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Method for reclaiming a surface of a substrate

  • US 20100200854A1
  • Filed: 02/12/2010
  • Published: 08/12/2010
  • Est. Priority Date: 02/12/2009
  • Status: Active Grant
First Claim
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1. A method for reclaiming a surface of a substrate, wherein a surface comprises a protruding residual topography resulting from a layer transfer process, wherein the substrate comprises at least a layer of a first material, the method comprising the steps of:

  • a) providing a silicon filling material in the non-protruding areas of the surface of the substrate, andb) polishing the surface,wherein the filling material and at least a part of the protruding residual topography are polished simultaneously during polishing step b).

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