal gap to reduce the inductance of the connection.