ANTENNA-MODULE HYBRID CIRCUIT

• US 20100201580A1
• Filed: 02/09/2010
• Published: 08/12/2010
• Est. Priority Date: 02/12/2009
• Status: Active Grant

• Current Assignee: Origin GPS Ltd.
• Original Assignee: Origin GPS Ltd.
• Inventors: GOLDBERGER, Haim
• Granted Patent: US 8,878,727 B2
• Time in Patent Office: Days
• US Class Current: 343/700.MS
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01Q 1/2283 mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H01Q 23/00 Antennas with active circuits or circuit elements integrated within them or attached to them
• CPC Class Codes: H01Q 9/0407 Substantially flat resonant element parallel to ground plane, e.g. patch antenna dipole H01Q9/285; monopole H01Q9/40

Abstract

A hybrid circuit with an integral antenna module, including an electronic circuit that includes circuit elements; and an antenna module including a dielectric material shaped to form a void enclosed by the dielectric material, a conducting patch on one side of the dielectric material. Wherein the circuit elements are enclosed by the dielectric material, so that the elements of the circuit are positioned inside the void formed by the dielectric material.

Claims

1. A hybrid circuit with an integral antenna module, comprising:

an electronic circuit comprising circuit elements; and

an antenna module comprising;

a dielectric material shaped to form a void enclosed by the dielectric material;

a conducting patch on one side of the dielectric material;

wherein said circuit elements are enclosed by said dielectric material, so that the elements of the circuit are positioned inside the void formed by said dielectric material.

2. A hybrid circuit according to claim 1, further comprising a ground patch on the other side of the dielectric material facing the void.

3. A hybrid circuit according to claim 1, further comprising a substrate serving as a cover to the void formed by the dielectric material and wherein the circuit elements are embedded in the substrate with the elements extending into the void.

4. A hybrid circuit according to claim 1, wherein circuit elements are embedded on an interconnect layer adjacent to the ground patch with the elements extending into the void.

5. A hybrid circuit according to claim 4. wherein said interconnect layer serves as the ground of the antenna.

6. A hybrid circuit according to claim 4, wherein said interconnect layer is coupled to the ground of the antenna.

7. A hybrid circuit according to claim 1, wherein said antenna is adapted to serve as a GPS antenna or a mobile telephone antenna.

8. A hybrid circuit according to claim 1. wherein the void is filled with a filling material surrounding the circuit elements.

9. A hybrid circuit according to claim 8, wherein the filling material is cured to form a solid hybrid circuit.

10. A hybrid circuit according to claim 1 wherein the width and length of the hybrid circuit are each at least twice the size of the thickness of the hybrid circuit.

11. A hybrid circuit according to claim 1, wherein the conducting patch and the ground patch have the same size and shape.

12. A hybrid circuit according to claim 1, wherein the conducting patch and the ground patch differ in size.

13. A hybrid circuit according to claim 1, wherein the conducting patch and the ground patch differ in shape.

14. A hybrid circuit according to claim 1, wherein said electronic circuit is connected to said conducting plate through said dielectric material.

15. A hybrid circuit according to claim 1, wherein said electronic circuit is connected to said conducting plate with a connection that goes around said dielectric material.