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METHODS FOR FORMING LAYERS WITHIN A MEMS DEVICE USING LIFTOFF PROCESSES

  • US 20100200938A1
  • Filed: 02/08/2010
  • Published: 08/12/2010
  • Est. Priority Date: 08/19/2005
  • Status: Active Grant
First Claim
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1. A method of fabricating a MEMS device, comprising:

  • forming an electrode layer over a substrate;

    forming a sacrificial layer over the electrode layer;

    patterning the sacrificial layer to form at least one tapered aperture extending through the sacrificial layer;

    forming a movable layer over the patterned sacrificial layer;

    forming a mask layer over at least a portion of the movable layer, the mask layer comprising an aperture overlying the tapered aperture extending through the sacrificial layer;

    depositing a support layer over the mask layer; and

    removing the mask layer via a liftoff process, thereby forming a support structure overlying at least a portion of the movable layer and located at least partially within the tapered aperture extending through the sacrificial layer

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