SEMICONDUCTOR LIGHT EMITTING DEVICE WITH PROTRUSIONS TO IMPROVE EXTERNAL EFFICIENCY AND CRYSTAL GROWTH
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Accused Products
Abstract
A substrate has at least one recess and/or protrusion formed in and/or on a surface thereof so as to scatter or diffract light generated in an active layer. The recess and/or protrusion is formed in such a shape that can reduce crystalline defects in semiconductor layers.
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Citations
47 Claims
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1-27. -27. (canceled)
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28. A method of manufacturing a substrate for a light emitting device that has a plurality of protrusions on a surface of the substrate, comprising:
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a first step of etching a part of the substrate with a protective film provided on the substrate and forming protrusions having side faces; and a second step of exposing and etching the side faces and at least a part of top faces of said protrusions, so as to make an inclination angle of the side faces on a lower side larger than an inclination angle of the side faces on an upper side. - View Dependent Claims (29, 30, 31, 32)
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33. A method of manufacturing a substrate for a light emitting device that has a plurality of protrusions on a surface of the substrate, comprising:
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a first step of etching a part of the substrate with a protective film provided on the substrate and forming protrusions having side faces; and a second step of exposing and etching the side faces and at least a part of top faces of said protrusions, so as to make an inclination angle of the side faces on a lower side larger than an inclination angle of the side faces on an upper side and to make an inclination angle of the side faces as a whole smaller than an inclination angle of the side faces as a whole in the first step. - View Dependent Claims (34, 35, 36, 37, 38, 39)
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40. A method of manufacturing a substrate for a light emitting device that has a plurality of protrusions on a surface of the substrate where semiconductor layers of the light emitting device is formed, comprising:
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a first step of etching a part of the substrate with a protective film provided on the substrate and forming protrusions having side faces that has an inclination angle θ
m1 as a whole; anda second step of exposing and etching the side faces and at least a part of top faces of said protrusions, so as to make an inclination angle θ
m2 of the side faces as a whole smaller than the inclination angle θ
m1. - View Dependent Claims (41, 42, 43, 44, 45, 46, 47)
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Specification