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Dopant Enhanced Interconnect

  • US 20100200991A1
  • Filed: 02/12/2010
  • Published: 08/12/2010
  • Est. Priority Date: 03/15/2007
  • Status: Abandoned Application
First Claim
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1. An interconnect device, comprising:

  • a liner deposited over a trench and/or via structure formed in a dielectric material; and

    an interconnect, formed on the liner, the interconnect comprising a dopant that does not alloy or react with the liner, wherein the dopant is present at a top surface of the interconnect.

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