KEY MODULE

• US 20100200381A1
• Filed: 02/10/2009
• Published: 08/12/2010
• Est. Priority Date: 02/10/2009
• Status: Abandoned Application

• Current Assignee: Lite-On Technology Corporation, Silitek Electronic Company Limited (Lite-On Technology Corporation)
• Original Assignee: Lite-On Technology Corporation, Silitek Electronic Company Limited (Lite-On Technology Corporation)
• Inventors: Kuo, Shih-Yuan
• Application Number:
  US12/368,307
• Publication Number:
  US 20100200381A1
• Time in Patent Office: Days
• US Class Current: 200/314
• CPC Class Codes: H01H 13/83 characterised by legends, e.g. Braille, liquid crystal displays, light emitting or optical elements
• CPC Class Codes: H01H 2209/074 elastomeric
• CPC Class Codes: H01H 2219/062 Light conductor

Abstract

A key module includes a circuit board, at least a key, at least a light emitting unit and a light guide film. The key is disposed on the circuit board. The light emitting unit is coupled to the circuit board for providing a light source. The light guide film is disposed between the circuit board and the key for guiding the light source provided by the light emitting unit to the key. In addition, the material of the light guide film is a flexible light guide material.

Claims

1. A key module, comprising:

a circuit board;

at least a key, disposed on the circuit board;

at least a light emitting unit, coupled to the circuit board, for providing a light source; and

a light guide film, disposed between the circuit board and the key for guiding the light source provided by the light emitting unit to the key;

wherein a material of the light guide film is a flexible light guide material.

2. The key module of claim 1, wherein the material of the light guide film is a silicone compound.

3. The key module of claim 1, wherein at least an elastic structure is disposed on a surface of the circuit board for providing a key pressure, and a surface of the elastic structure is covered by the light guide film.

4. The key module of claim 1, wherein the light guide film is formed by liquid injection molding, coating or compound molding.

5. The key module of claim 1, wherein a hardness of the light guide film is greater than 45 (in Shore hardness).

6. The key module of claim 1, wherein the hardness of the light guide film ranges between 50 and 75 (in Shore hardness).

7. The key module of claim 1, wherein a tensile strength of the light guide film is greater than 5.5*10⁶ Pa.

8. The key module of claim 1, wherein the tensile strength of the light guide film ranges between 6*10⁶ and 8*10⁶ Pa.